Lamination is a technique wherein the material is permanently assembled by heating, pressuring, welding, or by use of adhesives. This technique improves the properties of a material such as strength, durability, appearance, stability, and others. Printed circuit board (PCB) laminate involves lamination of a circuit with a non-conductive material. PCB laminates connect and support the electronic components using pads, conductive tracks, and other features etched from copper sheets laminated onto a non-conductive substrate. PCB laminations are widely used in one copper layer PCB, two copper layer PCB, or outer & inner layer PCB.
In 2019, the market size of Printed Circuit Board Laminate is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Printed Circuit Board Laminate.
This report studies the global market size of Printed Circuit Board Laminate, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Printed Circuit Board Laminate production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
Unimicron Technology Corp.
Nippon Mektron
Samsung Electro-Mechanics
Zhen Ding Technology Holding Limited
Young Poong Electronics Co., Ltd.
Daeduck Electronics Co., Ltd.
Ibiden Co., Ltd.
Tripod Technology Corporation
TTM Technologies, Inc.
Austria Technologie & Systemtechnik AG
Market Segment by Product Type
Polyimide
FR-4
CEM
Paper
Others
Market Segment by Application
Automotive
Communications
Industrial Electronics
Consumer Electronics
Aerospace & Defense
Others
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Printed Circuit Board Laminate status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Printed Circuit Board Laminate manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Printed Circuit Board Laminate are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
Summary:
Get latest Market Research Reports on Printed Circuit Board Laminate. Industry analysis & Market Report on Printed Circuit Board Laminate is a syndicated market report, published as Global (United States, European Union and China) Printed Circuit Board Laminate Market Research Report 2019-2025. It is complete Research Study and Industry Analysis of Printed Circuit Board Laminate market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.