Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.
Scope of the Report:
Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global Thermo Compression Bonder market is driven by increased Thermo Compression Bonder usage: memory applications currently, logic devices next. Meanwhile, Thermo Compression Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.
China Thermo Compression Bonder market is valued at $6.39 million in 2017 and is expected to reach $19.53 million by the end of 2023, growing at a CAGR of 20.47% between 2018 and 2023.
The worldwide market for Thermo Compression Bonder is expected to grow at a CAGR of roughly 24.8% over the next five years, will reach 120 million US$ in 2024, from 33 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Thermo Compression Bonder in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
ASMPT (AMICRA)
K&S
Besi
Shibaura
SET
Hanmi
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Automatic Thermo Compression Bonder
Manual Thermo Compression Bonder
Market Segment by Applications, can be divided into
IDMs
OSAT
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thermo Compression Bonder product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Thermo Compression Bonder, with price, sales, revenue and global market share of Thermo Compression Bonder in 2017 and 2018.
Chapter 3, the Thermo Compression Bonder competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thermo Compression Bonder breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Thermo Compression Bonder market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Thermo Compression Bonder sales channel, distributors, customers, research findings and conclusion, appendix and data source.
Summary:
Get latest Market Research Reports on Thermo Compression Bonder . Industry analysis & Market Report on Thermo Compression Bonder is a syndicated market report, published as Global Thermo Compression Bonder Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024. It is complete Research Study and Industry Analysis of Thermo Compression Bonder market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.