A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Scope of the Report:
The worldwide market for Thermal Interface Materials For Electronics Cooling is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2024, from xx million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Thermal Interface Materials For Electronics Cooling in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
DowDuPont
Shin-Etsu
Btech
Laird Performance Materials
Henkel
Honeywell
Laird Technologies
3M
SEMIKRON
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Greases
Elastomeric Pads
Thermal Tapes
Phase Change Materials
Other
Market Segment by Applications, can be divided into
Electronics
Power Devices
Others
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thermal Interface Materials For Electronics Cooling product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Thermal Interface Materials For Electronics Cooling, with price, sales, revenue and global market share of Thermal Interface Materials For Electronics Cooling in 2017 and 2018.
Chapter 3, the Thermal Interface Materials For Electronics Cooling competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thermal Interface Materials For Electronics Cooling breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Thermal Interface Materials For Electronics Cooling market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Thermal Interface Materials For Electronics Cooling sales channel, distributors, customers, research findings and conclusion, appendix and data source.
Summary:
Get latest Market Research Reports on Thermal Interface Materials For Electronics Cooling . Industry analysis & Market Report on Thermal Interface Materials For Electronics Cooling is a syndicated market report, published as Global Thermal Interface Materials For Electronics Cooling Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024. It is complete Research Study and Industry Analysis of Thermal Interface Materials For Electronics Cooling market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.