Report Detail
Global (United States, European Union and China) Wire Bonder Equipment Market Research Report 2019-2025
- RnM3663713 |
- 13 August, 2019 |
- Global |
- 116 Pages |
- QYResearch |
- Machinery & Equipment
Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.
According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is characterized by relationship-based sales. The selling price of such equipment is usually in the range of $100,000-$1,000,000. Therefore, manufacturers look to develop long-standing relations with customers buying their product offerings. The outlook of building such relations is to ensure repeat purchases by offering discounts and incentives for future orders. This is mostly practiced on those customers who account for around 5-10% of the equipment manufacturers sales.
In 2019, the market size of Wire Bonder Equipment is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Wire Bonder Equipment.
This report studies the global market size of Wire Bonder Equipment, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Wire Bonder Equipment production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
ASM Pacific Technology
Kulicke& Soffa
Palomar Technologies
Besi
DIAS Automation
F&K Delvotec Bondtechnik
Hesse
Hybond
SHINKAWA Electric
Toray Engineering
West Bond
Market Segment by Product Type
Ball Bonders
Stud-Bump Bonders
Wedge Bonders
Market Segment by Application
Steel
Manufacture
Others
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Wire Bonder Equipment status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Wire Bonder Equipment manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Wire Bonder Equipment are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
Table of Contents
1 Report Overview
- 1.1 Research Scope
- 1.2 Major Manufacturers Covered in This Report
- 1.3 Market Segment by Type
- 1.3.1 Global Wire Bonder Equipment Market Size Growth Rate by Type (2019-2025)
- 1.3.2 Ball Bonders
- 1.3.3 Stud-Bump Bonders
- 1.3.4 Wedge Bonders
- 1.4 Market Segment by Application
- 1.4.1 Global Wire Bonder Equipment Market Share by Application (2019-2025)
- 1.4.2 Steel
- 1.4.3 Manufacture
- 1.4.4 Others
- 1.5 Study Objectives
- 1.6 Years Considered
2 Global Growth Trends
- 2.1 Production and Capacity Analysis
- 2.1.1 Global Wire Bonder Equipment Production Value 2014-2025
- 2.1.2 Global Wire Bonder Equipment Production 2014-2025
- 2.1.3 Global Wire Bonder Equipment Capacity 2014-2025
- 2.1.4 Global Wire Bonder Equipment Marketing Pricing and Trends
- 2.2 Key Producers Growth Rate (CAGR) 2019-2025
- 2.2.1 Global Wire Bonder Equipment Market Size CAGR of Key Regions
- 2.2.2 Global Wire Bonder Equipment Market Share of Key Regions
- 2.3 Industry Trends
- 2.3.1 Market Top Trends
- 2.3.2 Market Drivers
3 Market Share by Manufacturers
- 3.1 Capacity and Production by Manufacturers
- 3.1.1 Global Wire Bonder Equipment Capacity by Manufacturers
- 3.1.2 Global Wire Bonder Equipment Production by Manufacturers
- 3.2 Revenue by Manufacturers
- 3.2.1 Wire Bonder Equipment Revenue by Manufacturers (2014-2019)
- 3.2.2 Wire Bonder Equipment Revenue Share by Manufacturers (2014-2019)
- 3.2.3 Global Wire Bonder Equipment Market Concentration Ratio (CR5 and HHI)
- 3.3 Wire Bonder Equipment Price by Manufacturers
- 3.4 Key Manufacturers Wire Bonder Equipment Plants/Factories Distribution and Area Served
- 3.5 Date of Key Manufacturers Enter into Wire Bonder Equipment Market
- 3.6 Key Manufacturers Wire Bonder Equipment Product Offered
- 3.7 Mergers & Acquisitions, Expansion Plans
4 Market Size by Type
- 4.1 Production and Production Value for Each Type
- 4.1.1 Ball Bonders Production and Production Value (2014-2019)
- 4.1.2 Stud-Bump Bonders Production and Production Value (2014-2019)
- 4.1.3 Wedge Bonders Production and Production Value (2014-2019)
- 4.2 Global Wire Bonder Equipment Production Market Share by Type
- 4.3 Global Wire Bonder Equipment Production Value Market Share by Type
- 4.4 Wire Bonder Equipment Ex-factory Price by Type
5 Market Size by Application
- 5.1 Overview
- 5.2 Global Wire Bonder Equipment Consumption by Application
6 Production by Regions
- 6.1 Global Wire Bonder Equipment Production (History Data) by Regions 2014-2019
- 6.2 Global Wire Bonder Equipment Production Value (History Data) by Regions
- 6.3 United States
- 6.3.1 United States Wire Bonder Equipment Production Growth Rate 2014-2019
- 6.3.2 United States Wire Bonder Equipment Production Value Growth Rate 2014-2019
- 6.3.3 Key Players in United States
- 6.3.4 United States Wire Bonder Equipment Import & Export
- 6.4 European Union
- 6.4.1 European Union Wire Bonder Equipment Production Growth Rate 2014-2019
- 6.4.2 European Union Wire Bonder Equipment Production Value Growth Rate 2014-2019
- 6.4.3 Key Players in European Union
- 6.4.4 European Union Wire Bonder Equipment Import & Export
- 6.5 China
- 6.5.1 China Wire Bonder Equipment Production Growth Rate 2014-2019
- 6.5.2 China Wire Bonder Equipment Production Value Growth Rate 2014-2019
- 6.5.3 Key Players in China
- 6.5.4 China Wire Bonder Equipment Import & Export
- 6.6 Rest of World
- 6.6.1 Japan
- 6.6.2 Korea
- 6.6.3 India
- 6.6.4 Southeast Asia
7 Wire Bonder Equipment Consumption by Regions
- 7.1 Global Wire Bonder Equipment Consumption (History Data) by Regions
- 7.2 United States
- 7.2.1 United States Wire Bonder Equipment Consumption by Type
- 7.2.2 United States Wire Bonder Equipment Consumption by Application
- 7.3 European Union
- 7.3.1 European Union Wire Bonder Equipment Consumption by Type
- 7.3.2 European Union Wire Bonder Equipment Consumption by Application
- 7.4 China
- 7.4.1 China Wire Bonder Equipment Consumption by Type
- 7.4.2 China Wire Bonder Equipment Consumption by Application
- 7.5 Rest of World
- 7.5.1 Rest of World Wire Bonder Equipment Consumption by Type
- 7.5.2 Rest of World Wire Bonder Equipment Consumption by Application
- 7.5.1 Japan
- 7.5.2 Korea
- 7.5.3 India
- 7.5.4 Southeast Asia
8 Company Profiles
- 8.1 ASM Pacific Technology
- 8.1.1 ASM Pacific Technology Company Details
- 8.1.2 Company Description and Business Overview
- 8.1.3 Production and Revenue of Wire Bonder Equipment
- 8.1.4 Wire Bonder Equipment Product Introduction
- 8.1.5 ASM Pacific Technology Recent Development
- 8.2 Kulicke& Soffa
- 8.2.1 Kulicke& Soffa Company Details
- 8.2.2 Company Description and Business Overview
- 8.2.3 Production and Revenue of Wire Bonder Equipment
- 8.2.4 Wire Bonder Equipment Product Introduction
- 8.2.5 Kulicke& Soffa Recent Development
- 8.3 Palomar Technologies
- 8.3.1 Palomar Technologies Company Details
- 8.3.2 Company Description and Business Overview
- 8.3.3 Production and Revenue of Wire Bonder Equipment
- 8.3.4 Wire Bonder Equipment Product Introduction
- 8.3.5 Palomar Technologies Recent Development
- 8.4 Besi
- 8.4.1 Besi Company Details
- 8.4.2 Company Description and Business Overview
- 8.4.3 Production and Revenue of Wire Bonder Equipment
- 8.4.4 Wire Bonder Equipment Product Introduction
- 8.4.5 Besi Recent Development
- 8.5 DIAS Automation
- 8.5.1 DIAS Automation Company Details
- 8.5.2 Company Description and Business Overview
- 8.5.3 Production and Revenue of Wire Bonder Equipment
- 8.5.4 Wire Bonder Equipment Product Introduction
- 8.5.5 DIAS Automation Recent Development
- 8.6 F&K Delvotec Bondtechnik
- 8.6.1 F&K Delvotec Bondtechnik Company Details
- 8.6.2 Company Description and Business Overview
- 8.6.3 Production and Revenue of Wire Bonder Equipment
- 8.6.4 Wire Bonder Equipment Product Introduction
- 8.6.5 F&K Delvotec Bondtechnik Recent Development
- 8.7 Hesse
- 8.7.1 Hesse Company Details
- 8.7.2 Company Description and Business Overview
- 8.7.3 Production and Revenue of Wire Bonder Equipment
- 8.7.4 Wire Bonder Equipment Product Introduction
- 8.7.5 Hesse Recent Development
- 8.8 Hybond
- 8.8.1 Hybond Company Details
- 8.8.2 Company Description and Business Overview
- 8.8.3 Production and Revenue of Wire Bonder Equipment
- 8.8.4 Wire Bonder Equipment Product Introduction
- 8.8.5 Hybond Recent Development
- 8.9 SHINKAWA Electric
- 8.9.1 SHINKAWA Electric Company Details
- 8.9.2 Company Description and Business Overview
- 8.9.3 Production and Revenue of Wire Bonder Equipment
- 8.9.4 Wire Bonder Equipment Product Introduction
- 8.9.5 SHINKAWA Electric Recent Development
- 8.10 Toray Engineering
- 8.10.1 Toray Engineering Company Details
- 8.10.2 Company Description and Business Overview
- 8.10.3 Production and Revenue of Wire Bonder Equipment
- 8.10.4 Wire Bonder Equipment Product Introduction
- 8.10.5 Toray Engineering Recent Development
- 8.11 West Bond
9 Market Forecast
- 9.1 Global Market Size Forecast
- 9.1.1 Global Wire Bonder Equipment Capacity, Production Forecast 2019-2025
- 9.1.2 Global Wire Bonder Equipment Production Value Forecast 2019-2025
- 9.2 Market Forecast by Regions
- 9.2.1 Global Wire Bonder Equipment Production and Value Forecast by Regions 2019-2025
- 9.2.2 Global Wire Bonder Equipment Consumption Forecast by Regions 2019-2025
- 9.3 United States
- 9.3.1 Production and Value Forecast in United States
- 9.3.2 Consumption Forecast in United States
- 9.4 European Union
- 9.4.1 Production and Value Forecast in European Union
- 9.4.2 Consumption Forecast in European Union
- 9.5 China
- 9.5.1 Production and Value Forecast in China
- 9.5.2 Consumption Forecast in China
- 9.6 Rest of World
- 9.6.1 Japan
- 9.6.2 Korea
- 9.6.3 India
- 9.6.4 Southeast Asia
- 9.7 Forecast by Type
- 9.7.1 Global Wire Bonder Equipment Production Forecast by Type
- 9.7.2 Global Wire Bonder Equipment Production Value Forecast by Type
- 9.8 Consumption Forecast by Application
10 Value Chain and Sales Channels Analysis
- 10.1 Value Chain Analysis
- 10.2 Sales Channels Analysis
- 10.2.1 Wire Bonder Equipment Sales Channels
- 10.2.2 Wire Bonder Equipment Distributors
- 10.3 Wire Bonder Equipment Customers
11 Opportunities & Challenges, Threat and Affecting Factors
- 11.1 Market Opportunities
- 11.2 Market Challenges
- 11.3 Porter's Five Forces Analysis
12 Key Findings
13 Appendix
- 13.1 Research Methodology
- 13.1.1 Methodology/Research Approach
- 13.1.1.1 Research Programs/Design
- 13.1.1.2 Market Size Estimation
- 13.1.1.3 Market Breakdown and Data Triangulation
- 13.1.2 Data Source
- 13.1.2.1 Secondary Sources
- 13.1.2.2 Primary Sources
- 13.1.1 Methodology/Research Approach
- 13.2 Author Details
Summary:
Get latest Market Research Reports on Wire Bonder Equipment. Industry analysis & Market Report on Wire Bonder Equipment is a syndicated market report, published as Global (United States, European Union and China) Wire Bonder Equipment Market Research Report 2019-2025. It is complete Research Study and Industry Analysis of Wire Bonder Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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