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Electronics & Semiconductor Global Wafer Grinding Tapes Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

  • RnM4598773
    • |
  • 02 July, 2024
    • |
  • Global
    • |
  • 113 Pages
    • |
  • GIR (Global Info Research)
    • |
  • Electronics & Semiconductor

According to our (Global Info Research) latest study, the global Wafer Grinding Tapes market size was valued at USD 200.6 million in 2023 and is forecast to a readjusted size of USD 276.5 million by 2030 with a CAGR of 4.7% during review period.
Wafer Grinding Tapes is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
The Global Info Research report includes an overview of the development of the Wafer Grinding Tapes industry chain, the market status of Standard (UV Type, Non-UV Type), Standard Thin Die (UV Type, Non-UV Type), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Wafer Grinding Tapes.
Regionally, the report analyzes the Wafer Grinding Tapes markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Wafer Grinding Tapes market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Wafer Grinding Tapes market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Wafer Grinding Tapes industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K Sqm), revenue generated, and market share of different by Type (e.g., UV Type, Non-UV Type).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Wafer Grinding Tapes market.
Regional Analysis: The report involves examining the Wafer Grinding Tapes market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Wafer Grinding Tapes market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Wafer Grinding Tapes:
Company Analysis: Report covers individual Wafer Grinding Tapes manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Wafer Grinding Tapes This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Standard, Standard Thin Die).
Technology Analysis: Report covers specific technologies relevant to Wafer Grinding Tapes. It assesses the current state, advancements, and potential future developments in Wafer Grinding Tapes areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Wafer Grinding Tapes market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Wafer Grinding Tapes market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Market segment by Type
UV Type
Non-UV Type
Market segment by Application
Standard
Standard Thin Die
(S)DBG(GAL)
Bump
Major players covered
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
Force-One Applied Materials
AMC Co, Ltd
Pantech Tape Co., Ltd
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Grinding Tapes product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Grinding Tapes, with price, sales, revenue and global market share of Wafer Grinding Tapes from 2019 to 2024.
Chapter 3, the Wafer Grinding Tapes competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Grinding Tapes breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Wafer Grinding Tapes market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Grinding Tapes.
Chapter 14 and 15, to describe Wafer Grinding Tapes sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope of Wafer Grinding Tapes
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Wafer Grinding Tapes Consumption Value by Type: 2019 Versus 2023 Versus 2030
    • 1.3.2 UV Type
    • 1.3.3 Non-UV Type
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Wafer Grinding Tapes Consumption Value by Application: 2019 Versus 2023 Versus 2030
    • 1.4.2 Standard
    • 1.4.3 Standard Thin Die
    • 1.4.4 (S)DBG(GAL)
    • 1.4.5 Bump
  • 1.5 Global Wafer Grinding Tapes Market Size & Forecast
    • 1.5.1 Global Wafer Grinding Tapes Consumption Value (2019 & 2023 & 2030)
    • 1.5.2 Global Wafer Grinding Tapes Sales Quantity (2019-2030)
    • 1.5.3 Global Wafer Grinding Tapes Average Price (2019-2030)

2 Manufacturers Profiles

  • 2.1 Mitsui Chemicals Tohcello
    • 2.1.1 Mitsui Chemicals Tohcello Details
    • 2.1.2 Mitsui Chemicals Tohcello Major Business
    • 2.1.3 Mitsui Chemicals Tohcello Wafer Grinding Tapes Product and Services
    • 2.1.4 Mitsui Chemicals Tohcello Wafer Grinding Tapes Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.1.5 Mitsui Chemicals Tohcello Recent Developments/Updates
  • 2.2 Nitto
    • 2.2.1 Nitto Details
    • 2.2.2 Nitto Major Business
    • 2.2.3 Nitto Wafer Grinding Tapes Product and Services
    • 2.2.4 Nitto Wafer Grinding Tapes Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.2.5 Nitto Recent Developments/Updates
  • 2.3 LINTEC
    • 2.3.1 LINTEC Details
    • 2.3.2 LINTEC Major Business
    • 2.3.3 LINTEC Wafer Grinding Tapes Product and Services
    • 2.3.4 LINTEC Wafer Grinding Tapes Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.3.5 LINTEC Recent Developments/Updates
  • 2.4 Furukawa Electric
    • 2.4.1 Furukawa Electric Details
    • 2.4.2 Furukawa Electric Major Business
    • 2.4.3 Furukawa Electric Wafer Grinding Tapes Product and Services
    • 2.4.4 Furukawa Electric Wafer Grinding Tapes Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.4.5 Furukawa Electric Recent Developments/Updates
  • 2.5 Denka
    • 2.5.1 Denka Details
    • 2.5.2 Denka Major Business
    • 2.5.3 Denka Wafer Grinding Tapes Product and Services
    • 2.5.4 Denka Wafer Grinding Tapes Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.5.5 Denka Recent Developments/Updates
  • 2.6 D&X
    • 2.6.1 D&X Details
    • 2.6.2 D&X Major Business
    • 2.6.3 D&X Wafer Grinding Tapes Product and Services
    • 2.6.4 D&X Wafer Grinding Tapes Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.6.5 D&X Recent Developments/Updates
  • 2.7 AI Technology
    • 2.7.1 AI Technology Details
    • 2.7.2 AI Technology Major Business
    • 2.7.3 AI Technology Wafer Grinding Tapes Product and Services
    • 2.7.4 AI Technology Wafer Grinding Tapes Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.7.5 AI Technology Recent Developments/Updates
  • 2.8 Force-One Applied Materials
    • 2.8.1 Force-One Applied Materials Details
    • 2.8.2 Force-One Applied Materials Major Business
    • 2.8.3 Force-One Applied Materials Wafer Grinding Tapes Product and Services
    • 2.8.4 Force-One Applied Materials Wafer Grinding Tapes Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.8.5 Force-One Applied Materials Recent Developments/Updates
  • 2.9 AMC Co, Ltd
    • 2.9.1 AMC Co, Ltd Details
    • 2.9.2 AMC Co, Ltd Major Business
    • 2.9.3 AMC Co, Ltd Wafer Grinding Tapes Product and Services
    • 2.9.4 AMC Co, Ltd Wafer Grinding Tapes Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.9.5 AMC Co, Ltd Recent Developments/Updates
  • 2.10 Pantech Tape Co., Ltd
    • 2.10.1 Pantech Tape Co., Ltd Details
    • 2.10.2 Pantech Tape Co., Ltd Major Business
    • 2.10.3 Pantech Tape Co., Ltd Wafer Grinding Tapes Product and Services
    • 2.10.4 Pantech Tape Co., Ltd Wafer Grinding Tapes Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.10.5 Pantech Tape Co., Ltd Recent Developments/Updates

3 Competitive Environment: Wafer Grinding Tapes by Manufacturer

  • 3.1 Global Wafer Grinding Tapes Sales Quantity by Manufacturer (2019-2024)
  • 3.2 Global Wafer Grinding Tapes Revenue by Manufacturer (2019-2024)
  • 3.3 Global Wafer Grinding Tapes Average Price by Manufacturer (2019-2024)
  • 3.4 Market Share Analysis (2023)
    • 3.4.1 Producer Shipments of Wafer Grinding Tapes by Manufacturer Revenue ($MM) and Market Share (%): 2023
    • 3.4.2 Top 3 Wafer Grinding Tapes Manufacturer Market Share in 2023
    • 3.4.2 Top 6 Wafer Grinding Tapes Manufacturer Market Share in 2023
  • 3.5 Wafer Grinding Tapes Market: Overall Company Footprint Analysis
    • 3.5.1 Wafer Grinding Tapes Market: Region Footprint
    • 3.5.2 Wafer Grinding Tapes Market: Company Product Type Footprint
    • 3.5.3 Wafer Grinding Tapes Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Wafer Grinding Tapes Market Size by Region
    • 4.1.1 Global Wafer Grinding Tapes Sales Quantity by Region (2019-2030)
    • 4.1.2 Global Wafer Grinding Tapes Consumption Value by Region (2019-2030)
    • 4.1.3 Global Wafer Grinding Tapes Average Price by Region (2019-2030)
  • 4.2 North America Wafer Grinding Tapes Consumption Value (2019-2030)
  • 4.3 Europe Wafer Grinding Tapes Consumption Value (2019-2030)
  • 4.4 Asia-Pacific Wafer Grinding Tapes Consumption Value (2019-2030)
  • 4.5 South America Wafer Grinding Tapes Consumption Value (2019-2030)
  • 4.6 Middle East and Africa Wafer Grinding Tapes Consumption Value (2019-2030)

5 Market Segment by Type

  • 5.1 Global Wafer Grinding Tapes Sales Quantity by Type (2019-2030)
  • 5.2 Global Wafer Grinding Tapes Consumption Value by Type (2019-2030)
  • 5.3 Global Wafer Grinding Tapes Average Price by Type (2019-2030)

6 Market Segment by Application

  • 6.1 Global Wafer Grinding Tapes Sales Quantity by Application (2019-2030)
  • 6.2 Global Wafer Grinding Tapes Consumption Value by Application (2019-2030)
  • 6.3 Global Wafer Grinding Tapes Average Price by Application (2019-2030)

7 North America

  • 7.1 North America Wafer Grinding Tapes Sales Quantity by Type (2019-2030)
  • 7.2 North America Wafer Grinding Tapes Sales Quantity by Application (2019-2030)
  • 7.3 North America Wafer Grinding Tapes Market Size by Country
    • 7.3.1 North America Wafer Grinding Tapes Sales Quantity by Country (2019-2030)
    • 7.3.2 North America Wafer Grinding Tapes Consumption Value by Country (2019-2030)
    • 7.3.3 United States Market Size and Forecast (2019-2030)
    • 7.3.4 Canada Market Size and Forecast (2019-2030)
    • 7.3.5 Mexico Market Size and Forecast (2019-2030)

8 Europe

  • 8.1 Europe Wafer Grinding Tapes Sales Quantity by Type (2019-2030)
  • 8.2 Europe Wafer Grinding Tapes Sales Quantity by Application (2019-2030)
  • 8.3 Europe Wafer Grinding Tapes Market Size by Country
    • 8.3.1 Europe Wafer Grinding Tapes Sales Quantity by Country (2019-2030)
    • 8.3.2 Europe Wafer Grinding Tapes Consumption Value by Country (2019-2030)
    • 8.3.3 Germany Market Size and Forecast (2019-2030)
    • 8.3.4 France Market Size and Forecast (2019-2030)
    • 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
    • 8.3.6 Russia Market Size and Forecast (2019-2030)
    • 8.3.7 Italy Market Size and Forecast (2019-2030)

9 Asia-Pacific

  • 9.1 Asia-Pacific Wafer Grinding Tapes Sales Quantity by Type (2019-2030)
  • 9.2 Asia-Pacific Wafer Grinding Tapes Sales Quantity by Application (2019-2030)
  • 9.3 Asia-Pacific Wafer Grinding Tapes Market Size by Region
    • 9.3.1 Asia-Pacific Wafer Grinding Tapes Sales Quantity by Region (2019-2030)
    • 9.3.2 Asia-Pacific Wafer Grinding Tapes Consumption Value by Region (2019-2030)
    • 9.3.3 China Market Size and Forecast (2019-2030)
    • 9.3.4 Japan Market Size and Forecast (2019-2030)
    • 9.3.5 Korea Market Size and Forecast (2019-2030)
    • 9.3.6 India Market Size and Forecast (2019-2030)
    • 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
    • 9.3.8 Australia Market Size and Forecast (2019-2030)

10 South America

  • 10.1 South America Wafer Grinding Tapes Sales Quantity by Type (2019-2030)
  • 10.2 South America Wafer Grinding Tapes Sales Quantity by Application (2019-2030)
  • 10.3 South America Wafer Grinding Tapes Market Size by Country
    • 10.3.1 South America Wafer Grinding Tapes Sales Quantity by Country (2019-2030)
    • 10.3.2 South America Wafer Grinding Tapes Consumption Value by Country (2019-2030)
    • 10.3.3 Brazil Market Size and Forecast (2019-2030)
    • 10.3.4 Argentina Market Size and Forecast (2019-2030)

11 Middle East & Africa

  • 11.1 Middle East & Africa Wafer Grinding Tapes Sales Quantity by Type (2019-2030)
  • 11.2 Middle East & Africa Wafer Grinding Tapes Sales Quantity by Application (2019-2030)
  • 11.3 Middle East & Africa Wafer Grinding Tapes Market Size by Country
    • 11.3.1 Middle East & Africa Wafer Grinding Tapes Sales Quantity by Country (2019-2030)
    • 11.3.2 Middle East & Africa Wafer Grinding Tapes Consumption Value by Country (2019-2030)
    • 11.3.3 Turkey Market Size and Forecast (2019-2030)
    • 11.3.4 Egypt Market Size and Forecast (2019-2030)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
    • 11.3.6 South Africa Market Size and Forecast (2019-2030)

12 Market Dynamics

  • 12.1 Wafer Grinding Tapes Market Drivers
  • 12.2 Wafer Grinding Tapes Market Restraints
  • 12.3 Wafer Grinding Tapes Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Wafer Grinding Tapes and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Wafer Grinding Tapes
  • 13.3 Wafer Grinding Tapes Production Process
  • 13.4 Wafer Grinding Tapes Industrial Chain

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Wafer Grinding Tapes Typical Distributors
  • 14.3 Wafer Grinding Tapes Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Wafer Grinding Tapes. Industry analysis & Market Report on Wafer Grinding Tapes is a syndicated market report, published as Global Wafer Grinding Tapes Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030. It is complete Research Study and Industry Analysis of Wafer Grinding Tapes market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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