Report Detail
Global Wafer Slicing Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
- RnM4617061 |
- 26 September, 2024 |
- Global |
- 101 Pages |
- GIR (Global Info Research) |
- Electronics & Semiconductor
Wafer Slicing Equipment(that is, the Wafer scribing machine) is mainly used for packaging, is the Wafer that contain a lot of chip (Wafer) into one device, a chip particles current industry are mainly composed of mechanical blade, including the main shaft, control system, etc., due to cutting matrix for semiconductor devices, so the product yield and higher control requirements.
According to our (Global Info Research) latest study, the global Wafer Slicing Equipment market size was valued at US$ 943 million in 2023 and is forecast to a readjusted size of USD 1278 million by 2030 with a CAGR of 4.5% during review period.
Global key wafer slicing equipment manufacturers include DISCO, Tokyo Seimitsu etc.The top 1 company hold a share about 60%.Chinese Mainland is the largest market, with a share about 40%, followed by Taiwan, China and South Korea with the share about 27% and 10%.
This report is a detailed and comprehensive analysis for global Wafer Slicing Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.
Key Features:
Global Wafer Slicing Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030
Global Wafer Slicing Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030
Global Wafer Slicing Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030
Global Wafer Slicing Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2019-2024
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Slicing Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Slicing Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO, Tokyo Seimitsu, GL Tech Co Ltd, ASM, Synova, CETC Electronics Equipment Group Co., Ltd., Shenyang Heyan Technology Co., Ltd., Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd., Hi-TESI, Tensun, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Slicing Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Blade Cutting Machine
Laser Cutting Machine
Market segment by Application
Pure Foundry
IDM
OSAT
LED
Photovoltaic
Major players covered
DISCO
Tokyo Seimitsu
GL Tech Co Ltd
ASM
Synova
CETC Electronics Equipment Group Co., Ltd.
Shenyang Heyan Technology Co., Ltd.
Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
Hi-TESI
Tensun
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Slicing Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Slicing Equipment, with price, sales quantity, revenue, and global market share of Wafer Slicing Equipment from 2019 to 2024.
Chapter 3, the Wafer Slicing Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Slicing Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Wafer Slicing Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Slicing Equipment.
Chapter 14 and 15, to describe Wafer Slicing Equipment sales channel, distributors, customers, research findings and conclusion.
1 Market Overview
- 1.1 Product Overview and Scope
- 1.2 Market Estimation Caveats and Base Year
- 1.3 Market Analysis by Type
- 1.3.1 Overview: Global Wafer Slicing Equipment Consumption Value by Type: 2019 Versus 2023 Versus 2030
- 1.3.2 Blade Cutting Machine
- 1.3.3 Laser Cutting Machine
- 1.4 Market Analysis by Application
- 1.4.1 Overview: Global Wafer Slicing Equipment Consumption Value by Application: 2019 Versus 2023 Versus 2030
- 1.4.2 Pure Foundry
- 1.4.3 IDM
- 1.4.4 OSAT
- 1.4.5 LED
- 1.4.6 Photovoltaic
- 1.5 Global Wafer Slicing Equipment Market Size & Forecast
- 1.5.1 Global Wafer Slicing Equipment Consumption Value (2019 & 2023 & 2030)
- 1.5.2 Global Wafer Slicing Equipment Sales Quantity (2019-2030)
- 1.5.3 Global Wafer Slicing Equipment Average Price (2019-2030)
2 Manufacturers Profiles
- 2.1 DISCO
- 2.1.1 DISCO Details
- 2.1.2 DISCO Major Business
- 2.1.3 DISCO Wafer Slicing Equipment Product and Services
- 2.1.4 DISCO Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.1.5 DISCO Recent Developments/Updates
- 2.2 Tokyo Seimitsu
- 2.2.1 Tokyo Seimitsu Details
- 2.2.2 Tokyo Seimitsu Major Business
- 2.2.3 Tokyo Seimitsu Wafer Slicing Equipment Product and Services
- 2.2.4 Tokyo Seimitsu Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.2.5 Tokyo Seimitsu Recent Developments/Updates
- 2.3 GL Tech Co Ltd
- 2.3.1 GL Tech Co Ltd Details
- 2.3.2 GL Tech Co Ltd Major Business
- 2.3.3 GL Tech Co Ltd Wafer Slicing Equipment Product and Services
- 2.3.4 GL Tech Co Ltd Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.3.5 GL Tech Co Ltd Recent Developments/Updates
- 2.4 ASM
- 2.4.1 ASM Details
- 2.4.2 ASM Major Business
- 2.4.3 ASM Wafer Slicing Equipment Product and Services
- 2.4.4 ASM Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.4.5 ASM Recent Developments/Updates
- 2.5 Synova
- 2.5.1 Synova Details
- 2.5.2 Synova Major Business
- 2.5.3 Synova Wafer Slicing Equipment Product and Services
- 2.5.4 Synova Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.5.5 Synova Recent Developments/Updates
- 2.6 CETC Electronics Equipment Group Co., Ltd.
- 2.6.1 CETC Electronics Equipment Group Co., Ltd. Details
- 2.6.2 CETC Electronics Equipment Group Co., Ltd. Major Business
- 2.6.3 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Product and Services
- 2.6.4 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.6.5 CETC Electronics Equipment Group Co., Ltd. Recent Developments/Updates
- 2.7 Shenyang Heyan Technology Co., Ltd.
- 2.7.1 Shenyang Heyan Technology Co., Ltd. Details
- 2.7.2 Shenyang Heyan Technology Co., Ltd. Major Business
- 2.7.3 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Product and Services
- 2.7.4 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.7.5 Shenyang Heyan Technology Co., Ltd. Recent Developments/Updates
- 2.8 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
- 2.8.1 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Details
- 2.8.2 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Major Business
- 2.8.3 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Product and Services
- 2.8.4 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.8.5 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Recent Developments/Updates
- 2.9 Hi-TESI
- 2.9.1 Hi-TESI Details
- 2.9.2 Hi-TESI Major Business
- 2.9.3 Hi-TESI Wafer Slicing Equipment Product and Services
- 2.9.4 Hi-TESI Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.9.5 Hi-TESI Recent Developments/Updates
- 2.10 Tensun
- 2.10.1 Tensun Details
- 2.10.2 Tensun Major Business
- 2.10.3 Tensun Wafer Slicing Equipment Product and Services
- 2.10.4 Tensun Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.10.5 Tensun Recent Developments/Updates
3 Competitive Environment: Wafer Slicing Equipment by Manufacturer
- 3.1 Global Wafer Slicing Equipment Sales Quantity by Manufacturer (2019-2024)
- 3.2 Global Wafer Slicing Equipment Revenue by Manufacturer (2019-2024)
- 3.3 Global Wafer Slicing Equipment Average Price by Manufacturer (2019-2024)
- 3.4 Market Share Analysis (2023)
- 3.4.1 Producer Shipments of Wafer Slicing Equipment by Manufacturer Revenue ($MM) and Market Share (%): 2023
- 3.4.2 Top 3 Wafer Slicing Equipment Manufacturer Market Share in 2023
- 3.4.3 Top 6 Wafer Slicing Equipment Manufacturer Market Share in 2023
- 3.5 Wafer Slicing Equipment Market: Overall Company Footprint Analysis
- 3.5.1 Wafer Slicing Equipment Market: Region Footprint
- 3.5.2 Wafer Slicing Equipment Market: Company Product Type Footprint
- 3.5.3 Wafer Slicing Equipment Market: Company Product Application Footprint
- 3.6 New Market Entrants and Barriers to Market Entry
- 3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
- 4.1 Global Wafer Slicing Equipment Market Size by Region
- 4.1.1 Global Wafer Slicing Equipment Sales Quantity by Region (2019-2030)
- 4.1.2 Global Wafer Slicing Equipment Consumption Value by Region (2019-2030)
- 4.1.3 Global Wafer Slicing Equipment Average Price by Region (2019-2030)
- 4.2 North America Wafer Slicing Equipment Consumption Value (2019-2030)
- 4.3 Europe Wafer Slicing Equipment Consumption Value (2019-2030)
- 4.4 Asia-Pacific Wafer Slicing Equipment Consumption Value (2019-2030)
- 4.5 South America Wafer Slicing Equipment Consumption Value (2019-2030)
- 4.6 Middle East & Africa Wafer Slicing Equipment Consumption Value (2019-2030)
5 Market Segment by Type
- 5.1 Global Wafer Slicing Equipment Sales Quantity by Type (2019-2030)
- 5.2 Global Wafer Slicing Equipment Consumption Value by Type (2019-2030)
- 5.3 Global Wafer Slicing Equipment Average Price by Type (2019-2030)
6 Market Segment by Application
- 6.1 Global Wafer Slicing Equipment Sales Quantity by Application (2019-2030)
- 6.2 Global Wafer Slicing Equipment Consumption Value by Application (2019-2030)
- 6.3 Global Wafer Slicing Equipment Average Price by Application (2019-2030)
7 North America
- 7.1 North America Wafer Slicing Equipment Sales Quantity by Type (2019-2030)
- 7.2 North America Wafer Slicing Equipment Sales Quantity by Application (2019-2030)
- 7.3 North America Wafer Slicing Equipment Market Size by Country
- 7.3.1 North America Wafer Slicing Equipment Sales Quantity by Country (2019-2030)
- 7.3.2 North America Wafer Slicing Equipment Consumption Value by Country (2019-2030)
- 7.3.3 United States Market Size and Forecast (2019-2030)
- 7.3.4 Canada Market Size and Forecast (2019-2030)
- 7.3.5 Mexico Market Size and Forecast (2019-2030)
8 Europe
- 8.1 Europe Wafer Slicing Equipment Sales Quantity by Type (2019-2030)
- 8.2 Europe Wafer Slicing Equipment Sales Quantity by Application (2019-2030)
- 8.3 Europe Wafer Slicing Equipment Market Size by Country
- 8.3.1 Europe Wafer Slicing Equipment Sales Quantity by Country (2019-2030)
- 8.3.2 Europe Wafer Slicing Equipment Consumption Value by Country (2019-2030)
- 8.3.3 Germany Market Size and Forecast (2019-2030)
- 8.3.4 France Market Size and Forecast (2019-2030)
- 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
- 8.3.6 Russia Market Size and Forecast (2019-2030)
- 8.3.7 Italy Market Size and Forecast (2019-2030)
9 Asia-Pacific
- 9.1 Asia-Pacific Wafer Slicing Equipment Sales Quantity by Type (2019-2030)
- 9.2 Asia-Pacific Wafer Slicing Equipment Sales Quantity by Application (2019-2030)
- 9.3 Asia-Pacific Wafer Slicing Equipment Market Size by Region
- 9.3.1 Asia-Pacific Wafer Slicing Equipment Sales Quantity by Region (2019-2030)
- 9.3.2 Asia-Pacific Wafer Slicing Equipment Consumption Value by Region (2019-2030)
- 9.3.3 China Market Size and Forecast (2019-2030)
- 9.3.4 Japan Market Size and Forecast (2019-2030)
- 9.3.5 South Korea Market Size and Forecast (2019-2030)
- 9.3.6 India Market Size and Forecast (2019-2030)
- 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
- 9.3.8 Australia Market Size and Forecast (2019-2030)
10 South America
- 10.1 South America Wafer Slicing Equipment Sales Quantity by Type (2019-2030)
- 10.2 South America Wafer Slicing Equipment Sales Quantity by Application (2019-2030)
- 10.3 South America Wafer Slicing Equipment Market Size by Country
- 10.3.1 South America Wafer Slicing Equipment Sales Quantity by Country (2019-2030)
- 10.3.2 South America Wafer Slicing Equipment Consumption Value by Country (2019-2030)
- 10.3.3 Brazil Market Size and Forecast (2019-2030)
- 10.3.4 Argentina Market Size and Forecast (2019-2030)
11 Middle East & Africa
- 11.1 Middle East & Africa Wafer Slicing Equipment Sales Quantity by Type (2019-2030)
- 11.2 Middle East & Africa Wafer Slicing Equipment Sales Quantity by Application (2019-2030)
- 11.3 Middle East & Africa Wafer Slicing Equipment Market Size by Country
- 11.3.1 Middle East & Africa Wafer Slicing Equipment Sales Quantity by Country (2019-2030)
- 11.3.2 Middle East & Africa Wafer Slicing Equipment Consumption Value by Country (2019-2030)
- 11.3.3 Turkey Market Size and Forecast (2019-2030)
- 11.3.4 Egypt Market Size and Forecast (2019-2030)
- 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
- 11.3.6 South Africa Market Size and Forecast (2019-2030)
12 Market Dynamics
- 12.1 Wafer Slicing Equipment Market Drivers
- 12.2 Wafer Slicing Equipment Market Restraints
- 12.3 Wafer Slicing Equipment Trends Analysis
- 12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry
13 Raw Material and Industry Chain
- 13.1 Raw Material of Wafer Slicing Equipment and Key Manufacturers
- 13.2 Manufacturing Costs Percentage of Wafer Slicing Equipment
- 13.3 Wafer Slicing Equipment Production Process
- 13.4 Industry Value Chain Analysis
14 Shipments by Distribution Channel
- 14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
- 14.2 Wafer Slicing Equipment Typical Distributors
- 14.3 Wafer Slicing Equipment Typical Customers
15 Research Findings and Conclusion
16 Appendix
- 16.1 Methodology
- 16.2 Research Process and Data Source
Summary:
Get latest Market Research Reports on Wafer Slicing Equipment. Industry analysis & Market Report on Wafer Slicing Equipment is a syndicated market report, published as Global Wafer Slicing Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030. It is complete Research Study and Industry Analysis of Wafer Slicing Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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