Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.
The global Wire Bonder Equipment market will reach xxx Million USD in 2020 with CAGR xx% 2020-2025. The main contents of the report including:
Global market size and forecast
Regional market size, production data and export & import
Key manufacturers profile, products & services, sales data of business
Global market size by Major End-Use
Global market size by Major Type
Key manufacturers are included based on company profile, sales data and product specifications etc.:
ASM Pacific Technology
Kulicke& Soffa
Palomar Technologies
Besi
DIAS Automation
F&K Delvotec Bondtechnik
Hesse
Hybond
SHINKAWA Electric
Toray Engineering
West Bond
Major applications as follows:
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
Major Type as follows:
Ball bonders
Stud-bump bonders
Wedge bonders
Regional market size, production data and export & import:
Asia-Pacific
North America
Europe
South America
Middle East & Africa
Table of Content
1 Global Market Overview
1.1 Scope of Statistics
1.1.1 Scope of Products
1.1.2 Scope of Manufacturers
1.1.3 Scope of End-Use
1.1.4 Scope of Product Type
1.1.5 Scope of Regions/Countries
1.2 Global Market Size
Fig Global Wire Bonder Equipment Market Size and CAGR 2015-2019 (Million USD)
Fig Global Wire Bonder Equipment Market Size and CAGR 2015-2019 (Volume)
Fig Global Wire Bonder Equipment Market Forecast and CAGR 2020-2025 (Million USD)
Fig Global Wire Bonder Equipment Market Forecast and CAGR 2020-2025 (Volume)
Summary: Get latest Market Research Reports on Wire Bonder Equipment. Industry analysis & Market Report on Wire Bonder Equipment is a syndicated market report, published as Global Wire Bonder Equipment Market Data Survey Report 2013-2025. It is complete Research Study and Industry Analysis of Wire Bonder Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.