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Electronics & Semiconductor Global Wafer Bonding Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

  • RnM4529999
    • |
  • 26 September, 2024
    • |
  • Global
    • |
  • 120 Pages
    • |
  • GIR (Global Info Research)
    • |
  • Electronics & Semiconductor

Wafer bonding equipment refers to the tools and machinery used in the process of wafer bonding in semiconductor manufacturing. Wafer bonding is a key step in the fabrication of advanced semiconductor devices and microelectromechanical systems (MEMS). This process involves joining two semiconductor wafers or substrates to create a single, integrated structure.
The wafer bonding equipment facilitates the precise alignment, cleaning, and bonding of two separate wafers or substrates.
Wafer bonding equipment typically includes precision alignment tools, bonding chambers, and heating elements to facilitate the bonding process. The equipment needs to maintain high levels of cleanliness and control over environmental conditions to ensure successful and reliable bonding. The choice of bonding technique and equipment depends on the specific requirements of the semiconductor or MEMS application.
Wafer bonding is crucial for creating complex structures, improving device performance, and integrating different materials on a single chip. It is widely used in the production of advanced semiconductor devices, sensors, and other micro-scale components.
According to our (Global Info Research) latest study, the global Wafer Bonding Equipment market size was valued at US$ 270 million in 2023 and is forecast to a readjusted size of USD 498 million by 2030 with a CAGR of 7.3% during review period.
The core manufacturers of global Wafer Bonding Equipment include EV Group, SUSS MicroTec and Tokyo Electron. The top three companies hold about 76 percent of the market. Asia Pacific is the world's largest Wafer Bonding Equipment market with a market share of about 58%, followed by Europe and North America with a market share of 23% and 14%, respectively. In terms of product type, Fully Automatic is the largest segment with approximately 81% market share. In terms of application, MEMS is the largest downstream segment, accounting for about 34% of the market.
This report is a detailed and comprehensive analysis for global Wafer Bonding Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.
Key Features:
Global Wafer Bonding Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2019-2030
Global Wafer Bonding Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2019-2030
Global Wafer Bonding Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2019-2030
Global Wafer Bonding Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2019-2024
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Bonding Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Bonding Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machinetool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech, Hutem, Canon, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Bonding Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fully Automatic
Semi Automatic
Market segment by Application
MEMS
Advanced Packaging
CIS
Others
Major players covered
EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machinetool
Ayumi Industry
Shanghai Micro Electronics
U-Precision Tech
Hutem
Canon
Bondtech
TAZMO
Aimechatec
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Bonding Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Bonding Equipment, with price, sales quantity, revenue, and global market share of Wafer Bonding Equipment from 2019 to 2024.
Chapter 3, the Wafer Bonding Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Bonding Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Wafer Bonding Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Bonding Equipment.
Chapter 14 and 15, to describe Wafer Bonding Equipment sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Wafer Bonding Equipment Consumption Value by Type: 2019 Versus 2023 Versus 2030
    • 1.3.2 Fully Automatic
    • 1.3.3 Semi Automatic
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Wafer Bonding Equipment Consumption Value by Application: 2019 Versus 2023 Versus 2030
    • 1.4.2 MEMS
    • 1.4.3 Advanced Packaging
    • 1.4.4 CIS
    • 1.4.5 Others
  • 1.5 Global Wafer Bonding Equipment Market Size & Forecast
    • 1.5.1 Global Wafer Bonding Equipment Consumption Value (2019 & 2023 & 2030)
    • 1.5.2 Global Wafer Bonding Equipment Sales Quantity (2019-2030)
    • 1.5.3 Global Wafer Bonding Equipment Average Price (2019-2030)

2 Manufacturers Profiles

  • 2.1 EV Group
    • 2.1.1 EV Group Details
    • 2.1.2 EV Group Major Business
    • 2.1.3 EV Group Wafer Bonding Equipment Product and Services
    • 2.1.4 EV Group Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.1.5 EV Group Recent Developments/Updates
  • 2.2 SUSS MicroTec
    • 2.2.1 SUSS MicroTec Details
    • 2.2.2 SUSS MicroTec Major Business
    • 2.2.3 SUSS MicroTec Wafer Bonding Equipment Product and Services
    • 2.2.4 SUSS MicroTec Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.2.5 SUSS MicroTec Recent Developments/Updates
  • 2.3 Tokyo Electron
    • 2.3.1 Tokyo Electron Details
    • 2.3.2 Tokyo Electron Major Business
    • 2.3.3 Tokyo Electron Wafer Bonding Equipment Product and Services
    • 2.3.4 Tokyo Electron Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.3.5 Tokyo Electron Recent Developments/Updates
  • 2.4 Applied Microengineering
    • 2.4.1 Applied Microengineering Details
    • 2.4.2 Applied Microengineering Major Business
    • 2.4.3 Applied Microengineering Wafer Bonding Equipment Product and Services
    • 2.4.4 Applied Microengineering Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.4.5 Applied Microengineering Recent Developments/Updates
  • 2.5 Nidec Machinetool
    • 2.5.1 Nidec Machinetool Details
    • 2.5.2 Nidec Machinetool Major Business
    • 2.5.3 Nidec Machinetool Wafer Bonding Equipment Product and Services
    • 2.5.4 Nidec Machinetool Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.5.5 Nidec Machinetool Recent Developments/Updates
  • 2.6 Ayumi Industry
    • 2.6.1 Ayumi Industry Details
    • 2.6.2 Ayumi Industry Major Business
    • 2.6.3 Ayumi Industry Wafer Bonding Equipment Product and Services
    • 2.6.4 Ayumi Industry Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.6.5 Ayumi Industry Recent Developments/Updates
  • 2.7 Shanghai Micro Electronics
    • 2.7.1 Shanghai Micro Electronics Details
    • 2.7.2 Shanghai Micro Electronics Major Business
    • 2.7.3 Shanghai Micro Electronics Wafer Bonding Equipment Product and Services
    • 2.7.4 Shanghai Micro Electronics Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.7.5 Shanghai Micro Electronics Recent Developments/Updates
  • 2.8 U-Precision Tech
    • 2.8.1 U-Precision Tech Details
    • 2.8.2 U-Precision Tech Major Business
    • 2.8.3 U-Precision Tech Wafer Bonding Equipment Product and Services
    • 2.8.4 U-Precision Tech Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.8.5 U-Precision Tech Recent Developments/Updates
  • 2.9 Hutem
    • 2.9.1 Hutem Details
    • 2.9.2 Hutem Major Business
    • 2.9.3 Hutem Wafer Bonding Equipment Product and Services
    • 2.9.4 Hutem Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.9.5 Hutem Recent Developments/Updates
  • 2.10 Canon
    • 2.10.1 Canon Details
    • 2.10.2 Canon Major Business
    • 2.10.3 Canon Wafer Bonding Equipment Product and Services
    • 2.10.4 Canon Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.10.5 Canon Recent Developments/Updates
  • 2.11 Bondtech
    • 2.11.1 Bondtech Details
    • 2.11.2 Bondtech Major Business
    • 2.11.3 Bondtech Wafer Bonding Equipment Product and Services
    • 2.11.4 Bondtech Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.11.5 Bondtech Recent Developments/Updates
  • 2.12 TAZMO
    • 2.12.1 TAZMO Details
    • 2.12.2 TAZMO Major Business
    • 2.12.3 TAZMO Wafer Bonding Equipment Product and Services
    • 2.12.4 TAZMO Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.12.5 TAZMO Recent Developments/Updates
  • 2.13 Aimechatec
    • 2.13.1 Aimechatec Details
    • 2.13.2 Aimechatec Major Business
    • 2.13.3 Aimechatec Wafer Bonding Equipment Product and Services
    • 2.13.4 Aimechatec Wafer Bonding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.13.5 Aimechatec Recent Developments/Updates

3 Competitive Environment: Wafer Bonding Equipment by Manufacturer

  • 3.1 Global Wafer Bonding Equipment Sales Quantity by Manufacturer (2019-2024)
  • 3.2 Global Wafer Bonding Equipment Revenue by Manufacturer (2019-2024)
  • 3.3 Global Wafer Bonding Equipment Average Price by Manufacturer (2019-2024)
  • 3.4 Market Share Analysis (2023)
    • 3.4.1 Producer Shipments of Wafer Bonding Equipment by Manufacturer Revenue ($MM) and Market Share (%): 2023
    • 3.4.2 Top 3 Wafer Bonding Equipment Manufacturer Market Share in 2023
    • 3.4.3 Top 6 Wafer Bonding Equipment Manufacturer Market Share in 2023
  • 3.5 Wafer Bonding Equipment Market: Overall Company Footprint Analysis
    • 3.5.1 Wafer Bonding Equipment Market: Region Footprint
    • 3.5.2 Wafer Bonding Equipment Market: Company Product Type Footprint
    • 3.5.3 Wafer Bonding Equipment Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Wafer Bonding Equipment Market Size by Region
    • 4.1.1 Global Wafer Bonding Equipment Sales Quantity by Region (2019-2030)
    • 4.1.2 Global Wafer Bonding Equipment Consumption Value by Region (2019-2030)
    • 4.1.3 Global Wafer Bonding Equipment Average Price by Region (2019-2030)
  • 4.2 North America Wafer Bonding Equipment Consumption Value (2019-2030)
  • 4.3 Europe Wafer Bonding Equipment Consumption Value (2019-2030)
  • 4.4 Asia-Pacific Wafer Bonding Equipment Consumption Value (2019-2030)
  • 4.5 South America Wafer Bonding Equipment Consumption Value (2019-2030)
  • 4.6 Middle East & Africa Wafer Bonding Equipment Consumption Value (2019-2030)

5 Market Segment by Type

  • 5.1 Global Wafer Bonding Equipment Sales Quantity by Type (2019-2030)
  • 5.2 Global Wafer Bonding Equipment Consumption Value by Type (2019-2030)
  • 5.3 Global Wafer Bonding Equipment Average Price by Type (2019-2030)

6 Market Segment by Application

  • 6.1 Global Wafer Bonding Equipment Sales Quantity by Application (2019-2030)
  • 6.2 Global Wafer Bonding Equipment Consumption Value by Application (2019-2030)
  • 6.3 Global Wafer Bonding Equipment Average Price by Application (2019-2030)

7 North America

  • 7.1 North America Wafer Bonding Equipment Sales Quantity by Type (2019-2030)
  • 7.2 North America Wafer Bonding Equipment Sales Quantity by Application (2019-2030)
  • 7.3 North America Wafer Bonding Equipment Market Size by Country
    • 7.3.1 North America Wafer Bonding Equipment Sales Quantity by Country (2019-2030)
    • 7.3.2 North America Wafer Bonding Equipment Consumption Value by Country (2019-2030)
    • 7.3.3 United States Market Size and Forecast (2019-2030)
    • 7.3.4 Canada Market Size and Forecast (2019-2030)
    • 7.3.5 Mexico Market Size and Forecast (2019-2030)

8 Europe

  • 8.1 Europe Wafer Bonding Equipment Sales Quantity by Type (2019-2030)
  • 8.2 Europe Wafer Bonding Equipment Sales Quantity by Application (2019-2030)
  • 8.3 Europe Wafer Bonding Equipment Market Size by Country
    • 8.3.1 Europe Wafer Bonding Equipment Sales Quantity by Country (2019-2030)
    • 8.3.2 Europe Wafer Bonding Equipment Consumption Value by Country (2019-2030)
    • 8.3.3 Germany Market Size and Forecast (2019-2030)
    • 8.3.4 France Market Size and Forecast (2019-2030)
    • 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
    • 8.3.6 Russia Market Size and Forecast (2019-2030)
    • 8.3.7 Italy Market Size and Forecast (2019-2030)

9 Asia-Pacific

  • 9.1 Asia-Pacific Wafer Bonding Equipment Sales Quantity by Type (2019-2030)
  • 9.2 Asia-Pacific Wafer Bonding Equipment Sales Quantity by Application (2019-2030)
  • 9.3 Asia-Pacific Wafer Bonding Equipment Market Size by Region
    • 9.3.1 Asia-Pacific Wafer Bonding Equipment Sales Quantity by Region (2019-2030)
    • 9.3.2 Asia-Pacific Wafer Bonding Equipment Consumption Value by Region (2019-2030)
    • 9.3.3 China Market Size and Forecast (2019-2030)
    • 9.3.4 Japan Market Size and Forecast (2019-2030)
    • 9.3.5 South Korea Market Size and Forecast (2019-2030)
    • 9.3.6 India Market Size and Forecast (2019-2030)
    • 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
    • 9.3.8 Australia Market Size and Forecast (2019-2030)

10 South America

  • 10.1 South America Wafer Bonding Equipment Sales Quantity by Type (2019-2030)
  • 10.2 South America Wafer Bonding Equipment Sales Quantity by Application (2019-2030)
  • 10.3 South America Wafer Bonding Equipment Market Size by Country
    • 10.3.1 South America Wafer Bonding Equipment Sales Quantity by Country (2019-2030)
    • 10.3.2 South America Wafer Bonding Equipment Consumption Value by Country (2019-2030)
    • 10.3.3 Brazil Market Size and Forecast (2019-2030)
    • 10.3.4 Argentina Market Size and Forecast (2019-2030)

11 Middle East & Africa

  • 11.1 Middle East & Africa Wafer Bonding Equipment Sales Quantity by Type (2019-2030)
  • 11.2 Middle East & Africa Wafer Bonding Equipment Sales Quantity by Application (2019-2030)
  • 11.3 Middle East & Africa Wafer Bonding Equipment Market Size by Country
    • 11.3.1 Middle East & Africa Wafer Bonding Equipment Sales Quantity by Country (2019-2030)
    • 11.3.2 Middle East & Africa Wafer Bonding Equipment Consumption Value by Country (2019-2030)
    • 11.3.3 Turkey Market Size and Forecast (2019-2030)
    • 11.3.4 Egypt Market Size and Forecast (2019-2030)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
    • 11.3.6 South Africa Market Size and Forecast (2019-2030)

12 Market Dynamics

  • 12.1 Wafer Bonding Equipment Market Drivers
  • 12.2 Wafer Bonding Equipment Market Restraints
  • 12.3 Wafer Bonding Equipment Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Wafer Bonding Equipment and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Wafer Bonding Equipment
  • 13.3 Wafer Bonding Equipment Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Wafer Bonding Equipment Typical Distributors
  • 14.3 Wafer Bonding Equipment Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Wafer Bonding Equipment. Industry analysis & Market Report on Wafer Bonding Equipment is a syndicated market report, published as Global Wafer Bonding Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030. It is complete Research Study and Industry Analysis of Wafer Bonding Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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