Report Detail
Global New Packages and Materials for Power Devices Market Insights, Forecast to 2025
- RnM3315278 |
- 12 April, 2019 |
- Global |
- 112 Pages |
- QYResearch |
- Electronics & Semiconductor
SIC (silicon carbide) and GaN (gallium nitride) have emerged as the preferred material for making packages for high-intensity semiconductors and power devices. Such materials can support high temperature power circuits and withstand high voltage.
At the same time the power semiconductor market is undergoing a period of change. Driven by the need for increased power density and system efficiency, wide band gap (WBG) materials such as SiC and gallium nitride (GaN) are being adopted in many applications. These WBG devices require new packages, materials, and assembly methods.
The New Packages and Materials for Power Devices market was valued at xx Million US$ in 2018 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for New Packages and Materials for Power Devices.
This report presents the worldwide New Packages and Materials for Power Devices market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
Littelfuse
Remtec, Inc.
MITSUBISHI ELECTRIC CORPORATION
Amkor Technology
Orient Semiconductor Electronics Ltd.
Infineon Technologies AG
SEMIKRON
ROHM SEMICONDUCTOR
STMicroelectronics
NXP Semiconductor
Exagan
ON Semiconductor
Efficient Power Conversion Corporation
New Packages and Materials for Power Devices Breakdown Data by Type
Wire Bonding Packaging
Gallium Nitrid (GaN)
Chip-scale Packaging
Gallium Arsenide
Silicon Carbide
Others
New Packages and Materials for Power Devices Breakdown Data by Application
Telecommunications and Computing
Industrial
Electronics
Automotive
Others
New Packages and Materials for Power Devices Production by Region
United States
Europe
China
Japan
South Korea
Other Regions
New Packages and Materials for Power Devices Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global New Packages and Materials for Power Devices status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key New Packages and Materials for Power Devices manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of New Packages and Materials for Power Devices :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (MT). Both top-down and bottom-up approaches have been used to estimate and validate the market size of New Packages and Materials for Power Devices market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Table of Contents
1 Study Coverage
- 1.1 New Packages and Materials for Power Devices Product
- 1.2 Key Market Segments in This Study
- 1.3 Key Manufacturers Covered
- 1.4 Market by Type
- 1.4.1 Global New Packages and Materials for Power Devices Market Size Growth Rate by Type
- 1.4.2 Wire Bonding Packaging
- 1.4.3 Gallium Nitrid (GaN)
- 1.4.4 Chip-scale Packaging
- 1.4.5 Gallium Arsenide
- 1.4.6 Silicon Carbide
- 1.4.7 Others
- 1.5 Market by Application
- 1.5.1 Global New Packages and Materials for Power Devices Market Size Growth Rate by Application
- 1.5.2 Telecommunications and Computing
- 1.5.3 Industrial
- 1.5.4 Electronics
- 1.5.5 Automotive
- 1.5.6 Others
- 1.6 Study Objectives
- 1.7 Years Considered
2 Executive Summary
- 2.1 Global New Packages and Materials for Power Devices Market Size
- 2.1.1 Global New Packages and Materials for Power Devices Revenue 2014-2025
- 2.1.2 Global New Packages and Materials for Power Devices Production 2014-2025
- 2.2 New Packages and Materials for Power Devices Growth Rate (CAGR) 2019-2025
- 2.3 Analysis of Competitive Landscape
- 2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
- 2.3.2 Key New Packages and Materials for Power Devices Manufacturers
- 2.3.2.1 New Packages and Materials for Power Devices Manufacturing Base Distribution, Headquarters
- 2.3.2.2 Manufacturers New Packages and Materials for Power Devices Product Offered
- 2.3.2.3 Date of Manufacturers Enter into New Packages and Materials for Power Devices Market
- 2.4 Key Trends for New Packages and Materials for Power Devices Markets & Products
3 Market Size by Manufacturers
- 3.1 New Packages and Materials for Power Devices Production by Manufacturers
- 3.1.1 New Packages and Materials for Power Devices Production by Manufacturers
- 3.1.2 New Packages and Materials for Power Devices Production Market Share by Manufacturers
- 3.2 New Packages and Materials for Power Devices Revenue by Manufacturers
- 3.2.1 New Packages and Materials for Power Devices Revenue by Manufacturers (2014-2019)
- 3.2.2 New Packages and Materials for Power Devices Revenue Share by Manufacturers (2014-2019)
- 3.3 New Packages and Materials for Power Devices Price by Manufacturers
- 3.4 Mergers & Acquisitions, Expansion Plans
4 New Packages and Materials for Power Devices Production by Regions
- 4.1 Global New Packages and Materials for Power Devices Production by Regions
- 4.1.1 Global New Packages and Materials for Power Devices Production Market Share by Regions
- 4.1.2 Global New Packages and Materials for Power Devices Revenue Market Share by Regions
- 4.2 United States
- 4.2.1 United States New Packages and Materials for Power Devices Production
- 4.2.2 United States New Packages and Materials for Power Devices Revenue
- 4.2.3 Key Players in United States
- 4.2.4 United States New Packages and Materials for Power Devices Import & Export
- 4.3 Europe
- 4.3.1 Europe New Packages and Materials for Power Devices Production
- 4.3.2 Europe New Packages and Materials for Power Devices Revenue
- 4.3.3 Key Players in Europe
- 4.3.4 Europe New Packages and Materials for Power Devices Import & Export
- 4.4 China
- 4.4.1 China New Packages and Materials for Power Devices Production
- 4.4.2 China New Packages and Materials for Power Devices Revenue
- 4.4.3 Key Players in China
- 4.4.4 China New Packages and Materials for Power Devices Import & Export
- 4.5 Japan
- 4.5.1 Japan New Packages and Materials for Power Devices Production
- 4.5.2 Japan New Packages and Materials for Power Devices Revenue
- 4.5.3 Key Players in Japan
- 4.5.4 Japan New Packages and Materials for Power Devices Import & Export
- 4.6 South Korea
- 4.6.1 South Korea New Packages and Materials for Power Devices Production
- 4.6.2 South Korea New Packages and Materials for Power Devices Revenue
- 4.6.3 Key Players in South Korea
- 4.6.4 South Korea New Packages and Materials for Power Devices Import & Export
- 4.7 Other Regions
- 4.7.1 Taiwan
- 4.7.2 India
- 4.7.3 Southeast Asia
5 New Packages and Materials for Power Devices Consumption by Regions
- 5.1 Global New Packages and Materials for Power Devices Consumption by Regions
- 5.1.1 Global New Packages and Materials for Power Devices Consumption by Regions
- 5.1.2 Global New Packages and Materials for Power Devices Consumption Market Share by Regions
- 5.2 North America
- 5.2.1 North America New Packages and Materials for Power Devices Consumption by Application
- 5.2.2 North America New Packages and Materials for Power Devices Consumption by Countries
- 5.2.3 United States
- 5.2.4 Canada
- 5.2.5 Mexico
- 5.3 Europe
- 5.3.1 Europe New Packages and Materials for Power Devices Consumption by Application
- 5.3.2 Europe New Packages and Materials for Power Devices Consumption by Countries
- 5.3.3 Germany
- 5.3.4 France
- 5.3.5 UK
- 5.3.6 Italy
- 5.3.7 Russia
- 5.4 Asia Pacific
- 5.4.1 Asia Pacific New Packages and Materials for Power Devices Consumption by Application
- 5.4.2 Asia Pacific New Packages and Materials for Power Devices Consumption by Countries
- 5.4.3 China
- 5.4.4 Japan
- 5.4.5 South Korea
- 5.4.6 India
- 5.4.7 Australia
- 5.4.8 Indonesia
- 5.4.9 Thailand
- 5.4.10 Malaysia
- 5.4.11 Philippines
- 5.4.12 Vietnam
- 5.5 Central & South America
- 5.5.1 Central & South America New Packages and Materials for Power Devices Consumption by Application
- 5.5.2 Central & South America New Packages and Materials for Power Devices Consumption by Country
- 5.5.3 Brazil
- 5.6 Middle East and Africa
- 5.6.1 Middle East and Africa New Packages and Materials for Power Devices Consumption by Application
- 5.6.2 Middle East and Africa New Packages and Materials for Power Devices Consumption by Countries
- 5.6.3 GCC Countries
- 5.6.4 Egypt
- 5.6.5 South Africa
6 Market Size by Type
- 6.1 Global New Packages and Materials for Power Devices Production by Type
- 6.2 Global New Packages and Materials for Power Devices Revenue by Type
- 6.3 New Packages and Materials for Power Devices Price by Type
7 Market Size by Application
- 7.1 Overview
- 7.2 Global New Packages and Materials for Power Devices Breakdown Dada by Application
- 7.2.1 Global New Packages and Materials for Power Devices Consumption by Application
- 7.2.2 Global New Packages and Materials for Power Devices Consumption Market Share by Application (2014-2019)
8 Manufacturers Profiles
- 8.1 Littelfuse
- 8.1.1 Littelfuse Company Details
- 8.1.2 Company Overview
- 8.1.3 Littelfuse New Packages and Materials for Power Devices Production Revenue and Gross Margin (2014-2019)
- 8.1.4 Littelfuse New Packages and Materials for Power Devices Product Description
- 8.1.5 Littelfuse Recent Development
- 8.2 Remtec, Inc.
- 8.2.1 Remtec, Inc. Company Details
- 8.2.2 Company Overview
- 8.2.3 Remtec, Inc. New Packages and Materials for Power Devices Production Revenue and Gross Margin (2014-2019)
- 8.2.4 Remtec, Inc. New Packages and Materials for Power Devices Product Description
- 8.2.5 Remtec, Inc. Recent Development
- 8.3 MITSUBISHI ELECTRIC CORPORATION
- 8.3.1 MITSUBISHI ELECTRIC CORPORATION Company Details
- 8.3.2 Company Overview
- 8.3.3 MITSUBISHI ELECTRIC CORPORATION New Packages and Materials for Power Devices Production Revenue and Gross Margin (2014-2019)
- 8.3.4 MITSUBISHI ELECTRIC CORPORATION New Packages and Materials for Power Devices Product Description
- 8.3.5 MITSUBISHI ELECTRIC CORPORATION Recent Development
- 8.4 Amkor Technology
- 8.4.1 Amkor Technology Company Details
- 8.4.2 Company Overview
- 8.4.3 Amkor Technology New Packages and Materials for Power Devices Production Revenue and Gross Margin (2014-2019)
- 8.4.4 Amkor Technology New Packages and Materials for Power Devices Product Description
- 8.4.5 Amkor Technology Recent Development
- 8.5 Orient Semiconductor Electronics Ltd.
- 8.5.1 Orient Semiconductor Electronics Ltd. Company Details
- 8.5.2 Company Overview
- 8.5.3 Orient Semiconductor Electronics Ltd. New Packages and Materials for Power Devices Production Revenue and Gross Margin (2014-2019)
- 8.5.4 Orient Semiconductor Electronics Ltd. New Packages and Materials for Power Devices Product Description
- 8.5.5 Orient Semiconductor Electronics Ltd. Recent Development
- 8.6 Infineon Technologies AG
- 8.6.1 Infineon Technologies AG Company Details
- 8.6.2 Company Overview
- 8.6.3 Infineon Technologies AG New Packages and Materials for Power Devices Production Revenue and Gross Margin (2014-2019)
- 8.6.4 Infineon Technologies AG New Packages and Materials for Power Devices Product Description
- 8.6.5 Infineon Technologies AG Recent Development
- 8.7 SEMIKRON
- 8.7.1 SEMIKRON Company Details
- 8.7.2 Company Overview
- 8.7.3 SEMIKRON New Packages and Materials for Power Devices Production Revenue and Gross Margin (2014-2019)
- 8.7.4 SEMIKRON New Packages and Materials for Power Devices Product Description
- 8.7.5 SEMIKRON Recent Development
- 8.8 ROHM SEMICONDUCTOR
- 8.8.1 ROHM SEMICONDUCTOR Company Details
- 8.8.2 Company Overview
- 8.8.3 ROHM SEMICONDUCTOR New Packages and Materials for Power Devices Production Revenue and Gross Margin (2014-2019)
- 8.8.4 ROHM SEMICONDUCTOR New Packages and Materials for Power Devices Product Description
- 8.8.5 ROHM SEMICONDUCTOR Recent Development
- 8.9 STMicroelectronics
- 8.9.1 STMicroelectronics Company Details
- 8.9.2 Company Overview
- 8.9.3 STMicroelectronics New Packages and Materials for Power Devices Production Revenue and Gross Margin (2014-2019)
- 8.9.4 STMicroelectronics New Packages and Materials for Power Devices Product Description
- 8.9.5 STMicroelectronics Recent Development
- 8.10 NXP Semiconductor
- 8.10.1 NXP Semiconductor Company Details
- 8.10.2 Company Overview
- 8.10.3 NXP Semiconductor New Packages and Materials for Power Devices Production Revenue and Gross Margin (2014-2019)
- 8.10.4 NXP Semiconductor New Packages and Materials for Power Devices Product Description
- 8.10.5 NXP Semiconductor Recent Development
- 8.11 Exagan
- 8.12 ON Semiconductor
- 8.13 Efficient Power Conversion Corporation
9 Production Forecasts
- 9.1 New Packages and Materials for Power Devices Production and Revenue Forecast
- 9.1.1 Global New Packages and Materials for Power Devices Production Forecast 2019-2025
- 9.1.2 Global New Packages and Materials for Power Devices Revenue Forecast 2019-2025
- 9.2 New Packages and Materials for Power Devices Production and Revenue Forecast by Regions
- 9.2.1 Global New Packages and Materials for Power Devices Revenue Forecast by Regions
- 9.2.2 Global New Packages and Materials for Power Devices Production Forecast by Regions
- 9.3 New Packages and Materials for Power Devices Key Producers Forecast
- 9.3.1 United States
- 9.3.2 Europe
- 9.3.3 China
- 9.3.4 Japan
- 9.3.5 South Korea
- 9.4 Forecast by Type
- 9.4.1 Global New Packages and Materials for Power Devices Production Forecast by Type
- 9.4.2 Global New Packages and Materials for Power Devices Revenue Forecast by Type
10 Consumption Forecast
- 10.1 New Packages and Materials for Power Devices Consumption Forecast by Application
- 10.2 New Packages and Materials for Power Devices Consumption Forecast by Regions
- 10.3 North America Market Consumption Forecast
- 10.3.1 North America New Packages and Materials for Power Devices Consumption Forecast by Regions 2019-2025
- 10.3.2 United States
- 10.3.3 Canada
- 10.3.4 Mexico
- 10.4 Europe Market Consumption Forecast
- 10.4.1 Europe New Packages and Materials for Power Devices Consumption Forecast by Regions 2019-2025
- 10.4.2 Germany
- 10.4.3 France
- 10.4.4 UK
- 10.4.5 Italy
- 10.4.6 Russia
- 10.5 Asia Pacific Market Consumption Forecast
- 10.5.1 Asia Pacific New Packages and Materials for Power Devices Consumption Forecast by Regions 2019-2025
- 10.5.2 China
- 10.5.3 Japan
- 10.5.4 South Korea
- 10.5.5 India
- 10.5.6 Australia
- 10.5.7 Indonesia
- 10.5.8 Thailand
- 10.5.9 Malaysia
- 10.5.10 Philippines
- 10.5.11 Vietnam
- 10.6 Central & South America Market Consumption Forecast
- 10.6.1 Central & South America New Packages and Materials for Power Devices Consumption Forecast by Regions 2019-2025
- 10.6.2 Brazil
- 10.7 Middle East and Africa Market Consumption Forecast
- 10.7.1 Middle East and Africa New Packages and Materials for Power Devices Consumption Forecast by Regions 2019-2025
- 10.7.2 GCC Countries
- 10.7.3 Egypt
- 10.7.4 South Africa
11 Value Chain and Sales Channels Analysis
- 11.1 Value Chain Analysis
- 11.2 Sales Channels Analysis
- 11.2.1 New Packages and Materials for Power Devices Sales Channels
- 11.2.2 New Packages and Materials for Power Devices Distributors
- 11.3 New Packages and Materials for Power Devices Customers
12 Market Opportunities & Challenges, Risks and Influences Factors Analysis
- 12.1 Market Opportunities and Drivers
- 12.2 Market Challenges
- 12.3 Market Risks/Restraints
13 Key Findings in the Global New Packages and Materials for Power Devices Study
14 Appendix
- 14.1 Research Methodology
- 14.1.1 Methodology/Research Approach
- 14.1.1.1 Research Programs/Design
- 14.1.1.2 Market Size Estimation
- 14.1.1.3 Market Breakdown and Data Triangulation
- 14.1.2 Data Source
- 14.1.2.1 Secondary Sources
- 14.1.2.2 Primary Sources
- 14.1.1 Methodology/Research Approach
- 14.2 Author Details
Summary:
Get latest Market Research Reports on New Packages and Materials for Power Devices . Industry analysis & Market Report on New Packages and Materials for Power Devices is a syndicated market report, published as Global New Packages and Materials for Power Devices Market Insights, Forecast to 2025. It is complete Research Study and Industry Analysis of New Packages and Materials for Power Devices market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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