Report Detail
Global Semiconductor Assembly & Packaging Equipment Market Professional Survey Report 2019
- RnM3753923 |
- 17 September, 2019 |
- Global |
- 112 Pages |
- QYResearch |
- Electronics & Semiconductor
Semiconductor packaging and assembly equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.
The increase in application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment. The growth in complexity of semiconductor IC designs majorly drives the market. Recently, it has been observed that there is an increase in the need for semiconductor ICs that can perform multiple functions. Consequently, vendors have developed semiconductor ICs with complex architecture to address the rise in need for multi-functional ICs. The development of complex semiconductor ICs is a critical factor that impels the market growth during the forecast period.
The global Semiconductor Assembly & Packaging Equipment market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Semiconductor Assembly & Packaging Equipment volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Assembly & Packaging Equipment market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Semiconductor Assembly & Packaging Equipment in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Semiconductor Assembly & Packaging Equipment manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
ASM Pacific Technology
Kulicke & Soffa Industries
Besi
Accrutech
Shinkawa
Palomar Technologies
Hesse Mechatronics
Toray Engineering
West Bond
HYBOND
DIAS Automation
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Die Bonders
Wire Bonders
Packaging Equipment
Others
Segment by Application
IDMs
OSAT
Table of Contents
Executive Summary
1 Industry Overview of Semiconductor Assembly & Packaging Equipment
- 1.1 Definition of Semiconductor Assembly & Packaging Equipment
- 1.2 Semiconductor Assembly & Packaging Equipment Segment by Type
- 1.2.1 Global Semiconductor Assembly & Packaging Equipment Production Growth Rate Comparison by Types (2014-2025)
- 1.2.2 Die Bonders
- 1.2.3 Wire Bonders
- 1.2.4 Packaging Equipment
- 1.2.5 Others
- 1.3 Semiconductor Assembly & Packaging Equipment Segment by Applications
- 1.3.1 Global Semiconductor Assembly & Packaging Equipment Consumption Comparison by Applications (2014-2025)
- 1.3.2 IDMs
- 1.3.3 OSAT
- 1.4 Global Semiconductor Assembly & Packaging Equipment Overall Market
- 1.4.1 Global Semiconductor Assembly & Packaging Equipment Revenue (2014-2025)
- 1.4.2 Global Semiconductor Assembly & Packaging Equipment Production (2014-2025)
- 1.4.3 North America Semiconductor Assembly & Packaging Equipment Status and Prospect (2014-2025)
- 1.4.4 Europe Semiconductor Assembly & Packaging Equipment Status and Prospect (2014-2025)
- 1.4.5 China Semiconductor Assembly & Packaging Equipment Status and Prospect (2014-2025)
- 1.4.6 Japan Semiconductor Assembly & Packaging Equipment Status and Prospect (2014-2025)
- 1.4.7 Southeast Asia Semiconductor Assembly & Packaging Equipment Status and Prospect (2014-2025)
- 1.4.8 India Semiconductor Assembly & Packaging Equipment Status and Prospect (2014-2025)
2 Manufacturing Cost Structure Analysis
- 2.1 Raw Material and Suppliers
- 2.2 Manufacturing Cost Structure Analysis of Semiconductor Assembly & Packaging Equipment
- 2.3 Manufacturing Process Analysis of Semiconductor Assembly & Packaging Equipment
- 2.4 Industry Chain Structure of Semiconductor Assembly & Packaging Equipment
3 Development and Manufacturing Plants Analysis of Semiconductor Assembly & Packaging Equipment
- 3.1 Capacity and Commercial Production Date
- 3.2 Global Semiconductor Assembly & Packaging Equipment Manufacturing Plants Distribution
- 3.3 Major Manufacturers Technology Source and Market Position of Semiconductor Assembly & Packaging Equipment
- 3.4 Recent Development and Expansion Plans
4 Key Figures of Major Manufacturers
- 4.1 Semiconductor Assembly & Packaging Equipment Production and Capacity Analysis
- 4.2 Semiconductor Assembly & Packaging Equipment Revenue Analysis
- 4.3 Semiconductor Assembly & Packaging Equipment Price Analysis
- 4.4 Market Concentration Degree
5 Semiconductor Assembly & Packaging Equipment Regional Market Analysis
- 5.1 Semiconductor Assembly & Packaging Equipment Production by Regions
- 5.1.1 Global Semiconductor Assembly & Packaging Equipment Production by Regions
- 5.1.2 Global Semiconductor Assembly & Packaging Equipment Revenue by Regions
- 5.2 Semiconductor Assembly & Packaging Equipment Consumption by Regions
- 5.3 North America Semiconductor Assembly & Packaging Equipment Market Analysis
- 5.3.1 North America Semiconductor Assembly & Packaging Equipment Production
- 5.3.2 North America Semiconductor Assembly & Packaging Equipment Revenue
- 5.3.3 Key Manufacturers in North America
- 5.3.4 North America Semiconductor Assembly & Packaging Equipment Import and Export
- 5.4 Europe Semiconductor Assembly & Packaging Equipment Market Analysis
- 5.4.1 Europe Semiconductor Assembly & Packaging Equipment Production
- 5.4.2 Europe Semiconductor Assembly & Packaging Equipment Revenue
- 5.4.3 Key Manufacturers in Europe
- 5.4.4 Europe Semiconductor Assembly & Packaging Equipment Import and Export
- 5.5 China Semiconductor Assembly & Packaging Equipment Market Analysis
- 5.5.1 China Semiconductor Assembly & Packaging Equipment Production
- 5.5.2 China Semiconductor Assembly & Packaging Equipment Revenue
- 5.5.3 Key Manufacturers in China
- 5.5.4 China Semiconductor Assembly & Packaging Equipment Import and Export
- 5.6 Japan Semiconductor Assembly & Packaging Equipment Market Analysis
- 5.6.1 Japan Semiconductor Assembly & Packaging Equipment Production
- 5.6.2 Japan Semiconductor Assembly & Packaging Equipment Revenue
- 5.6.3 Key Manufacturers in Japan
- 5.6.4 Japan Semiconductor Assembly & Packaging Equipment Import and Export
- 5.7 Southeast Asia Semiconductor Assembly & Packaging Equipment Market Analysis
- 5.7.1 Southeast Asia Semiconductor Assembly & Packaging Equipment Production
- 5.7.2 Southeast Asia Semiconductor Assembly & Packaging Equipment Revenue
- 5.7.3 Key Manufacturers in Southeast Asia
- 5.7.4 Southeast Asia Semiconductor Assembly & Packaging Equipment Import and Export
- 5.8 India Semiconductor Assembly & Packaging Equipment Market Analysis
- 5.8.1 India Semiconductor Assembly & Packaging Equipment Production
- 5.8.2 India Semiconductor Assembly & Packaging Equipment Revenue
- 5.8.3 Key Manufacturers in India
- 5.8.4 India Semiconductor Assembly & Packaging Equipment Import and Export
6 Semiconductor Assembly & Packaging Equipment Segment Market Analysis (by Type)
- 6.1 Global Semiconductor Assembly & Packaging Equipment Production by Type
- 6.2 Global Semiconductor Assembly & Packaging Equipment Revenue by Type
- 6.3 Semiconductor Assembly & Packaging Equipment Price by Type
7 Semiconductor Assembly & Packaging Equipment Segment Market Analysis (by Application)
- 7.1 Global Semiconductor Assembly & Packaging Equipment Consumption by Application
- 7.2 Global Semiconductor Assembly & Packaging Equipment Consumption Market Share by Application (2014-2019)
8 Semiconductor Assembly & Packaging Equipment Major Manufacturers Analysis
- 8.1 ASM Pacific Technology
- 8.1.1 ASM Pacific Technology Semiconductor Assembly & Packaging Equipment Production Sites and Area Served
- 8.1.2 ASM Pacific Technology Product Introduction, Application and Specification
- 8.1.3 ASM Pacific Technology Semiconductor Assembly & Packaging Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.1.4 Main Business and Markets Served
- 8.2 Kulicke & Soffa Industries
- 8.2.1 Kulicke & Soffa Industries Semiconductor Assembly & Packaging Equipment Production Sites and Area Served
- 8.2.2 Kulicke & Soffa Industries Product Introduction, Application and Specification
- 8.2.3 Kulicke & Soffa Industries Semiconductor Assembly & Packaging Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.2.4 Main Business and Markets Served
- 8.3 Besi
- 8.3.1 Besi Semiconductor Assembly & Packaging Equipment Production Sites and Area Served
- 8.3.2 Besi Product Introduction, Application and Specification
- 8.3.3 Besi Semiconductor Assembly & Packaging Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.3.4 Main Business and Markets Served
- 8.4 Accrutech
- 8.4.1 Accrutech Semiconductor Assembly & Packaging Equipment Production Sites and Area Served
- 8.4.2 Accrutech Product Introduction, Application and Specification
- 8.4.3 Accrutech Semiconductor Assembly & Packaging Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.4.4 Main Business and Markets Served
- 8.5 Shinkawa
- 8.5.1 Shinkawa Semiconductor Assembly & Packaging Equipment Production Sites and Area Served
- 8.5.2 Shinkawa Product Introduction, Application and Specification
- 8.5.3 Shinkawa Semiconductor Assembly & Packaging Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.5.4 Main Business and Markets Served
- 8.6 Palomar Technologies
- 8.6.1 Palomar Technologies Semiconductor Assembly & Packaging Equipment Production Sites and Area Served
- 8.6.2 Palomar Technologies Product Introduction, Application and Specification
- 8.6.3 Palomar Technologies Semiconductor Assembly & Packaging Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.6.4 Main Business and Markets Served
- 8.7 Hesse Mechatronics
- 8.7.1 Hesse Mechatronics Semiconductor Assembly & Packaging Equipment Production Sites and Area Served
- 8.7.2 Hesse Mechatronics Product Introduction, Application and Specification
- 8.7.3 Hesse Mechatronics Semiconductor Assembly & Packaging Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.7.4 Main Business and Markets Served
- 8.8 Toray Engineering
- 8.8.1 Toray Engineering Semiconductor Assembly & Packaging Equipment Production Sites and Area Served
- 8.8.2 Toray Engineering Product Introduction, Application and Specification
- 8.8.3 Toray Engineering Semiconductor Assembly & Packaging Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.8.4 Main Business and Markets Served
- 8.9 West Bond
- 8.9.1 West Bond Semiconductor Assembly & Packaging Equipment Production Sites and Area Served
- 8.9.2 West Bond Product Introduction, Application and Specification
- 8.9.3 West Bond Semiconductor Assembly & Packaging Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.9.4 Main Business and Markets Served
- 8.10 HYBOND
- 8.10.1 HYBOND Semiconductor Assembly & Packaging Equipment Production Sites and Area Served
- 8.10.2 HYBOND Product Introduction, Application and Specification
- 8.10.3 HYBOND Semiconductor Assembly & Packaging Equipment Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.10.4 Main Business and Markets Served
- 8.11 DIAS Automation
9 Development Trend of Analysis of Semiconductor Assembly & Packaging Equipment Market
- 9.1 Global Semiconductor Assembly & Packaging Equipment Market Trend Analysis
- 9.1.1 Global Semiconductor Assembly & Packaging Equipment Market Size (Volume and Value) Forecast 2019-2025
- 9.2 Semiconductor Assembly & Packaging Equipment Regional Market Trend
- 9.2.1 North America Semiconductor Assembly & Packaging Equipment Forecast 2019-2025
- 9.2.2 Europe Semiconductor Assembly & Packaging Equipment Forecast 2019-2025
- 9.2.3 China Semiconductor Assembly & Packaging Equipment Forecast 2019-2025
- 9.2.4 Japan Semiconductor Assembly & Packaging Equipment Forecast 2019-2025
- 9.2.5 Southeast Asia Semiconductor Assembly & Packaging Equipment Forecast 2019-2025
- 9.2.6 India Semiconductor Assembly & Packaging Equipment Forecast 2019-2025
- 9.3 Semiconductor Assembly & Packaging Equipment Market Trend (Product Type)
- 9.4 Semiconductor Assembly & Packaging Equipment Market Trend (Application)
- 10.1 Marketing Channel
- 10.1.1 Direct Marketing
- 10.1.2 Indirect Marketing
- 10.3 Semiconductor Assembly & Packaging Equipment Customers
11 Market Dynamics
- 11.1 Market Trends
- 11.2 Opportunities
- 11.3 Market Drivers
- 11.4 Challenges
- 11.5 Influence Factors
12 Conclusion
13 Appendix
- 13.1 Methodology/Research Approach
- 13.1.1 Research Programs/Design
- 13.1.2 Market Size Estimation
- 13.1.3 Market Breakdown and Data Triangulation
- 13.2 Data Source
- 13.2.1 Secondary Sources
- 13.2.2 Primary Sources
- 13.3 Author List
Summary:
Get latest Market Research Reports on Semiconductor Assembly & Packaging Equipment. Industry analysis & Market Report on Semiconductor Assembly & Packaging Equipment is a syndicated market report, published as Global Semiconductor Assembly & Packaging Equipment Market Professional Survey Report 2019. It is complete Research Study and Industry Analysis of Semiconductor Assembly & Packaging Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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