Global Smart Card IC Market Data Survey Report 2013-2025

Table of Contents

1 Global Market Overview

• 1.1 Scope of Statistics
  • 1.1.1 Scope of Products
  • 1.1.2 Scope of Manufacturers
  • 1.1.3 Scope of Application
  • 1.1.4 Scope of Type
  • 1.1.5 Scope of Regions/Countries
• 1.2 Global Market Size

2 Regional Market

• 2.1 Regional Production
• 2.2 Regional Demand
• 2.3 Regional Trade

3 Key Manufacturers

• 3.1 Infineon Technologies
  • 3.1.1 Company Information
  • 3.1.2 Product & Services
  • 3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.1.4 Recent Development
• 3.2 NXP
  • 3.2.1 Company Information
  • 3.2.2 Product & Services
  • 3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.2.4 Recent Development
• 3.3 ON Semiconductor
  • 3.3.1 Company Information
  • 3.3.2 Product & Services
  • 3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.3.4 Recent Development
• 3.4 Athena
  • 3.4.1 Company Information
  • 3.4.2 Product & Services
  • 3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.4.4 Recent Development
• 3.5 Abnote
  • 3.5.1 Company Information
  • 3.5.2 Product & Services
  • 3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.5.4 Recent Development
• 3.6 Renesas Technology
  • 3.6.1 Company Information
  • 3.6.2 Product & Services
  • 3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.6.4 Recent Development
• 3.7 Samsung
  • 3.7.1 Company Information
  • 3.7.2 Product & Services
  • 3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.7.4 Recent Development
• 3.8 EM Microelectronic
  • 3.8.1 Company Information
  • 3.8.2 Product & Services
  • 3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.8.4 Recent Development
• 3.9 HT Micron
  • 3.9.1 Company Information
  • 3.9.2 Product & Services
  • 3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.9.4 Recent Development
• 3.10 STMicroelectronics
  • 3.10.1 Company Information
  • 3.10.2 Product & Services
  • 3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.10.4 Recent Development
• 3.11 TI
  • 3.11.1 Company Information
  • 3.11.2 Product & Services
  • 3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.11.4 Recent Development
• 3.12 Atmel
  • 3.12.1 Company Information
  • 3.12.2 Product & Services
  • 3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.12.4 Recent Development
• 3.13 Philips
  • 3.13.1 Company Information
  • 3.13.2 Product & Services
  • 3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.13.4 Recent Development
• 3.14 CardLogix
  • 3.14.1 Company Information
  • 3.14.2 Product & Services
  • 3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.14.4 Recent Development
• 3.15 Gemalto
  • 3.15.1 Company Information
  • 3.15.2 Product & Services
  • 3.15.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.15.4 Recent Development
• 3.16 Oberthur Technologies
  • 3.16.1 Company Information
  • 3.16.2 Product & Services
  • 3.16.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.16.4 Recent Development
• 3.17 Morpho
  • 3.17.1 Company Information
  • 3.17.2 Product & Services
  • 3.17.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.17.4 Recent Development
• 3.18 Watchdata System
  • 3.18.1 Company Information
  • 3.18.2 Product & Services
  • 3.18.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.18.4 Recent Development
• 3.19 Giesecke&Devrient
  • 3.19.1 Company Information
  • 3.19.2 Product & Services
  • 3.19.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.19.4 Recent Development
• 3.20 ASK
  • 3.20.1 Company Information
  • 3.20.2 Product & Services
  • 3.20.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.20.4 Recent Development
• 3.21 Inside Contactless
  • 3.21.1 Company Information
  • 3.21.2 Product & Services
  • 3.21.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.21.4 Recent Development
• 3.22 Shanghai Huahong Integrated Circuits
  • 3.22.1 Company Information
  • 3.22.2 Product & Services
  • 3.22.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.22.4 Recent Development
• 3.23 TMC
  • 3.23.1 Company Information
  • 3.23.2 Product & Services
  • 3.23.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
  • 3.23.4 Recent Development
• 3.24 Datang
  • 3.24.1 Company Information
  • 3.24.2 Product & Services
  • 3.24.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
• 3.25 Fudan Microelectronics
  • 3.25.1 Company Information
  • 3.25.2 Product & Services
  • 3.25.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)

4 Major Application

• 4.1 Telecom
  • 4.1.1 Overview
  • 4.1.2 Telecom Market Size and Forecast
• 4.2 Banking
  • 4.2.1 Overview
  • 4.2.2 Banking Market Size and Forecast
• 4.3 Social Security
  • 4.3.1 Overview
  • 4.3.2 Social Security Market Size and Forecast
• 4.4 Identification
  • 4.4.1 Overview
  • 4.4.2 Identification Market Size and Forecast
• 4.5 Transport
  • 4.5.1 Overview
  • 4.5.2 Transport Market Size and Forecast
• 4.6 Others Applications
  • 4.6.1 Overview
  • 4.6.2 Others Applications Market Size and Forecast

5 Market by Type

5.By Memory Card IC

• 5.1 Memory Card IC
  • 5.1.1 Overview
  • 5.1.2 Memory Card IC Market Size and Forecast
• 5.2 Security Logic Card IC
  • 5.2.1 Overview
  • 5.2.2 Security Logic Card IC Market Size and Forecast
• 5.3 CPU Cards IC
  • 5.3.1 Overview
  • 5.3.2 CPU Cards IC Market Size and Forecast

6 Price Overview

• 6.1 Price by Manufacturers
• 6.2 Price by Application
• 6.3 Price by Type

7 Conclusion