This report studies the Solder Paste Inspection (SPI) System market, Solder Paste Inspection is mainly done to check the solder paste deposits in the Printed Circuit Board (PCB) manufacturing process. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of solder paste inspection (SPI), you can reduce the defects related to soldering by a considerable amount.
Importance of Solder Paste Inspection Process
Here are some of the key points of information, which prove the importance of SPI process:
Improves PCB Quality & Performance: This process makes use of advanced equipment for precise inspection. Angle cameras are used to take 3D pictures, which are very helpful in measuring the alignment and volume of the solder paste. This helps improve the yield, as well as the print quality. Furthermore, it helps improve the performance of the PCBs.
Advanced Equipment for Better Control & Monitoring: As said earlier, angle cameras are used, which produce clear 3D pictures. Unlike the traditional cameras, 3D cameras are capable of capturing the height of the solder paste printed. This facilitates precise measurement of the solder paste volume. Thus, with the help of SPI coupled with automated optical inspection, manufacturers can easily monitor and control the component placement and solder paste printing processes.
Helps Reduce Solder Errors: Important information about the printing process can be obtained by doing the solder paste inspection. It gives a clear idea about the causes of defects, thus allowing you to make the necessary changes and reduce the errors to a minimum.
Numerous studies have been performed over the last few years proving that up to 70% of all SMD solder joint issues, can be traced back to the solder paste printing process. These printing errors may be caused by incorrect printer setup, stencil damage, stencil design or type, solder paste type, solder paste conditions or a collection of several issues.
The global Solder Paste Inspection (SPI) System market concentration rate is high and dominated by several players from Korea, Taiwan, Japan, United States and Germany; Koh Young, MirTec Ltd, PARMI Corp and Pemtron are from Korea; Test Research, Inc (TRI) and Jet Technology from Taiwan; CyberOptics Corporation, Machine Vision Products (MVP), Caltex Scientific and ASC International from United States; and Viscom AG and Vi TECHNOLOGY from Europe. In 2017, Koh Young and Test Research, Inc (TRI) occupied more than 60 percent of global market.
Currently, In-line SPI systems are dominating the market, due to the superior performance and the market demand. The SPI system market is mainly driven by the demand from Automotive and Consumer Electronics; other end market like communications, aerospace and medical fields will play more and more role in future.
According to this study, over the next five years the Solder Paste Inspection (SPI) System market will register a 2.6% CAGR in terms of revenue, the global market size will reach US$ 270 million by 2024, from US$ 240 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Solder Paste Inspection (SPI) System business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Solder Paste Inspection (SPI) System market by product type, application, key manufacturers and key regions and countries.
This study considers the Solder Paste Inspection (SPI) System value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
In-line SPI System
Off-line SPI System
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Automotive Electronics
Consumer Electronics
Industrials
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Koh Young (Korea)
CyberOptics Corporation
Test Research, Inc (TRI) (Taiwan)
MirTec Ltd (Korea)
PARMI Corp (Korea)
Viscom AG (Germany)
ViTrox (Malaysia)
Vi TECHNOLOGY (France)
Mek (Marantz Electronics) (Japan)
CKD Corporation (Japan)
Pemtron (Korea)
SAKI Corporation (Japan)
Machine Vision Products (MVP) (US)
Caltex Scientific (US)
ASC International (US)
Sinic-Tek Vision Technology (China)
Shenzhen JT Automation Equipment (China)
Jet Technology (Taiwan)
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Solder Paste Inspection (SPI) System consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Solder Paste Inspection (SPI) System market by identifying its various subsegments.
Focuses on the key global Solder Paste Inspection (SPI) System manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Solder Paste Inspection (SPI) System with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Solder Paste Inspection (SPI) System submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Summary:
Get latest Market Research Reports on Solder Paste Inspection (SPI) System . Industry analysis & Market Report on Solder Paste Inspection (SPI) System is a syndicated market report, published as Global Solder Paste Inspection (SPI) System Market Growth 2019-2024. It is complete Research Study and Industry Analysis of Solder Paste Inspection (SPI) System market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.