Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.
Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global Thermo Compression Bonder market is driven by increased Thermo Compression Bonder usage: memory applications currently, logic devices next. Meanwhile, Thermo Compression Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.
China Thermo Compression Bonder market is valued at $6.39 million in 2017 and is expected to reach $19.53 million by the end of 2023, growing at a CAGR of 20.47% between 2018 and 2023.
According to this study, over the next five years the Thermo Compression Bonder market will register a 24.8% CAGR in terms of revenue, the global market size will reach US$ 120 million by 2024, from US$ 33 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Thermo Compression Bonder business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Thermo Compression Bonder market by product type, application, key manufacturers and key regions and countries.
This study considers the Thermo Compression Bonder value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Automatic Thermo Compression Bonder
Manual Thermo Compression Bonder
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
IDMs
OSAT
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
ASMPT (AMICRA)
K&S
Besi
Shibaura
SET
Hanmi
...
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Thermo Compression Bonder consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Thermo Compression Bonder market by identifying its various subsegments.
Focuses on the key global Thermo Compression Bonder manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Thermo Compression Bonder with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Thermo Compression Bonder submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Summary:
Get latest Market Research Reports on Thermo Compression Bonder. Industry analysis & Market Report on Thermo Compression Bonder is a syndicated market report, published as Global Thermo Compression Bonder Market Growth 2019-2024. It is complete Research Study and Industry Analysis of Thermo Compression Bonder market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.