Solder paste is a suspension of solder particles in a solder flux, which is widely used in the electronic assembly materials.
Scope of the Report:
Currently China has become international solder paste large consumption country, but the production technology is relatively laggard, the manufacturers can only produce some low-end product, although after 2010 the new production lines is expanding, the technology is still relying on import.
The solder paste is mainly used in printed circuit board, integrated circuit package, which widely used in the electronics industry. As the electronics industry develops, there is a growing demand to increase the package density of components on a substrate. Along with this, performance and quality requirements for solder pastes have become more demanding.
Solder Paste industry is a low concentration industry. As electronic foundry industry transfer to China mainland, many new entrants enter into this industry, and small enterprises accounted for a large part of the market.
The worldwide market for Solder Paste is expected to grow at a CAGR of roughly -6.7% over the next five years, will reach 370 million US$ in 2024, from 570 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Solder Paste in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
Senju
Alent (Alpha)
Tamura
Henkel
Indium
Kester (ITW)
Shengmao
Inventec
KOKI
AIM
Nihon Superior
KAWADA
Yashida
Tongfang Tech
Shenzhen Bright
Yong An
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Rosin Based Pastes
Water Soluble pastes
No-clean pastes
Market Segment by Applications, can be divided into
SMT Assembly
Semiconductor Packaging
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Solder Paste product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Solder Paste, with price, sales, revenue and global market share of Solder Paste in 2017 and 2018.
Chapter 3, the Solder Paste competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Solder Paste breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Solder Paste market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Solder Paste sales channel, distributors, customers, research findings and conclusion, appendix and data source.
Summary:
Get latest Market Research Reports on Solder Paste. Industry analysis & Market Report on Solder Paste is a syndicated market report, published as Global Solder Paste Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024. It is complete Research Study and Industry Analysis of Solder Paste market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.