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Machinery & Equipment Global Temporary Wafer Debonding System Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

  • RnM4508071
    • |
  • 04 February, 2023
    • |
  • Global
    • |
  • 94 Pages
    • |
  • GIR (Global Info Research)
    • |
  • Machinery & Equipment

Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner and wafer diameter increases, thinning/handling procedures are required. This implies development in wafer thinning, wafer dicing and wafer temporary bonding. Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the “Magic” material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times.
According to our (Global Info Research) latest study, the global Temporary Wafer Debonding System market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
This report is a detailed and comprehensive analysis for global Temporary Wafer Debonding System market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Temporary Wafer Debonding System market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Temporary Wafer Debonding System market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Temporary Wafer Debonding System market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Temporary Wafer Debonding System market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Temporary Wafer Debonding System
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Temporary Wafer Debonding System market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include EV Group, SUSS MicroTec, Tokyo Electron, Cost Effective Equipment and Micro Materials, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Temporary Wafer Debonding System market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Chemical Debonding
Hot Sliding Debonding
Mechanical Debonding
Laser Debonding
Market segment by Application
MEMS
Advanced Packaging
CMOS
Others
Major players covered
EV Group
SUSS MicroTec
Tokyo Electron
Cost Effective Equipment
Micro Materials
Dynatech
ERS electronic GmbH
Brewer Science
Kingyoup Enterprises
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Temporary Wafer Debonding System product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Temporary Wafer Debonding System, with price, sales, revenue and global market share of Temporary Wafer Debonding System from 2018 to 2023.
Chapter 3, the Temporary Wafer Debonding System competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Temporary Wafer Debonding System breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Temporary Wafer Debonding System market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Temporary Wafer Debonding System.
Chapter 14 and 15, to describe Temporary Wafer Debonding System sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope of Temporary Wafer Debonding System
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Temporary Wafer Debonding System Consumption Value by Type: 2018 Versus 2022 Versus 2029
    • 1.3.2 Chemical Debonding
    • 1.3.3 Hot Sliding Debonding
    • 1.3.4 Mechanical Debonding
    • 1.3.5 Laser Debonding
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Temporary Wafer Debonding System Consumption Value by Application: 2018 Versus 2022 Versus 2029
    • 1.4.2 MEMS
    • 1.4.3 Advanced Packaging
    • 1.4.4 CMOS
    • 1.4.5 Others
  • 1.5 Global Temporary Wafer Debonding System Market Size & Forecast
    • 1.5.1 Global Temporary Wafer Debonding System Consumption Value (2018 & 2022 & 2029)
    • 1.5.2 Global Temporary Wafer Debonding System Sales Quantity (2018-2029)
    • 1.5.3 Global Temporary Wafer Debonding System Average Price (2018-2029)

2 Manufacturers Profiles

  • 2.1 EV Group
    • 2.1.1 EV Group Details
    • 2.1.2 EV Group Major Business
    • 2.1.3 EV Group Temporary Wafer Debonding System Product and Services
    • 2.1.4 EV Group Temporary Wafer Debonding System Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.1.5 EV Group Recent Developments/Updates
  • 2.2 SUSS MicroTec
    • 2.2.1 SUSS MicroTec Details
    • 2.2.2 SUSS MicroTec Major Business
    • 2.2.3 SUSS MicroTec Temporary Wafer Debonding System Product and Services
    • 2.2.4 SUSS MicroTec Temporary Wafer Debonding System Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.2.5 SUSS MicroTec Recent Developments/Updates
  • 2.3 Tokyo Electron
    • 2.3.1 Tokyo Electron Details
    • 2.3.2 Tokyo Electron Major Business
    • 2.3.3 Tokyo Electron Temporary Wafer Debonding System Product and Services
    • 2.3.4 Tokyo Electron Temporary Wafer Debonding System Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.3.5 Tokyo Electron Recent Developments/Updates
  • 2.4 Cost Effective Equipment
    • 2.4.1 Cost Effective Equipment Details
    • 2.4.2 Cost Effective Equipment Major Business
    • 2.4.3 Cost Effective Equipment Temporary Wafer Debonding System Product and Services
    • 2.4.4 Cost Effective Equipment Temporary Wafer Debonding System Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.4.5 Cost Effective Equipment Recent Developments/Updates
  • 2.5 Micro Materials
    • 2.5.1 Micro Materials Details
    • 2.5.2 Micro Materials Major Business
    • 2.5.3 Micro Materials Temporary Wafer Debonding System Product and Services
    • 2.5.4 Micro Materials Temporary Wafer Debonding System Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.5.5 Micro Materials Recent Developments/Updates
  • 2.6 Dynatech
    • 2.6.1 Dynatech Details
    • 2.6.2 Dynatech Major Business
    • 2.6.3 Dynatech Temporary Wafer Debonding System Product and Services
    • 2.6.4 Dynatech Temporary Wafer Debonding System Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.6.5 Dynatech Recent Developments/Updates
  • 2.7 ERS electronic GmbH
    • 2.7.1 ERS electronic GmbH Details
    • 2.7.2 ERS electronic GmbH Major Business
    • 2.7.3 ERS electronic GmbH Temporary Wafer Debonding System Product and Services
    • 2.7.4 ERS electronic GmbH Temporary Wafer Debonding System Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.7.5 ERS electronic GmbH Recent Developments/Updates
  • 2.8 Brewer Science
    • 2.8.1 Brewer Science Details
    • 2.8.2 Brewer Science Major Business
    • 2.8.3 Brewer Science Temporary Wafer Debonding System Product and Services
    • 2.8.4 Brewer Science Temporary Wafer Debonding System Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.8.5 Brewer Science Recent Developments/Updates
  • 2.9 Kingyoup Enterprises
    • 2.9.1 Kingyoup Enterprises Details
    • 2.9.2 Kingyoup Enterprises Major Business
    • 2.9.3 Kingyoup Enterprises Temporary Wafer Debonding System Product and Services
    • 2.9.4 Kingyoup Enterprises Temporary Wafer Debonding System Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.9.5 Kingyoup Enterprises Recent Developments/Updates

3 Competitive Environment: Temporary Wafer Debonding System by Manufacturer

  • 3.1 Global Temporary Wafer Debonding System Sales Quantity by Manufacturer (2018-2023)
  • 3.2 Global Temporary Wafer Debonding System Revenue by Manufacturer (2018-2023)
  • 3.3 Global Temporary Wafer Debonding System Average Price by Manufacturer (2018-2023)
  • 3.4 Market Share Analysis (2022)
    • 3.4.1 Producer Shipments of Temporary Wafer Debonding System by Manufacturer Revenue ($MM) and Market Share (%): 2022
    • 3.4.2 Top 3 Temporary Wafer Debonding System Manufacturer Market Share in 2022
    • 3.4.2 Top 6 Temporary Wafer Debonding System Manufacturer Market Share in 2022
  • 3.5 Temporary Wafer Debonding System Market: Overall Company Footprint Analysis
    • 3.5.1 Temporary Wafer Debonding System Market: Region Footprint
    • 3.5.2 Temporary Wafer Debonding System Market: Company Product Type Footprint
    • 3.5.3 Temporary Wafer Debonding System Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Temporary Wafer Debonding System Market Size by Region
    • 4.1.1 Global Temporary Wafer Debonding System Sales Quantity by Region (2018-2029)
    • 4.1.2 Global Temporary Wafer Debonding System Consumption Value by Region (2018-2029)
    • 4.1.3 Global Temporary Wafer Debonding System Average Price by Region (2018-2029)
  • 4.2 North America Temporary Wafer Debonding System Consumption Value (2018-2029)
  • 4.3 Europe Temporary Wafer Debonding System Consumption Value (2018-2029)
  • 4.4 Asia-Pacific Temporary Wafer Debonding System Consumption Value (2018-2029)
  • 4.5 South America Temporary Wafer Debonding System Consumption Value (2018-2029)
  • 4.6 Middle East and Africa Temporary Wafer Debonding System Consumption Value (2018-2029)

5 Market Segment by Type

  • 5.1 Global Temporary Wafer Debonding System Sales Quantity by Type (2018-2029)
  • 5.2 Global Temporary Wafer Debonding System Consumption Value by Type (2018-2029)
  • 5.3 Global Temporary Wafer Debonding System Average Price by Type (2018-2029)

6 Market Segment by Application

  • 6.1 Global Temporary Wafer Debonding System Sales Quantity by Application (2018-2029)
  • 6.2 Global Temporary Wafer Debonding System Consumption Value by Application (2018-2029)
  • 6.3 Global Temporary Wafer Debonding System Average Price by Application (2018-2029)

7 North America

  • 7.1 North America Temporary Wafer Debonding System Sales Quantity by Type (2018-2029)
  • 7.2 North America Temporary Wafer Debonding System Sales Quantity by Application (2018-2029)
  • 7.3 North America Temporary Wafer Debonding System Market Size by Country
    • 7.3.1 North America Temporary Wafer Debonding System Sales Quantity by Country (2018-2029)
    • 7.3.2 North America Temporary Wafer Debonding System Consumption Value by Country (2018-2029)
    • 7.3.3 United States Market Size and Forecast (2018-2029)
    • 7.3.4 Canada Market Size and Forecast (2018-2029)
    • 7.3.5 Mexico Market Size and Forecast (2018-2029)

8 Europe

  • 8.1 Europe Temporary Wafer Debonding System Sales Quantity by Type (2018-2029)
  • 8.2 Europe Temporary Wafer Debonding System Sales Quantity by Application (2018-2029)
  • 8.3 Europe Temporary Wafer Debonding System Market Size by Country
    • 8.3.1 Europe Temporary Wafer Debonding System Sales Quantity by Country (2018-2029)
    • 8.3.2 Europe Temporary Wafer Debonding System Consumption Value by Country (2018-2029)
    • 8.3.3 Germany Market Size and Forecast (2018-2029)
    • 8.3.4 France Market Size and Forecast (2018-2029)
    • 8.3.5 United Kingdom Market Size and Forecast (2018-2029)
    • 8.3.6 Russia Market Size and Forecast (2018-2029)
    • 8.3.7 Italy Market Size and Forecast (2018-2029)

9 Asia-Pacific

  • 9.1 Asia-Pacific Temporary Wafer Debonding System Sales Quantity by Type (2018-2029)
  • 9.2 Asia-Pacific Temporary Wafer Debonding System Sales Quantity by Application (2018-2029)
  • 9.3 Asia-Pacific Temporary Wafer Debonding System Market Size by Region
    • 9.3.1 Asia-Pacific Temporary Wafer Debonding System Sales Quantity by Region (2018-2029)
    • 9.3.2 Asia-Pacific Temporary Wafer Debonding System Consumption Value by Region (2018-2029)
    • 9.3.3 China Market Size and Forecast (2018-2029)
    • 9.3.4 Japan Market Size and Forecast (2018-2029)
    • 9.3.5 Korea Market Size and Forecast (2018-2029)
    • 9.3.6 India Market Size and Forecast (2018-2029)
    • 9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
    • 9.3.8 Australia Market Size and Forecast (2018-2029)

10 South America

  • 10.1 South America Temporary Wafer Debonding System Sales Quantity by Type (2018-2029)
  • 10.2 South America Temporary Wafer Debonding System Sales Quantity by Application (2018-2029)
  • 10.3 South America Temporary Wafer Debonding System Market Size by Country
    • 10.3.1 South America Temporary Wafer Debonding System Sales Quantity by Country (2018-2029)
    • 10.3.2 South America Temporary Wafer Debonding System Consumption Value by Country (2018-2029)
    • 10.3.3 Brazil Market Size and Forecast (2018-2029)
    • 10.3.4 Argentina Market Size and Forecast (2018-2029)

11 Middle East & Africa

  • 11.1 Middle East & Africa Temporary Wafer Debonding System Sales Quantity by Type (2018-2029)
  • 11.2 Middle East & Africa Temporary Wafer Debonding System Sales Quantity by Application (2018-2029)
  • 11.3 Middle East & Africa Temporary Wafer Debonding System Market Size by Country
    • 11.3.1 Middle East & Africa Temporary Wafer Debonding System Sales Quantity by Country (2018-2029)
    • 11.3.2 Middle East & Africa Temporary Wafer Debonding System Consumption Value by Country (2018-2029)
    • 11.3.3 Turkey Market Size and Forecast (2018-2029)
    • 11.3.4 Egypt Market Size and Forecast (2018-2029)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
    • 11.3.6 South Africa Market Size and Forecast (2018-2029)

12 Market Dynamics

  • 12.1 Temporary Wafer Debonding System Market Drivers
  • 12.2 Temporary Wafer Debonding System Market Restraints
  • 12.3 Temporary Wafer Debonding System Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry
  • 12.5 Influence of COVID-19 and Russia-Ukraine War
    • 12.5.1 Influence of COVID-19
    • 12.5.2 Influence of Russia-Ukraine War

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Temporary Wafer Debonding System and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Temporary Wafer Debonding System
  • 13.3 Temporary Wafer Debonding System Production Process
  • 13.4 Temporary Wafer Debonding System Industrial Chain

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Temporary Wafer Debonding System Typical Distributors
  • 14.3 Temporary Wafer Debonding System Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Temporary Wafer Debonding System. Industry analysis & Market Report on Temporary Wafer Debonding System is a syndicated market report, published as Global Temporary Wafer Debonding System Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029. It is complete Research Study and Industry Analysis of Temporary Wafer Debonding System market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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