Global Printed Circuit Board(PCB) Market Research Report 2012-2024

Table of Contents

1 Market Overview

• 1.1 Objectives of Research
  • 1.1.1 Definition
  • 1.1.2 Specifications
• 1.2 Market Segment
  • 1.2.1 by Type
    • 1.2.1.1 Single-Sided Boards
    • 1.2.1.2 Double-Sided Boards
    • 1.2.1.3 Multilayer Circuit Board
  • 1.2.2 by Application
    • 1.2.2.1 Electronic Industry
    • 1.2.2.2 Intelligent Control Equipment
  • 1.2.3 by Regions

2 Industry Chain

• 2.1 Industry Chain Structure
• 2.2 Upstream
• 2.3 Market
  • 2.3.1 SWOT
  • 2.3.2 Dynamics

3 Environmental Analysis

• 3.1 Policy
• 3.2 Economic
• 3.3 Technology
• 3.4 Market Entry

4 Market Segmentation by Type

• 4.1 Market Size
  • 4.1.1 Single-Sided Boards Market, 2013-2018
  • 4.1.2 Double-Sided Boards Market, 2013-2018
  • 4.1.3 Multilayer Circuit Board Market, 2013-2018
• 4.2 Market Forecast
  • 4.2.1 Single-Sided Boards Market Forecast, 2019-2024
  • 4.2.2 Double-Sided Boards Market Forecast, 2019-2024
  • 4.2.3 Multilayer Circuit Board Market Forecast, 2019-2024

5 Market Segmentation by Application

• 5.1 Market Size
  • 5.1.1 Electronic Industry Market, 2013-2018
  • 5.1.2 Intelligent Control Equipment Market, 2013-2018
• 5.2 Market Forecast
  • 5.2.1 Electronic Industry Market Forecast, 2019-2024
  • 5.2.2 Intelligent Control Equipment Market Forecast, 2019-2024

6 Market Segmentation by Region

• 6.1 Market Size
  • 6.1.1 Asia-Pacific
    • 6.1.1.1 Asia-Pacific Market, 2012-2018
    • 6.1.1.2 Asia-Pacific Market by Type
    • 6.1.1.3 Asia-Pacific Market by Application
  • 6.1.2 North America
    • 6.1.2.1 North America Market, 2012-2018
    • 6.1.2.2 North America Market by Type
    • 6.1.2.3 North America Market by Application
  • 6.1.3 Europe
    • 6.1.3.1 Europe Market, 2012-2018
    • 6.1.3.2 Europe Market by Type
    • 6.1.3.3 Europe Market by Application
  • 6.1.4 South America
    • 6.1.4.1 South America Market, 2012-2018
    • 6.1.4.2 South America Market by Type
    • 6.1.4.3 South America Market by Application
  • 6.1.5 Middle East & Africa
    • 6.1.5.1 Middle East & Africa Market, 2012-2018
    • 6.1.5.2 Middle East & Africa Market by Type
    • 6.1.5.3 Middle East & Africa Market by Application
• 6.2 Market Forecast
  • 6.2.1 Asia-Pacific Market Forecast, 2019-2024
  • 6.2.2 North America Market Forecast, 2019-2024
  • 6.2.3 Europe Market Forecast, 2019-2024
  • 6.2.4 South America Market Forecast, 2019-2024
  • 6.2.5 Middle East & Africa Market Forecast, 2019-2024

7 Market Competitive

• 7.1 Global Market by Vendors
• 7.2 Market Concentration
• 7.3 Price & Factors
• 7.4 Marketing Channel

8 Major Vendors

• 8.1 Mektec(Japan)
• 8.2 IBIDEN(Japan)
• 8.3 Samsung Electro-Mechanics(Korea)
• 8.4 AT&S(Austria)
• 8.5 TTM(US)
• 8.6 Unimicron(Taiwan, China)
• 8.7 Zhen Ding Tech(Taiwan, China)
• 8.8 Sumitomo Electric Industries(Japan)
• 8.9 MFS(Singapore)
• 8.10 YoungPoong(Korea)
• 8.11 CMK(Japan)
• 8.12 Founder(China)
• 8.13 SCC(China)
• 8.14 CCTC(China)
• 8.15 Nippon Mektron(Japan)
• 8.16 Foxconn(Taiwan, China)
• 8.17 Tripod(Taiwan, China)
• 8.18 Sumitomo Denko(Japan)
• 8.19 Daeduck Group(Korea)
• 8.20 HannStar Board (GBM) (Taiwan, China)
• 8.21 Viasystems(US)
• 8.22 Nanya PCB(Taiwan, China)
• 8.23 Kingboard PCB Group(China Hong Kong)
• 8.24 Shinko Electric Ind(Japan)
• 8.25 Mflex(US)
• 8.26 Compeq Mfg(Taiwan, China)
• 8.27 Meiko Electronics(Japan)

9 Conclusion