In terms of geography, the APAC region accounted for the majority of market shares and will continue to lead the market. Most of the revenues coming from this region is generated from the foundries present in Taiwan, South Korea, and Japan. The presence of prominent semiconductor foundries, such as Taiwan Semiconductor Manufacturing, United Microelectronics, Samsung, and Semiconductor Manufacturing International, is driving the semiconductor market in the region. Also, the manufacturers are investing heavily in the region to build new fabs, which will further contribute to this market’s growth over the next few years.
The global Semiconductor Chip Packaging market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Semiconductor Chip Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Chip Packaging market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Semiconductor Chip Packaging in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Semiconductor Chip Packaging manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
...
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
Table of Contents
Executive Summary
1 Industry Overview of Semiconductor Chip Packaging
1.1 Definition of Semiconductor Chip Packaging
1.2 Semiconductor Chip Packaging Segment by Type
1.2.1 Global Semiconductor Chip Packaging Production Growth Rate Comparison by Types (2014-2025)
1.2.2 Fan-Out Wafer-Level Packaging (FO WLP)
1.2.3 Fan-In Wafer-Level Packaging (FI WLP)
1.2.4 Flip Chip (FC)
1.2.5 2.5D/3D
1.3 Semiconductor Chip Packaging Segment by Applications
1.3.1 Global Semiconductor Chip Packaging Consumption Comparison by Applications (2014-2025)
1.3.2 Telecommunications
1.3.3 Automotive
1.3.4 Aerospace and Defense
1.3.5 Medical Devices
1.3.6 Consumer Electronics
1.3.7 Other
1.4 Global Semiconductor Chip Packaging Overall Market
1.4.1 Global Semiconductor Chip Packaging Revenue (2014-2025)
1.4.2 Global Semiconductor Chip Packaging Production (2014-2025)
1.4.3 North America Semiconductor Chip Packaging Status and Prospect (2014-2025)
1.4.4 Europe Semiconductor Chip Packaging Status and Prospect (2014-2025)
1.4.5 China Semiconductor Chip Packaging Status and Prospect (2014-2025)
1.4.6 Japan Semiconductor Chip Packaging Status and Prospect (2014-2025)
1.4.7 Southeast Asia Semiconductor Chip Packaging Status and Prospect (2014-2025)
1.4.8 India Semiconductor Chip Packaging Status and Prospect (2014-2025)
2 Manufacturing Cost Structure Analysis
2.1 Raw Material and Suppliers
2.2 Manufacturing Cost Structure Analysis of Semiconductor Chip Packaging
2.3 Manufacturing Process Analysis of Semiconductor Chip Packaging
2.4 Industry Chain Structure of Semiconductor Chip Packaging
3 Development and Manufacturing Plants Analysis of Semiconductor Chip Packaging
3.1 Capacity and Commercial Production Date
3.2 Global Semiconductor Chip Packaging Manufacturing Plants Distribution
3.3 Major Manufacturers Technology Source and Market Position of Semiconductor Chip Packaging
3.4 Recent Development and Expansion Plans
4 Key Figures of Major Manufacturers
4.1 Semiconductor Chip Packaging Production and Capacity Analysis
Summary: Get latest Market Research Reports on Semiconductor Chip Packaging. Industry analysis & Market Report on Semiconductor Chip Packaging is a syndicated market report, published as Global Semiconductor Chip Packaging Market Professional Survey Report 2019. It is complete Research Study and Industry Analysis of Semiconductor Chip Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.