Report Detail
Global and Japan Solder Bumps Market Insights, Forecast to 2026
- RnM4204279 |
- 14 September, 2020 |
- Global |
- 127 Pages |
- QYResearch |
- Chemical & Material
Solder Bumps market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Solder Bumps market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2015-2026.
Segment by Type, the Solder Bumps market is segmented into
Lead Solder Bumps
Lead Free Solder Bumps
Segment by Application, the Solder Bumps market is segmented into
BGA
CSP & WLCSP
Flip-Chip & Others
Regional and Country-level Analysis
The Solder Bumps market is analysed and market size information is provided by regions (countries).
The key regions covered in the Solder Bumps market report are North America, Europe, Asia Pacific, Latin America, Middle East and Africa. It also covers key regions (countries), viz, U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.
The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of sales and revenue for the period 2015-2026.
Competitive Landscape and Solder Bumps Market Share Analysis
Solder Bumps market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue and the sales, revenue generated in Solder Bumps business, the date to enter into the Solder Bumps market, Solder Bumps product introduction, recent developments, etc.
The major vendors covered:
Senju Metal (Japan)
DS HiMetal (Korea)
MKE (Korea)
YCTC (Taiwan)
Nippon Micrometal (Japan)
Accurus (Taiwan)
PMTC (Taiwan)
Shanghai hiking solder material (China)
Shenmao Technology (Taiwan)
1 Study Coverage
- 1.1 Solder Bumps Product Introduction
- 1.2 Market Segments
- 1.3 Key Solder Bumps Manufacturers Covered: Ranking by Revenue
- 1.4 Market by Type
- 1.4.1 Global Solder Bumps Market Size Growth Rate by Type
- 1.4.2 Lead Solder Bumps
- 1.4.3 Lead Free Solder Bumps
- 1.5 Market by Application
- 1.5.1 Global Solder Bumps Market Size Growth Rate by Application
- 1.5.2 BGA
- 1.5.3 CSP & WLCSP
- 1.5.4 Flip-Chip & Others
- 1.6 Study Objectives
- 1.7 Years Considered
2 Executive Summary
- 2.1 Global Solder Bumps Market Size, Estimates and Forecasts
- 2.1.1 Global Solder Bumps Revenue 2015-2026
- 2.1.2 Global Solder Bumps Sales 2015-2026
- 2.2 Global Solder Bumps, Market Size by Producing Regions: 2015 VS 2020 VS 2026
- 2.3 Solder Bumps Historical Market Size by Region (2015-2020)
- 2.3.1 Global Solder Bumps Retrospective Market Scenario in Sales by Region: 2015-2020
- 2.3.2 Global Solder Bumps Retrospective Market Scenario in Revenue by Region: 2015-2020
- 2.4 Solder Bumps Market Estimates and Projections by Region (2021-2026)
- 2.4.1 Global Solder Bumps Sales Forecast by Region (2021-2026)
- 2.4.2 Global Solder Bumps Revenue Forecast by Region (2021-2026)
3 Global Solder Bumps Competitor Landscape by Players
- 3.1 Global Top Solder Bumps Sales by Manufacturers
- 3.1.1 Global Solder Bumps Sales by Manufacturers (2015-2020)
- 3.1.2 Global Solder Bumps Sales Market Share by Manufacturers (2015-2020)
- 3.2 Global Solder Bumps Manufacturers by Revenue
- 3.2.1 Global Solder Bumps Revenue by Manufacturers (2015-2020)
- 3.2.2 Global Solder Bumps Revenue Share by Manufacturers (2015-2020)
- 3.2.3 Global Solder Bumps Market Concentration Ratio (CR5 and HHI) (2015-2020)
- 3.2.4 Global Top 10 and Top 5 Companies by Solder Bumps Revenue in 2019
- 3.2.5 Global Solder Bumps Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
- 3.3 Global Solder Bumps Price by Manufacturers
- 3.4 Global Solder Bumps Manufacturing Base Distribution, Product Types
- 3.4.1 Solder Bumps Manufacturers Manufacturing Base Distribution, Headquarters
- 3.4.2 Manufacturers Solder Bumps Product Type
- 3.4.3 Date of International Manufacturers Enter into Solder Bumps Market
- 3.5 Manufacturers Mergers & Acquisitions, Expansion Plans
4 Market Size by Type (2015-2026)
- 4.1 Global Solder Bumps Market Size by Type (2015-2020)
- 4.1.1 Global Solder Bumps Sales by Type (2015-2020)
- 4.1.2 Global Solder Bumps Revenue by Type (2015-2020)
- 4.1.3 Solder Bumps Average Selling Price (ASP) by Type (2015-2026)
- 4.2 Global Solder Bumps Market Size Forecast by Type (2021-2026)
- 4.2.1 Global Solder Bumps Sales Forecast by Type (2021-2026)
- 4.2.2 Global Solder Bumps Revenue Forecast by Type (2021-2026)
- 4.2.3 Solder Bumps Average Selling Price (ASP) Forecast by Type (2021-2026)
- 4.3 Global Solder Bumps Market Share by Price Tier (2015-2020): Low-End, Mid-Range and High-End
5 Market Size by Application (2015-2026)
- 5.1 Global Solder Bumps Market Size by Application (2015-2020)
- 5.1.1 Global Solder Bumps Sales by Application (2015-2020)
- 5.1.2 Global Solder Bumps Revenue by Application (2015-2020)
- 5.1.3 Solder Bumps Price by Application (2015-2020)
- 5.2 Solder Bumps Market Size Forecast by Application (2021-2026)
- 5.2.1 Global Solder Bumps Sales Forecast by Application (2021-2026)
- 5.2.2 Global Solder Bumps Revenue Forecast by Application (2021-2026)
- 5.2.3 Global Solder Bumps Price Forecast by Application (2021-2026)
6 Japan by Players, Type and Application
- 6.1 Japan Solder Bumps Market Size YoY Growth 2015-2026
- 6.1.1 Japan Solder Bumps Sales YoY Growth 2015-2026
- 6.1.2 Japan Solder Bumps Revenue YoY Growth 2015-2026
- 6.1.3 Japan Solder Bumps Market Share in Global Market 2015-2026
- 6.2 Japan Solder Bumps Market Size by Players (International and Local Players)
- 6.2.1 Japan Top Solder Bumps Players by Sales (2015-2020)
- 6.2.2 Japan Top Solder Bumps Players by Revenue (2015-2020)
- 6.3 Japan Solder Bumps Historic Market Review by Type (2015-2020)
- 6.3.1 Japan Solder Bumps Sales Market Share by Type (2015-2020)
- 6.3.2 Japan Solder Bumps Revenue Market Share by Type (2015-2020)
- 6.3.3 Japan Solder Bumps Price by Type (2015-2020)
- 6.4 Japan Solder Bumps Market Estimates and Forecasts by Type (2021-2026)
- 6.4.1 Japan Solder Bumps Sales Forecast by Type (2021-2026)
- 6.4.2 Japan Solder Bumps Revenue Forecast by Type (2021-2026)
- 6.4.3 Japan Solder Bumps Price Forecast by Type (2021-2026)
- 6.5 Japan Solder Bumps Historic Market Review by Application (2015-2020)
- 6.5.1 Japan Solder Bumps Sales Market Share by Application (2015-2020)
- 6.5.2 Japan Solder Bumps Revenue Market Share by Application (2015-2020)
- 6.5.3 Japan Solder Bumps Price by Application (2015-2020)
- 6.6 Japan Solder Bumps Market Estimates and Forecasts by Application (2021-2026)
- 6.6.1 Japan Solder Bumps Sales Forecast by Application (2021-2026)
- 6.6.2 Japan Solder Bumps Revenue Forecast by Application (2021-2026)
- 6.6.3 Japan Solder Bumps Price Forecast by Application (2021-2026)
7 North America
- 7.1 North America Solder Bumps Market Size YoY Growth 2015-2026
- 7.2 North America Solder Bumps Market Facts & Figures by Country
- 7.2.1 North America Solder Bumps Sales by Country (2015-2020)
- 7.2.2 North America Solder Bumps Revenue by Country (2015-2020)
- 7.2.3 U.S.
- 7.2.4 Canada
8 Europe
- 8.1 Europe Solder Bumps Market Size YoY Growth 2015-2026
- 8.2 Europe Solder Bumps Market Facts & Figures by Country
- 8.2.1 Europe Solder Bumps Sales by Country
- 8.2.2 Europe Solder Bumps Revenue by Country
- 8.2.3 Germany
- 8.2.4 France
- 8.2.5 U.K.
- 8.2.6 Italy
- 8.2.7 Russia
9 Asia Pacific
- 9.1 Asia Pacific Solder Bumps Market Size YoY Growth 2015-2026
- 9.2 Asia Pacific Solder Bumps Market Facts & Figures by Country
- 9.2.1 Asia Pacific Solder Bumps Sales by Region (2015-2020)
- 9.2.2 Asia Pacific Solder Bumps Revenue by Region
- 9.2.3 China
- 9.2.4 Japan
- 9.2.5 South Korea
- 9.2.6 India
- 9.2.7 Australia
- 9.2.8 Taiwan
- 9.2.9 Indonesia
- 9.2.10 Thailand
- 9.2.11 Malaysia
- 9.2.12 Philippines
- 9.2.13 Vietnam
10 Latin America
- 10.1 Latin America Solder Bumps Market Size YoY Growth 2015-2026
- 10.2 Latin America Solder Bumps Market Facts & Figures by Country
- 10.2.1 Latin America Solder Bumps Sales by Country
- 10.2.2 Latin America Solder Bumps Revenue by Country
- 10.2.3 Mexico
- 10.2.4 Brazil
- 10.2.5 Argentina
11 Middle East and Africa
- 11.1 Middle East and Africa Solder Bumps Market Size YoY Growth 2015-2026
- 11.2 Middle East and Africa Solder Bumps Market Facts & Figures by Country
- 11.2.1 Middle East and Africa Solder Bumps Sales by Country
- 11.2.2 Middle East and Africa Solder Bumps Revenue by Country
- 11.2.3 Turkey
- 11.2.4 Saudi Arabia
- 11.2.5 U.A.E
12 Company Profiles
- 12.1 Senju Metal (Japan)
- 12.1.1 Senju Metal (Japan) Corporation Information
- 12.1.2 Senju Metal (Japan) Description and Business Overview
- 12.1.3 Senju Metal (Japan) Sales, Revenue and Gross Margin (2015-2020)
- 12.1.4 Senju Metal (Japan) Solder Bumps Products Offered
- 12.1.5 Senju Metal (Japan) Recent Development
- 12.2 DS HiMetal (Korea)
- 12.2.1 DS HiMetal (Korea) Corporation Information
- 12.2.2 DS HiMetal (Korea) Description and Business Overview
- 12.2.3 DS HiMetal (Korea) Sales, Revenue and Gross Margin (2015-2020)
- 12.2.4 DS HiMetal (Korea) Solder Bumps Products Offered
- 12.2.5 DS HiMetal (Korea) Recent Development
- 12.3 MKE (Korea)
- 12.3.1 MKE (Korea) Corporation Information
- 12.3.2 MKE (Korea) Description and Business Overview
- 12.3.3 MKE (Korea) Sales, Revenue and Gross Margin (2015-2020)
- 12.3.4 MKE (Korea) Solder Bumps Products Offered
- 12.3.5 MKE (Korea) Recent Development
- 12.4 YCTC (Taiwan)
- 12.4.1 YCTC (Taiwan) Corporation Information
- 12.4.2 YCTC (Taiwan) Description and Business Overview
- 12.4.3 YCTC (Taiwan) Sales, Revenue and Gross Margin (2015-2020)
- 12.4.4 YCTC (Taiwan) Solder Bumps Products Offered
- 12.4.5 YCTC (Taiwan) Recent Development
- 12.5 Nippon Micrometal (Japan)
- 12.5.1 Nippon Micrometal (Japan) Corporation Information
- 12.5.2 Nippon Micrometal (Japan) Description and Business Overview
- 12.5.3 Nippon Micrometal (Japan) Sales, Revenue and Gross Margin (2015-2020)
- 12.5.4 Nippon Micrometal (Japan) Solder Bumps Products Offered
- 12.5.5 Nippon Micrometal (Japan) Recent Development
- 12.6 Accurus (Taiwan)
- 12.6.1 Accurus (Taiwan) Corporation Information
- 12.6.2 Accurus (Taiwan) Description and Business Overview
- 12.6.3 Accurus (Taiwan) Sales, Revenue and Gross Margin (2015-2020)
- 12.6.4 Accurus (Taiwan) Solder Bumps Products Offered
- 12.6.5 Accurus (Taiwan) Recent Development
- 12.7 PMTC (Taiwan)
- 12.7.1 PMTC (Taiwan) Corporation Information
- 12.7.2 PMTC (Taiwan) Description and Business Overview
- 12.7.3 PMTC (Taiwan) Sales, Revenue and Gross Margin (2015-2020)
- 12.7.4 PMTC (Taiwan) Solder Bumps Products Offered
- 12.7.5 PMTC (Taiwan) Recent Development
- 12.8 Shanghai hiking solder material (China)
- 12.8.1 Shanghai hiking solder material (China) Corporation Information
- 12.8.2 Shanghai hiking solder material (China) Description and Business Overview
- 12.8.3 Shanghai hiking solder material (China) Sales, Revenue and Gross Margin (2015-2020)
- 12.8.4 Shanghai hiking solder material (China) Solder Bumps Products Offered
- 12.8.5 Shanghai hiking solder material (China) Recent Development
- 12.9 Shenmao Technology (Taiwan)
- 12.9.1 Shenmao Technology (Taiwan) Corporation Information
- 12.9.2 Shenmao Technology (Taiwan) Description and Business Overview
- 12.9.3 Shenmao Technology (Taiwan) Sales, Revenue and Gross Margin (2015-2020)
- 12.9.4 Shenmao Technology (Taiwan) Solder Bumps Products Offered
- 12.9.5 Shenmao Technology (Taiwan) Recent Development
- 12.11 Senju Metal (Japan)
- 12.11.1 Senju Metal (Japan) Corporation Information
- 12.11.2 Senju Metal (Japan) Description and Business Overview
- 12.11.3 Senju Metal (Japan) Sales, Revenue and Gross Margin (2015-2020)
- 12.11.4 Senju Metal (Japan) Solder Bumps Products Offered
- 12.11.5 Senju Metal (Japan) Recent Development
13 Market Opportunities, Challenges, Risks and Influences Factors Analysis
- 13.1 Market Opportunities and Drivers
- 13.2 Market Challenges
- 13.3 Market Risks/Restraints
- 13.4 Porter’s Five Forces Analysis
- 13.5 Primary Interviews with Key Solder Bumps Players (Opinion Leaders)
14 Value Chain and Sales Channels Analysis
- 14.1 Value Chain Analysis
- 14.2 Solder Bumps Customers
- 14.3 Sales Channels Analysis
- 14.3.1 Sales Channels
- 14.3.2 Distributors
15 Research Findings and Conclusion
16 Appendix
- 16.1 Research Methodology
- 16.1.1 Methodology/Research Approach
- 16.1.2 Data Source
- 16.2 Author Details
Summary:
Get latest Market Research Reports on Solder Bumps. Industry analysis & Market Report on Solder Bumps is a syndicated market report, published as Global and Japan Solder Bumps Market Insights, Forecast to 2026. It is complete Research Study and Industry Analysis of Solder Bumps market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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