Underfill materials are necessary composite formulations made of organic polymers and inorganic fillers. These materials find their application in packaging of semiconductor for enhancing their thermochemical performance. Underfill materials are being excessively used in the packaging of semiconductor packaging because of their outstanding rework ability and thermal stability.
Some of the key players in the global underfills materials market include names such as Yincae Advanced Material LLC, AIM Metals & Alloys LP, Won Chemicals Co. Ltd., and Epoxy Technology among others.
In 2019, the market size of Underfill Materials is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Underfill Materials.
This report studies the global market size of Underfill Materials, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Underfill Materials production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
Yincae Advanced Material
AIM Metals & Alloys
Won Chemicals
Epoxy Technology
...
Market Segment by Product Type
Capillary Underfill Material (CUF)
No Flow Underfill Material (NUF)
Molded Underfill Material (MUF)
Market Segment by Application
Flip Chips
Ball Grid Array (BGA)
Chip Scale Packaging (CSP)
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Underfill Materials status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Underfill Materials manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Underfill Materials are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
Summary:
Get latest Market Research Reports on Underfill Materials. Industry analysis & Market Report on Underfill Materials is a syndicated market report, published as Global (United States, European Union and China) Underfill Materials Market Research Report 2019-2025. It is complete Research Study and Industry Analysis of Underfill Materials market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.