Report Detail
Global Thin Wafers Temporary Bonding Equipment and Materials Market Size, Status and Forecast 2020-2026
- RnM4099102 |
- 16 July, 2020 |
- Global |
- 128 Pages |
- QYResearch |
- Electronics & Semiconductor
Thin Wafers Temporary Bonding Equipment and Materials market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Thin Wafers Temporary Bonding Equipment and Materials market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2015-2026.
Market segment by Type, the product can be split into
Chemical Debonding
Hot Sliding Debonding
Mechanical Debonding
Laser Debonding
Market segment by Application, split into
< 100 µm Wafers
below 40µm Wafers
Based on regional and country-level analysis, the Thin Wafers Temporary Bonding Equipment and Materials market has been segmented as follows:
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Nordic
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Latin America
Mexico
Brazil
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of Middle East & Africa
In the competitive analysis section of the report, leading as well as prominent players of the global Thin Wafers Temporary Bonding Equipment and Materials market are broadly studied on the basis of key factors. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on price and revenue (global level) by player for the period 2015-2020.
The key players covered in this study
3M
ABB
Accretech
AGC
AMD
Cabot
Corning
Crystal Solar
Dalsa
DoubleCheck Semiconductors
1366 Technologies
Ebara
ERS
Hamamatsu
IBM
Intel
LG Innotek
Mitsubishi Electric
Qualcomm
Robert Bosch
Samsung
1 Report Overview
- 1.1 Study Scope
- 1.2 Market Analysis by Type
- 1.2.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Type: 2020 VS 2026
- 1.2.2 Chemical Debonding
- 1.2.3 Hot Sliding Debonding
- 1.2.4 Mechanical Debonding
- 1.2.5 Laser Debonding
- 1.3 Market by Application
- 1.3.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Application: 2020 VS 2026
- 1.3.2 < 100 µm Wafers
- 1.3.3 below 40µm Wafers
- 1.4 Study Objectives
- 1.5 Years Considered
2 Global Growth Trends
- 2.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Perspective (2015-2026)
- 2.2 Global Thin Wafers Temporary Bonding Equipment and Materials Growth Trends by Regions
- 2.2.1 Thin Wafers Temporary Bonding Equipment and Materials Market Size by Regions: 2015 VS 2020 VS 2026
- 2.2.2 Thin Wafers Temporary Bonding Equipment and Materials Historic Market Share by Regions (2015-2020)
- 2.2.3 Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Regions (2021-2026)
- 2.3 Industry Trends and Growth Strategy
- 2.3.1 Market Trends
- 2.3.2 Market Drivers
- 2.3.3 Market Challenges
- 2.3.4 Market Restraints
3 Competition Landscape by Key Players
- 3.1 Global Top Thin Wafers Temporary Bonding Equipment and Materials Players by Market Size
- 3.1.1 Global Top Thin Wafers Temporary Bonding Equipment and Materials Players by Revenue (2015-2020)
- 3.1.2 Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Players (2015-2020)
- 3.2 Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
- 3.3 Players Covered: Ranking by Thin Wafers Temporary Bonding Equipment and Materials Revenue
- 3.4 Global Thin Wafers Temporary Bonding Equipment and Materials Market Concentration Ratio
- 3.4.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Concentration Ratio (CR5 and HHI)
- 3.4.2 Global Top 10 and Top 5 Companies by Thin Wafers Temporary Bonding Equipment and Materials Revenue in 2019
- 3.5 Key Players Thin Wafers Temporary Bonding Equipment and Materials Area Served
- 3.6 Key Players Thin Wafers Temporary Bonding Equipment and Materials Product Solution and Service
- 3.7 Date of Enter into Thin Wafers Temporary Bonding Equipment and Materials Market
- 3.8 Mergers & Acquisitions, Expansion Plans
4 Thin Wafers Temporary Bonding Equipment and Materials Breakdown Data by Type (2015-2026)
- 4.1 Global Thin Wafers Temporary Bonding Equipment and Materials Historic Market Size by Type (2015-2020)
- 4.2 Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Type (2021-2026)
5 Thin Wafers Temporary Bonding Equipment and Materials Breakdown Data by Application (2015-2026)
- 5.1 Global Thin Wafers Temporary Bonding Equipment and Materials Historic Market Size by Application (2015-2020)
- 5.2 Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Application (2021-2026)
6 North America
- 6.1 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size (2015-2026)
- 6.2 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2015-2020)
- 6.3 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2015-2020)
- 6.4 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2015-2020)
- 6.4.1 United States
- 6.4.2 Canada
7 Europe
- 7.1 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size (2015-2026)
- 7.2 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2015-2020)
- 7.3 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2015-2020)
- 7.4 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2015-2020)
- 7.4.1 Germany
- 7.4.2 France
- 7.4.3 U.K.
- 7.4.4 Italy
- 7.4.5 Russia
- 7.4.6 Nordic
- 7.4.7 Rest of Europe
8 China
- 8.1 China Thin Wafers Temporary Bonding Equipment and Materials Market Size (2015-2026)
- 8.2 China Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2015-2020)
- 8.3 China Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2015-2020)
- 8.4 China Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region (2015-2020)
- 8.4.1 China
- 8.4.2 Japan
- 8.4.3 South Korea
- 8.4.4 Southeast Asia
- 8.4.5 India
- 8.4.6 Australia
- 8.4.7 Rest of Asia-Pacific
9 Japan
- 9.1 Japan Thin Wafers Temporary Bonding Equipment and Materials Market Size (2015-2026)
- 9.2 Japan Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2015-2020)
- 9.3 Japan Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2015-2020)
- 9.4 Japan Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2015-2020)
- 9.4.1 Mexico
- 9.4.2 Brazil
10 Southeast Asia
- 10.1 Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Market Size (2015-2026)
- 10.2 Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2015-2020)
- 10.3 Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2015-2020)
- 10.4 Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2015-2020)
- 10.4.1 Turkey
- 10.4.2 Saudi Arabia
- 10.4.3 UAE
- 10.4.4 Rest of Middle East & Africa
11Key Players Profiles
- 11.1 3M
- 11.1.1 3M Company Details
- 11.1.2 3M Business Overview
- 11.1.3 3M Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 11.1.4 3M Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020))
- 11.1.5 3M Recent Development
- 11.2 ABB
- 11.2.1 ABB Company Details
- 11.2.2 ABB Business Overview
- 11.2.3 ABB Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 11.2.4 ABB Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 11.2.5 ABB Recent Development
- 11.3 Accretech
- 11.3.1 Accretech Company Details
- 11.3.2 Accretech Business Overview
- 11.3.3 Accretech Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 11.3.4 Accretech Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 11.3.5 Accretech Recent Development
- 11.4 AGC
- 11.4.1 AGC Company Details
- 11.4.2 AGC Business Overview
- 11.4.3 AGC Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 11.4.4 AGC Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 11.4.5 AGC Recent Development
- 11.5 AMD
- 11.5.1 AMD Company Details
- 11.5.2 AMD Business Overview
- 11.5.3 AMD Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 11.5.4 AMD Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 11.5.5 AMD Recent Development
- 11.6 Cabot
- 11.6.1 Cabot Company Details
- 11.6.2 Cabot Business Overview
- 11.6.3 Cabot Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 11.6.4 Cabot Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 11.6.5 Cabot Recent Development
- 11.7 Corning
- 11.7.1 Corning Company Details
- 11.7.2 Corning Business Overview
- 11.7.3 Corning Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 11.7.4 Corning Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 11.7.5 Corning Recent Development
- 11.8 Crystal Solar
- 11.8.1 Crystal Solar Company Details
- 11.8.2 Crystal Solar Business Overview
- 11.8.3 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 11.8.4 Crystal Solar Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 11.8.5 Crystal Solar Recent Development
- 11.9 Dalsa
- 11.9.1 Dalsa Company Details
- 11.9.2 Dalsa Business Overview
- 11.9.3 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 11.9.4 Dalsa Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 11.9.5 Dalsa Recent Development
- 11.10 DoubleCheck Semiconductors
- 11.10.1 DoubleCheck Semiconductors Company Details
- 11.10.2 DoubleCheck Semiconductors Business Overview
- 11.10.3 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 11.10.4 DoubleCheck Semiconductors Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 11.10.5 DoubleCheck Semiconductors Recent Development
- 11.11 1366 Technologies
- 10.11.1 1366 Technologies Company Details
- 10.11.2 1366 Technologies Business Overview
- 10.11.3 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.11.4 1366 Technologies Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.11.5 1366 Technologies Recent Development
- 11.12 Ebara
- 10.12.1 Ebara Company Details
- 10.12.2 Ebara Business Overview
- 10.12.3 Ebara Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.12.4 Ebara Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.12.5 Ebara Recent Development
- 11.13 ERS
- 10.13.1 ERS Company Details
- 10.13.2 ERS Business Overview
- 10.13.3 ERS Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.13.4 ERS Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.13.5 ERS Recent Development
- 11.14 Hamamatsu
- 10.14.1 Hamamatsu Company Details
- 10.14.2 Hamamatsu Business Overview
- 10.14.3 Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.14.4 Hamamatsu Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.14.5 Hamamatsu Recent Development
- 11.15 IBM
- 10.15.1 IBM Company Details
- 10.15.2 IBM Business Overview
- 10.15.3 IBM Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.15.4 IBM Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.15.5 IBM Recent Development
- 11.16 Intel
- 10.16.1 Intel Company Details
- 10.16.2 Intel Business Overview
- 10.16.3 Intel Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.16.4 Intel Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.16.5 Intel Recent Development
- 11.17 LG Innotek
- 10.17.1 LG Innotek Company Details
- 10.17.2 LG Innotek Business Overview
- 10.17.3 LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.17.4 LG Innotek Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.17.5 LG Innotek Recent Development
- 11.18 Mitsubishi Electric
- 10.18.1 Mitsubishi Electric Company Details
- 10.18.2 Mitsubishi Electric Business Overview
- 10.18.3 Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.18.4 Mitsubishi Electric Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.18.5 Mitsubishi Electric Recent Development
- 11.19 Qualcomm
- 10.19.1 Qualcomm Company Details
- 10.19.2 Qualcomm Business Overview
- 10.19.3 Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.19.4 Qualcomm Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.19.5 Qualcomm Recent Development
- 11.20 Robert Bosch
- 10.20.1 Robert Bosch Company Details
- 10.20.2 Robert Bosch Business Overview
- 10.20.3 Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.20.4 Robert Bosch Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.20.5 Robert Bosch Recent Development
- 11.21 Samsung
- 10.21.1 Samsung Company Details
- 10.21.2 Samsung Business Overview
- 10.21.3 Samsung Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.21.4 Samsung Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.21.5 Samsung Recent Development
- 11.22 Sumitomo Chemical
- 10.22.1 Sumitomo Chemical Company Details
- 10.22.2 Sumitomo Chemical Business Overview
- 10.22.3 Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Introduction
- 10.22.4 Sumitomo Chemical Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2015-2020)
- 10.22.5 Sumitomo Chemical Recent Development
12Analyst's Viewpoints/Conclusions
13Appendix
- 13.1 Research Methodology
- 13.1.1 Methodology/Research Approach
- 13.1.2 Data Source
- 13.2 Disclaimer
Summary:
Get latest Market Research Reports on Thin Wafers Temporary Bonding Equipment and Materials. Industry analysis & Market Report on Thin Wafers Temporary Bonding Equipment and Materials is a syndicated market report, published as Global Thin Wafers Temporary Bonding Equipment and Materials Market Size, Status and Forecast 2020-2026. It is complete Research Study and Industry Analysis of Thin Wafers Temporary Bonding Equipment and Materials market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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