Global and United States Wafer Bumping Market Report & Forecast 2022-2028

Table of Contents

1 Study Coverage

• 1.1 Wafer Bumping Revenue in Wafer Bumping Business (2017-2022) & (US$ Million) Introduction
• 1.2 Global Wafer Bumping Outlook 2017 VS 2022 VS 2028
  • 1.2.1 Global Wafer Bumping Market Size for the Year 2017-2028
  • 1.2.2 Global Wafer Bumping Market Size for the Year 2017-2028
• 1.3 Wafer Bumping Market Size, United States VS Global, 2017 VS 2022 VS 2028
  • 1.3.1 The Market Share of United States Wafer Bumping in Global, 2017 VS 2022 VS 2028
  • 1.3.2 The Growth Rate of Wafer Bumping Market Size, United States VS Global, 2017 VS 2022 VS 2028
• 1.4 Wafer Bumping Market Dynamics
  • 1.4.1 Wafer Bumping Industry Trends
  • 1.4.2 Wafer Bumping Market Drivers
  • 1.4.3 Wafer Bumping Market Challenges
  • 1.4.4 Wafer Bumping Market Restraints
• 1.5 Study Objectives
• 1.6 Years Considered

2 Wafer Bumping by Type

• 2.1 Wafer Bumping Market Segment by Type
  • 2.1.1 Copper Pillar Bump
  • 2.1.2 Lead Free Bump
  • 2.1.3 Others
• 2.2 Global Wafer Bumping Market Size by Type (2017, 2022 & 2028)
• 2.3 Global Wafer Bumping Market Size by Type (2017-2028)
• 2.4 United States Wafer Bumping Market Size by Type (2017, 2022 & 2028)
• 2.5 United States Wafer Bumping Market Size by Type (2017-2028)

3 Wafer Bumping by Application

• 3.1 Wafer Bumping Market Segment by Application
  • 3.1.1 4&6 Inch
  • 3.1.2 8&12 Inch
• 3.2 Global Wafer Bumping Market Size by Application (2017, 2022 & 2028)
• 3.3 Global Wafer Bumping Market Size by Application (2017-2028)
• 3.4 United States Wafer Bumping Market Size by Application (2017, 2022 & 2028)
• 3.5 United States Wafer Bumping Market Size by Application (2017-2028)

4 Global Wafer Bumping Competitor Landscape by Company

• 4.1 Global Wafer Bumping Market Size by Company
  • 4.1.1 Top Global Wafer Bumping Companies Ranked by Revenue (2021)
  • 4.1.2 Global Wafer Bumping Revenue by Player (2017-2022)
• 4.2 Global Wafer Bumping Concentration Ratio (CR)
  • 4.2.1 Wafer Bumping Market Concentration Ratio (CR) (2017-2022)
  • 4.2.2 Global Top 5 and Top 10 Largest Companies of Wafer Bumping in 2021
  • 4.2.3 Global Wafer Bumping Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
• 4.3 Global Wafer Bumping Headquarters, Revenue in Wafer Bumping Business (2017-2022) & (US$ Million) Type
  • 4.3.1 Global Wafer Bumping Headquarters and Area Served
  • 4.3.2 Global Wafer Bumping Companies Revenue in Wafer Bumping Business (2017-2022) & (US$ Million) Type
  • 4.3.3 Date of International Companies Enter into Wafer Bumping Market
• 4.4 Companies Mergers & Acquisitions, Expansion Plans
• 4.5 United States Wafer Bumping Market Size by Company
  • 4.5.1 Top Wafer Bumping Players in United States, Ranked by Revenue (2021)
  • 4.5.2 United States Wafer Bumping Revenue by Players (2020, 2021 & 2022)

5 Global Wafer Bumping Market Size by Region

• 5.1 Global Wafer Bumping Market Size by Region: 2017 VS 2022 VS 2028
• 5.2 Global Wafer Bumping Market Size by Region (2017-2028)
  • 5.2.1 Global Wafer Bumping Market Size by Region: 2017-2022
  • 5.2.2 Global Wafer Bumping Market Size by Region (2023-2028)

6 Segment in Region Level & Country Level

• 6.1 North America
  • 6.1.1 North America Wafer Bumping Market Size YoY Growth 2017-2028
  • 6.1.2 North America Wafer Bumping Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.1.3 United States
  • 6.1.4 Canada
• 6.2 Asia-Pacific
  • 6.2.1 Asia-Pacific Wafer Bumping Market Size YoY Growth 2017-2028
  • 6.2.2 Asia-Pacific Wafer Bumping Market Facts & Figures by Region (2017, 2022 & 2028)
  • 6.2.3 China
  • 6.2.4 Japan
  • 6.2.5 South Korea
  • 6.2.6 India
  • 6.2.7 Australia
  • 6.2.8 China Taiwan
  • 6.2.9 Indonesia
  • 6.2.10 Thailand
  • 6.2.11 Malaysia
• 6.3 Europe
  • 6.3.1 Europe Wafer Bumping Market Size YoY Growth 2017-2028
  • 6.3.2 Europe Wafer Bumping Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.3.3 Germany
  • 6.3.4 France
  • 6.3.5 U.K.
  • 6.3.6 Italy
  • 6.3.7 Russia
• 6.4 Latin America
  • 6.4.1 Latin America Wafer Bumping Market Size YoY Growth 2017-2028
  • 6.4.2 Latin America Wafer Bumping Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.4.3 Mexico
  • 6.4.4 Brazil
  • 6.4.5 Argentina
  • 6.4.6 Colombia
• 6.5 Middle East and Africa
  • 6.5.1 Middle East and Africa Wafer Bumping Market Size YoY Growth 2017-2028
  • 6.5.2 Middle East and Africa Wafer Bumping Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.5.3 Turkey
  • 6.5.4 Saudi Arabia
  • 6.5.5 UAE

7 Company Profiles

• 7.1 ASE Global
  • 7.1.1 ASE Global Company Details
  • 7.1.2 ASE Global Business Overview
  • 7.1.3 ASE Global Wafer Bumping Introduction
  • 7.1.4 ASE Global Revenue in Wafer Bumping Business (2017-2022)
  • 7.1.5 ASE Global Recent Development
• 7.2 Fujitsu
  • 7.2.1 Fujitsu Company Details
  • 7.2.2 Fujitsu Business Overview
  • 7.2.3 Fujitsu Wafer Bumping Introduction
  • 7.2.4 Fujitsu Revenue in Wafer Bumping Business (2017-2022)
  • 7.2.5 Fujitsu Recent Development
• 7.3 Amkor Technology
  • 7.3.1 Amkor Technology Company Details
  • 7.3.2 Amkor Technology Business Overview
  • 7.3.3 Amkor Technology Wafer Bumping Introduction
  • 7.3.4 Amkor Technology Revenue in Wafer Bumping Business (2017-2022)
  • 7.3.5 Amkor Technology Recent Development
• 7.4 MacDermid Alpha Electronics Solutions
  • 7.4.1 MacDermid Alpha Electronics Solutions Company Details
  • 7.4.2 MacDermid Alpha Electronics Solutions Business Overview
  • 7.4.3 MacDermid Alpha Electronics Solutions Wafer Bumping Introduction
  • 7.4.4 MacDermid Alpha Electronics Solutions Revenue in Wafer Bumping Business (2017-2022)
  • 7.4.5 MacDermid Alpha Electronics Solutions Recent Development
• 7.5 Maxell
  • 7.5.1 Maxell Company Details
  • 7.5.2 Maxell Business Overview
  • 7.5.3 Maxell Wafer Bumping Introduction
  • 7.5.4 Maxell Revenue in Wafer Bumping Business (2017-2022)
  • 7.5.5 Maxell Recent Development
• 7.6 JCET Group
  • 7.6.1 JCET Group Company Details
  • 7.6.2 JCET Group Business Overview
  • 7.6.3 JCET Group Wafer Bumping Introduction
  • 7.6.4 JCET Group Revenue in Wafer Bumping Business (2017-2022)
  • 7.6.5 JCET Group Recent Development
• 7.7 Unisem Group
  • 7.7.1 Unisem Group Company Details
  • 7.7.2 Unisem Group Business Overview
  • 7.7.3 Unisem Group Wafer Bumping Introduction
  • 7.7.4 Unisem Group Revenue in Wafer Bumping Business (2017-2022)
  • 7.7.5 Unisem Group Recent Development
• 7.8 Powertech Technology
  • 7.8.1 Powertech Technology Company Details
  • 7.8.2 Powertech Technology Business Overview
  • 7.8.3 Powertech Technology Wafer Bumping Introduction
  • 7.8.4 Powertech Technology Revenue in Wafer Bumping Business (2017-2022)
  • 7.8.5 Powertech Technology Recent Development
• 7.9 SFA Semicon
  • 7.9.1 SFA Semicon Company Details
  • 7.9.2 SFA Semicon Business Overview
  • 7.9.3 SFA Semicon Wafer Bumping Introduction
  • 7.9.4 SFA Semicon Revenue in Wafer Bumping Business (2017-2022)
  • 7.9.5 SFA Semicon Recent Development
• 7.10 Semi-Pac Inc
  • 7.10.1 Semi-Pac Inc Company Details
  • 7.10.2 Semi-Pac Inc Business Overview
  • 7.10.3 Semi-Pac Inc Wafer Bumping Introduction
  • 7.10.4 Semi-Pac Inc Revenue in Wafer Bumping Business (2017-2022)
  • 7.10.5 Semi-Pac Inc Recent Development
• 7.11 ChipMOS TECHNOLOGIES
  • 7.11.1 ChipMOS TECHNOLOGIES Company Details
  • 7.11.2 ChipMOS TECHNOLOGIES Business Overview
  • 7.11.3 ChipMOS TECHNOLOGIES Wafer Bumping Introduction
  • 7.11.4 ChipMOS TECHNOLOGIES Revenue in Wafer Bumping Business (2017-2022)
  • 7.11.5 ChipMOS TECHNOLOGIES Recent Development
• 7.12 NEPES
  • 7.12.1 NEPES Company Details
  • 7.12.2 NEPES Business Overview
  • 7.12.3 NEPES Wafer Bumping Introduction
  • 7.12.4 NEPES Revenue in Wafer Bumping Business (2017-2022)
  • 7.12.5 NEPES Recent Development
• 7.13 TI
  • 7.13.1 TI Company Details
  • 7.13.2 TI Business Overview
  • 7.13.3 TI Wafer Bumping Introduction
  • 7.13.4 TI Revenue in Wafer Bumping Business (2017-2022)
  • 7.13.5 TI Recent Development
• 7.14 International Micro Industries
  • 7.14.1 International Micro Industries Company Details
  • 7.14.2 International Micro Industries Business Overview
  • 7.14.3 International Micro Industries Wafer Bumping Introduction
  • 7.14.4 International Micro Industries Revenue in Wafer Bumping Business (2017-2022)
  • 7.14.5 International Micro Industries Recent Development
• 7.15 Raytek Semiconductor
  • 7.15.1 Raytek Semiconductor Company Details
  • 7.15.2 Raytek Semiconductor Business Overview
  • 7.15.3 Raytek Semiconductor Wafer Bumping Introduction
  • 7.15.4 Raytek Semiconductor Revenue in Wafer Bumping Business (2017-2022)
  • 7.15.5 Raytek Semiconductor Recent Development
• 7.16 Jiangsu CAS Microelectronics Integration
  • 7.16.1 Jiangsu CAS Microelectronics Integration Company Details
  • 7.16.2 Jiangsu CAS Microelectronics Integration Business Overview
  • 7.16.3 Jiangsu CAS Microelectronics Integration Wafer Bumping Introduction
  • 7.16.4 Jiangsu CAS Microelectronics Integration Revenue in Wafer Bumping Business (2017-2022)
  • 7.16.5 Jiangsu CAS Microelectronics Integration Recent Development

8 Research Findings and Conclusion

9 Appendix

• 9.1 Research Methodology
  • 9.1.1 Methodology/Research Approach
  • 9.1.2 Data Source
• 9.2 Author Details