Report Detail
Global Semiconductor Packaging Material Market Professional Survey Report 2019
- RnM3766358 |
- 20 September, 2019 |
- Global |
- 110 Pages |
- QYResearch |
- Chemical & Material
Semiconductor packaging materials are used in the final stage of semiconductor device fabrication and are used to safeguard devices from deterioration and external influence.
The Asia Pacific currently holds the pole position in the semiconductor packaging material market owing to fast technological growths and the developing demand for progressive electronic packaging materials from the end-users. Furthermore, the large investments in electronics applications along with low-cost manufacturing, low workforce cost, and easy convenience of the raw materials are subsidizing to the evolution of the region.
The global Semiconductor Packaging Material market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Semiconductor Packaging Material volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Packaging Material market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Semiconductor Packaging Material in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Semiconductor Packaging Material manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Henkel AG & Company
KGaA (Germany)
Hitachi Chemical Company, Ltd. (Japan)
Sumitomo Chemical Co., Ltd. (Japan)
Kyocera Chemical Corporation (Japan)
Mitsui High-tec, Inc. (Japan)
Toray Industries, Inc. (Japan)
Alent plc (U.K.)
LG Chem (South Korea)
BASF SE (Germany)
Tanaka Kikinzoku Group (Japan)
E. I. du Pont de Nemours and Company (US)
Honeywell International Inc. (US)
Toppan Printing Co., Ltd. (Japan)
Nippon Micrometal Corporation (Japan)
Alpha Advanced Materials (US)
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Organic Substrates
Bonding Wires
Encapsulation Resins
Ceramic Packages
Solder Balls
Wafer Level Packaging Dielectrics
Others
Segment by Application
Semiconductor Packaging
Others
Table of Contents
Executive Summary
1 Industry Overview of Semiconductor Packaging Material
- 1.1 Definition of Semiconductor Packaging Material
- 1.2 Semiconductor Packaging Material Segment by Type
- 1.2.1 Global Semiconductor Packaging Material Production Growth Rate Comparison by Types (2014-2025)
- 1.2.2 Organic Substrates
- 1.2.3 Bonding Wires
- 1.2.4 Encapsulation Resins
- 1.2.5 Ceramic Packages
- 1.2.6 Solder Balls
- 1.2.7 Wafer Level Packaging Dielectrics
- 1.2.8 Others
- 1.3 Semiconductor Packaging Material Segment by Applications
- 1.3.1 Global Semiconductor Packaging Material Consumption Comparison by Applications (2014-2025)
- 1.3.2 Semiconductor Packaging
- 1.3.3 Others
- 1.4 Global Semiconductor Packaging Material Overall Market
- 1.4.1 Global Semiconductor Packaging Material Revenue (2014-2025)
- 1.4.2 Global Semiconductor Packaging Material Production (2014-2025)
- 1.4.3 North America Semiconductor Packaging Material Status and Prospect (2014-2025)
- 1.4.4 Europe Semiconductor Packaging Material Status and Prospect (2014-2025)
- 1.4.5 China Semiconductor Packaging Material Status and Prospect (2014-2025)
- 1.4.6 Japan Semiconductor Packaging Material Status and Prospect (2014-2025)
- 1.4.7 Southeast Asia Semiconductor Packaging Material Status and Prospect (2014-2025)
- 1.4.8 India Semiconductor Packaging Material Status and Prospect (2014-2025)
2 Manufacturing Cost Structure Analysis
- 2.1 Raw Material and Suppliers
- 2.2 Manufacturing Cost Structure Analysis of Semiconductor Packaging Material
- 2.3 Manufacturing Process Analysis of Semiconductor Packaging Material
- 2.4 Industry Chain Structure of Semiconductor Packaging Material
3 Development and Manufacturing Plants Analysis of Semiconductor Packaging Material
- 3.1 Capacity and Commercial Production Date
- 3.2 Global Semiconductor Packaging Material Manufacturing Plants Distribution
- 3.3 Major Manufacturers Technology Source and Market Position of Semiconductor Packaging Material
- 3.4 Recent Development and Expansion Plans
4 Key Figures of Major Manufacturers
- 4.1 Semiconductor Packaging Material Production and Capacity Analysis
- 4.2 Semiconductor Packaging Material Revenue Analysis
- 4.3 Semiconductor Packaging Material Price Analysis
- 4.4 Market Concentration Degree
5 Semiconductor Packaging Material Regional Market Analysis
- 5.1 Semiconductor Packaging Material Production by Regions
- 5.1.1 Global Semiconductor Packaging Material Production by Regions
- 5.1.2 Global Semiconductor Packaging Material Revenue by Regions
- 5.2 Semiconductor Packaging Material Consumption by Regions
- 5.3 North America Semiconductor Packaging Material Market Analysis
- 5.3.1 North America Semiconductor Packaging Material Production
- 5.3.2 North America Semiconductor Packaging Material Revenue
- 5.3.3 Key Manufacturers in North America
- 5.3.4 North America Semiconductor Packaging Material Import and Export
- 5.4 Europe Semiconductor Packaging Material Market Analysis
- 5.4.1 Europe Semiconductor Packaging Material Production
- 5.4.2 Europe Semiconductor Packaging Material Revenue
- 5.4.3 Key Manufacturers in Europe
- 5.4.4 Europe Semiconductor Packaging Material Import and Export
- 5.5 China Semiconductor Packaging Material Market Analysis
- 5.5.1 China Semiconductor Packaging Material Production
- 5.5.2 China Semiconductor Packaging Material Revenue
- 5.5.3 Key Manufacturers in China
- 5.5.4 China Semiconductor Packaging Material Import and Export
- 5.6 Japan Semiconductor Packaging Material Market Analysis
- 5.6.1 Japan Semiconductor Packaging Material Production
- 5.6.2 Japan Semiconductor Packaging Material Revenue
- 5.6.3 Key Manufacturers in Japan
- 5.6.4 Japan Semiconductor Packaging Material Import and Export
- 5.7 Southeast Asia Semiconductor Packaging Material Market Analysis
- 5.7.1 Southeast Asia Semiconductor Packaging Material Production
- 5.7.2 Southeast Asia Semiconductor Packaging Material Revenue
- 5.7.3 Key Manufacturers in Southeast Asia
- 5.7.4 Southeast Asia Semiconductor Packaging Material Import and Export
- 5.8 India Semiconductor Packaging Material Market Analysis
- 5.8.1 India Semiconductor Packaging Material Production
- 5.8.2 India Semiconductor Packaging Material Revenue
- 5.8.3 Key Manufacturers in India
- 5.8.4 India Semiconductor Packaging Material Import and Export
6 Semiconductor Packaging Material Segment Market Analysis (by Type)
- 6.1 Global Semiconductor Packaging Material Production by Type
- 6.2 Global Semiconductor Packaging Material Revenue by Type
- 6.3 Semiconductor Packaging Material Price by Type
7 Semiconductor Packaging Material Segment Market Analysis (by Application)
- 7.1 Global Semiconductor Packaging Material Consumption by Application
- 7.2 Global Semiconductor Packaging Material Consumption Market Share by Application (2014-2019)
8 Semiconductor Packaging Material Major Manufacturers Analysis
- 8.1 Henkel AG & Company
- 8.1.1 Henkel AG & Company Semiconductor Packaging Material Production Sites and Area Served
- 8.1.2 Henkel AG & Company Product Introduction, Application and Specification
- 8.1.3 Henkel AG & Company Semiconductor Packaging Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.1.4 Main Business and Markets Served
- 8.2 KGaA (Germany)
- 8.2.1 KGaA (Germany) Semiconductor Packaging Material Production Sites and Area Served
- 8.2.2 KGaA (Germany) Product Introduction, Application and Specification
- 8.2.3 KGaA (Germany) Semiconductor Packaging Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.2.4 Main Business and Markets Served
- 8.3 Hitachi Chemical Company, Ltd. (Japan)
- 8.3.1 Hitachi Chemical Company, Ltd. (Japan) Semiconductor Packaging Material Production Sites and Area Served
- 8.3.2 Hitachi Chemical Company, Ltd. (Japan) Product Introduction, Application and Specification
- 8.3.3 Hitachi Chemical Company, Ltd. (Japan) Semiconductor Packaging Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.3.4 Main Business and Markets Served
- 8.4 Sumitomo Chemical Co., Ltd. (Japan)
- 8.4.1 Sumitomo Chemical Co., Ltd. (Japan) Semiconductor Packaging Material Production Sites and Area Served
- 8.4.2 Sumitomo Chemical Co., Ltd. (Japan) Product Introduction, Application and Specification
- 8.4.3 Sumitomo Chemical Co., Ltd. (Japan) Semiconductor Packaging Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.4.4 Main Business and Markets Served
- 8.5 Kyocera Chemical Corporation (Japan)
- 8.5.1 Kyocera Chemical Corporation (Japan) Semiconductor Packaging Material Production Sites and Area Served
- 8.5.2 Kyocera Chemical Corporation (Japan) Product Introduction, Application and Specification
- 8.5.3 Kyocera Chemical Corporation (Japan) Semiconductor Packaging Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.5.4 Main Business and Markets Served
- 8.6 Mitsui High-tec, Inc. (Japan)
- 8.6.1 Mitsui High-tec, Inc. (Japan) Semiconductor Packaging Material Production Sites and Area Served
- 8.6.2 Mitsui High-tec, Inc. (Japan) Product Introduction, Application and Specification
- 8.6.3 Mitsui High-tec, Inc. (Japan) Semiconductor Packaging Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.6.4 Main Business and Markets Served
- 8.7 Toray Industries, Inc. (Japan)
- 8.7.1 Toray Industries, Inc. (Japan) Semiconductor Packaging Material Production Sites and Area Served
- 8.7.2 Toray Industries, Inc. (Japan) Product Introduction, Application and Specification
- 8.7.3 Toray Industries, Inc. (Japan) Semiconductor Packaging Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.7.4 Main Business and Markets Served
- 8.8 Alent plc (U.K.)
- 8.8.1 Alent plc (U.K.) Semiconductor Packaging Material Production Sites and Area Served
- 8.8.2 Alent plc (U.K.) Product Introduction, Application and Specification
- 8.8.3 Alent plc (U.K.) Semiconductor Packaging Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.8.4 Main Business and Markets Served
- 8.9 LG Chem (South Korea)
- 8.9.1 LG Chem (South Korea) Semiconductor Packaging Material Production Sites and Area Served
- 8.9.2 LG Chem (South Korea) Product Introduction, Application and Specification
- 8.9.3 LG Chem (South Korea) Semiconductor Packaging Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.9.4 Main Business and Markets Served
- 8.10 BASF SE (Germany)
- 8.10.1 BASF SE (Germany) Semiconductor Packaging Material Production Sites and Area Served
- 8.10.2 BASF SE (Germany) Product Introduction, Application and Specification
- 8.10.3 BASF SE (Germany) Semiconductor Packaging Material Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.10.4 Main Business and Markets Served
- 8.11 Tanaka Kikinzoku Group (Japan)
- 8.12 E. I. du Pont de Nemours and Company (U.S.)
- 8.13 Honeywell International Inc. (U.S.)
- 8.14 Toppan Printing Co., Ltd. (Japan)
- 8.15 Nippon Micrometal Corporation (Japan)
- 8.16 Alpha Advanced Materials (U.S.)
9 Development Trend of Analysis of Semiconductor Packaging Material Market
- 9.1 Global Semiconductor Packaging Material Market Trend Analysis
- 9.1.1 Global Semiconductor Packaging Material Market Size (Volume and Value) Forecast 2019-2025
- 9.2 Semiconductor Packaging Material Regional Market Trend
- 9.2.1 North America Semiconductor Packaging Material Forecast 2019-2025
- 9.2.2 Europe Semiconductor Packaging Material Forecast 2019-2025
- 9.2.3 China Semiconductor Packaging Material Forecast 2019-2025
- 9.2.4 Japan Semiconductor Packaging Material Forecast 2019-2025
- 9.2.5 Southeast Asia Semiconductor Packaging Material Forecast 2019-2025
- 9.2.6 India Semiconductor Packaging Material Forecast 2019-2025
- 9.3 Semiconductor Packaging Material Market Trend (Product Type)
- 9.4 Semiconductor Packaging Material Market Trend (Application)
- 10.1 Marketing Channel
- 10.1.1 Direct Marketing
- 10.1.2 Indirect Marketing
- 10.3 Semiconductor Packaging Material Customers
11 Market Dynamics
- 11.1 Market Trends
- 11.2 Opportunities
- 11.3 Market Drivers
- 11.4 Challenges
- 11.5 Influence Factors
12 Conclusion
13 Appendix
- 13.1 Methodology/Research Approach
- 13.1.1 Research Programs/Design
- 13.1.2 Market Size Estimation
- 13.1.3 Market Breakdown and Data Triangulation
- 13.2 Data Source
- 13.2.1 Secondary Sources
- 13.2.2 Primary Sources
- 13.3 Author List
Summary:
Get latest Market Research Reports on Semiconductor Packaging Material. Industry analysis & Market Report on Semiconductor Packaging Material is a syndicated market report, published as Global Semiconductor Packaging Material Market Professional Survey Report 2019. It is complete Research Study and Industry Analysis of Semiconductor Packaging Material market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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