Report Detail
Global Solder Ball Market Insights, Forecast to 2025
- RnM3059731 |
- 05 March, 2019 |
- Global |
- 117 Pages |
- QYResearch |
- Other
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Asia Pacific held the leading share of the market in terms of revenue in 2016. We estimate that the global market share of Solder Ball is 27.66% in Taiwan, 20.54% in Korea, 17.28% in Japan, 15% in China and 10.56% in South East Asia. Because there are many larger IC packaging (including testing) companies in these region, such as ASE, Amkor, SPIL etc. Solder Ball are most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market in 2016. Senju Metal dominated with 40.00% revenue share, followed by DS HiMetal with 19.14% revenue share and MKE with 7.08% revenue share.
Global Solder Ball market size will increase to 350 Million US$ by 2025, from 210 Million US$ in 2018, at a CAGR of 6.4% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Solder Ball.
This report researches the worldwide Solder Ball market size (value, capacity, production and consumption) in key regions like United States, Europe, Asia Pacific (China, Japan) and other regions.
This study categorizes the global Solder Ball breakdown data by manufacturers, region, type and application, also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Solder Ball Breakdown Data by Type
Lead Solder Ball
Lead Free Solder Ball
Solder Ball Breakdown Data by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Solder Ball Production Breakdown Data by Region
United States
Europe
China
Japan
Other Regions
Solder Ball Consumption Breakdown Data by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global Solder Ball capacity, production, value, consumption, status and forecast;
To focus on the key Solder Ball manufacturers and study the capacity, production, value, market share and development plans in next few years.
To focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
To define, describe and forecast the market by type, application and region.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
In this study, the years considered to estimate the market size of Solder Ball :
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Table of Contents
Global Solder Ball Market Research Report 2019-2025, by Manufacturers, Regions, Types and Applications
1 Study Coverage
- 1.1 Solder Ball Product
- 1.2 Key Market Segments in This Study
- 1.3 Key Manufacturers Covered
- 1.4 Market by Type
- 1.4.1 Global Solder Ball Market Size Growth Rate by Type
- 1.4.2 Lead Solder Ball
- 1.4.3 Lead Free Solder Ball
- 1.5 Market by Application
- 1.5.1 Global Solder Ball Market Size Growth Rate by Application
- 1.5.2 BGA
- 1.5.3 CSP & WLCSP
- 1.5.4 Flip-Chip & Others
- 1.6 Study Objectives
- 1.7 Years Considered
2 Executive Summary
- 2.1 Global Solder Ball Production
- 2.1.1 Global Solder Ball Revenue 2014-2025
- 2.1.2 Global Solder Ball Production 2014-2025
- 2.1.3 Global Solder Ball Capacity 2014-2025
- 2.1.4 Global Solder Ball Marketing Pricing and Trends
- 2.2 Solder Ball Growth Rate (CAGR) 2019-2025
- 2.3 Analysis of Competitive Landscape
- 2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
- 2.3.2 Key Solder Ball Manufacturers
- 2.4 Market Drivers, Trends and Issues
- 2.5 Macroscopic Indicator
- 2.5.1 GDP for Major Regions
- 2.5.2 Price of Raw Materials in Dollars: Evolution
3 Market Size by Manufacturers
- 3.1 Solder Ball Production by Manufacturers
- 3.1.1 Solder Ball Production by Manufacturers
- 3.1.2 Solder Ball Production Market Share by Manufacturers
- 3.2 Solder Ball Revenue by Manufacturers
- 3.2.1 Solder Ball Revenue by Manufacturers (2014-2019)
- 3.2.2 Solder Ball Revenue Share by Manufacturers (2014-2019)
- 3.3 Solder Ball Price by Manufacturers
- 3.4 Mergers & Acquisitions, Expansion Plans
4 Solder Ball Production by Regions
- 4.1 Global Solder Ball Production by Regions
- 4.1.1 Global Solder Ball Production Market Share by Regions
- 4.1.2 Global Solder Ball Revenue Market Share by Regions
- 4.2 United States
- 4.2.1 United States Solder Ball Production
- 4.2.2 United States Solder Ball Revenue
- 4.2.3 Key Players in United States
- 4.2.4 United States Solder Ball Import & Export
- 4.3 Europe
- 4.3.1 Europe Solder Ball Production
- 4.3.2 Europe Solder Ball Revenue
- 4.3.3 Key Players in Europe
- 4.3.4 Europe Solder Ball Import & Export
- 4.4 China
- 4.4.1 China Solder Ball Production
- 4.4.2 China Solder Ball Revenue
- 4.4.3 Key Players in China
- 4.4.4 China Solder Ball Import & Export
- 4.5 Japan
- 4.5.1 Japan Solder Ball Production
- 4.5.2 Japan Solder Ball Revenue
- 4.5.3 Key Players in Japan
- 4.5.4 Japan Solder Ball Import & Export
- 4.6 Other Regions
- 4.6.1 South Korea
- 4.6.2 India
- 4.6.3 Southeast Asia
5 Solder Ball Consumption by Regions
- 5.1 Global Solder Ball Consumption by Regions
- 5.1.1 Global Solder Ball Consumption by Regions
- 5.1.2 Global Solder Ball Consumption Market Share by Regions
- 5.2 North America
- 5.2.1 North America Solder Ball Consumption by Application
- 5.2.2 North America Solder Ball Consumption by Countries
- 5.2.3 United States
- 5.2.4 Canada
- 5.2.5 Mexico
- 5.3 Europe
- 5.3.1 Europe Solder Ball Consumption by Application
- 5.3.2 Europe Solder Ball Consumption by Countries
- 5.3.3 Germany
- 5.3.4 France
- 5.3.5 UK
- 5.3.6 Italy
- 5.3.7 Russia
- 5.4 Asia Pacific
- 5.4.1 Asia Pacific Solder Ball Consumption by Application
- 5.4.2 Asia Pacific Solder Ball Consumption by Countries
- 5.4.3 China
- 5.4.4 Japan
- 5.4.5 South Korea
- 5.4.6 India
- 5.4.7 Australia
- 5.4.8 Indonesia
- 5.4.9 Thailand
- 5.4.10 Malaysia
- 5.4.11 Philippines
- 5.4.12 Vietnam
- 5.5 Central & South America
- 5.5.1 Central & South America Solder Ball Consumption by Application
- 5.5.2 Central & South America Solder Ball Consumption by Countries
- 5.5.3 Brazil
- 5.6 Middle East and Africa
- 5.6.1 Middle East and Africa Solder Ball Consumption by Application
- 5.6.2 Middle East and Africa Solder Ball Consumption by Countries
- 5.6.3 Turkey
- 5.6.4 GCC Countries
- 5.6.5 Egypt
- 5.6.6 South Africa
6 Market Size by Type
- 6.1 Global Solder Ball Breakdown Dada by Type
- 6.2 Global Solder Ball Revenue by Type
- 6.3 Solder Ball Price by Type
7 Market Size by Application
- 7.1 Overview
- 7.2 Global Solder Ball Breakdown Dada by Application
- 7.2.1 Global Solder Ball Consumption by Application
- 7.2.2 Global Solder Ball Consumption Market Share by Application (2014-2019)
8 Manufacturers Profiles
- 8.1 Senju Metal
- 8.1.1 Senju Metal Company Details
- 8.1.2 Company Description
- 8.1.3 Capacity, Production and Value of Solder Ball
- 8.1.4 Solder Ball Product Description
- 8.1.5 SWOT Analysis
- 8.2 DS HiMetal
- 8.2.1 DS HiMetal Company Details
- 8.2.2 Company Description
- 8.2.3 Capacity, Production and Value of Solder Ball
- 8.2.4 Solder Ball Product Description
- 8.2.5 SWOT Analysis
- 8.3 MKE
- 8.3.1 MKE Company Details
- 8.3.2 Company Description
- 8.3.3 Capacity, Production and Value of Solder Ball
- 8.3.4 Solder Ball Product Description
- 8.3.5 SWOT Analysis
- 8.4 YCTC
- 8.4.1 YCTC Company Details
- 8.4.2 Company Description
- 8.4.3 Capacity, Production and Value of Solder Ball
- 8.4.4 Solder Ball Product Description
- 8.4.5 SWOT Analysis
- 8.5 Nippon Micrometal
- 8.5.1 Nippon Micrometal Company Details
- 8.5.2 Company Description
- 8.5.3 Capacity, Production and Value of Solder Ball
- 8.5.4 Solder Ball Product Description
- 8.5.5 SWOT Analysis
- 8.6 Accurus
- 8.6.1 Accurus Company Details
- 8.6.2 Company Description
- 8.6.3 Capacity, Production and Value of Solder Ball
- 8.6.4 Solder Ball Product Description
- 8.6.5 SWOT Analysis
- 8.7 PMTC
- 8.7.1 PMTC Company Details
- 8.7.2 Company Description
- 8.7.3 Capacity, Production and Value of Solder Ball
- 8.7.4 Solder Ball Product Description
- 8.7.5 SWOT Analysis
- 8.8 Shanghai hiking solder material
- 8.8.1 Shanghai hiking solder material Company Details
- 8.8.2 Company Description
- 8.8.3 Capacity, Production and Value of Solder Ball
- 8.8.4 Solder Ball Product Description
- 8.8.5 SWOT Analysis
- 8.9 Shenmao Technology
- 8.9.1 Shenmao Technology Company Details
- 8.9.2 Company Description
- 8.9.3 Capacity, Production and Value of Solder Ball
- 8.9.4 Solder Ball Product Description
- 8.9.5 SWOT Analysis
9 Production Forecasts
- 9.1 Solder Ball Production and Revenue Forecast
- 9.1.1 Global Solder Ball Production Forecast 2019-2025
- 9.1.2 Global Solder Ball Revenue Forecast 2019-2025
- 9.2 Solder Ball Production and Revenue Forecast by Regions
- 9.2.1 Global Solder Ball Revenue Forecast by Regions
- 9.2.2 Global Solder Ball Production Forecast by Regions
- 9.3 Solder Ball Key Producers Forecast
- 9.3.1 United States
- 9.3.2 Europe
- 9.3.3 China
- 9.3.4 Japan
- 9.4 Forecast by Type
- 9.4.1 Global Solder Ball Production Forecast by Type
- 9.4.2 Global Solder Ball Revenue Forecast by Type
10 Consumption Forecast
- 10.1 Consumption Forecast by Application
- 10.2 Solder Ball Consumption Forecast by Regions
- 10.3 North America Market Consumption Forecast
- 10.3.1 North America Solder Ball Consumption Forecast by Countries 2019-2025
- 10.3.2 United States
- 10.3.3 Canada
- 10.3.4 Mexico
- 10.4 Europe Market Consumption Forecast
- 10.4.1 Europe Solder Ball Consumption Forecast by Countries 2019-2025
- 10.4.2 Germany
- 10.4.3 France
- 10.4.4 UK
- 10.4.5 Italy
- 10.4.6 Russia
- 10.5 Asia Pacific Market Consumption Forecast
- 10.5.1 Asia Pacific Solder Ball Consumption Forecast by Countries 2019-2025
- 10.5.2 China
- 10.5.3 Japan
- 10.5.4 Korea
- 10.5.5 India
- 10.5.6 Australia
- 10.5.7 Indonesia
- 10.5.8 Thailand
- 10.5.9 Malaysia
- 10.5.10 Philippines
- 10.5.11 Vietnam
- 10.6 Central & South America Market Consumption Forecast
- 10.6.1 Central & South America Solder Ball Consumption Forecast by Country 2019-2025
- 10.6.2 Brazil
- 10.7 Middle East and Africa Market Consumption Forecast
- 10.7.1 Middle East and Africa Solder Ball Consumption Forecast by Countries 2019-2025
- 10.7.2 Middle East and Africa
- 10.7.3 Turkey
- 10.7.4 GCC Countries
- 10.7.5 Egypt
- 10.7.6 South Africa
11 Upstream, Industry Chain and Downstream Customers Analysis
- 11.1 Analysis of Solder Ball Upstream Market
- 11.1.1 Solder Ball Key Raw Material
- 11.1.2 Typical Suppliers of Key Solder Ball Raw Material
- 11.1.3 Solder Ball Raw Material Market Concentration Rate
- 11.2 Solder Ball Industry Chain Analysis
- 11.3 Marketing & Distribution
- 11.4 Solder Ball Distributors
- 11.5 Solder Ball Customers
12 Opportunities & Challenges, Threat and Affecting Factors
- 12.1 Market Opportunities
- 12.2 Market Challenges
- 12.3 Porter's Five Forces Analysis
13 Key Findings
14 Appendix
- 14.1 Research Methodology
- 14.1.1 Methodology/Research Approach
- 14.1.2 Data Source
- 14.2 Author Details
Summary:
Get latest Market Research Reports on Solder Ball . Industry analysis & Market Report on Solder Ball is a syndicated market report, published as Global Solder Ball Market Insights, Forecast to 2025. It is complete Research Study and Industry Analysis of Solder Ball market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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