Global Multilayer Printed-wiring Board Market Data Survey Report 2013-2025

Table of Contents
1 Global Market Overview
1.1 Scope of Statistics
1.1.1 Scope of Products
1.1.2 Scope of Manufacturers
1.1.3 Scope of Application
1.1.4 Scope of Type
1.1.5 Scope of Regions/Countries
1.2 Global Market Size
2 Regional Market
2.1 Regional Production
2.2 Regional Demand
2.3 Regional Trade
3 Key Manufacturers
3.1 Nippon Mektron
3.1.1 Company Information
3.1.2 Product & Services
3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.1.4 Recent Development
3.2 Zhen Ding Technology
3.2.1 Company Information
3.2.2 Product & Services
3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.2.4 Recent Development
3.3 Unimicron
3.3.1 Company Information
3.3.2 Product & Services
3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.3.4 Recent Development
3.4 Young Poong Group
3.4.1 Company Information
3.4.2 Product & Services
3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.4.4 Recent Development
3.5 Samsung Electro-Mechanics
3.5.1 Company Information
3.5.2 Product & Services
3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.5.4 Recent Development
3.6 Ibiden
3.6.1 Company Information
3.6.2 Product & Services
3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.6.4 Recent Development
3.7 Tripod
3.7.1 Company Information
3.7.2 Product & Services
3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.7.4 Recent Development
3.8 TTM Technologies
3.8.1 Company Information
3.8.2 Product & Services
3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.8.4 Recent Development
3.9 Sumitomo Electric SEI
3.9.1 Company Information
3.9.2 Product & Services
3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.9.4 Recent Development
3.10 Daeduck Group
3.10.1 Company Information
3.10.2 Product & Services
3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.10.4 Recent Development
3.11 Nanya PCB
3.11.1 Company Information
3.11.2 Product & Services
3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.11.4 Recent Development
3.12 Compeq
3.12.1 Company Information
3.12.2 Product & Services
3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.12.4 Recent Development
3.13 HannStar Board
3.13.1 Company Information
3.13.2 Product & Services
3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.13.4 Recent Development
3.14 LG Innotek
3.14.1 Company Information
3.14.2 Product & Services
3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.14.4 Recent Development
3.15 AT&S
3.15.1 Company Information
3.15.2 Product & Services
3.15.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.15.4 Recent Development
3.16 Meiko
3.16.1 Company Information
3.16.2 Product & Services
3.16.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.16.4 Recent Development
3.17 Chin-Poon
3.17.1 Company Information
3.17.2 Product & Services
3.17.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.17.4 Recent Development
3.18 Shennan
3.18.1 Company Information
3.18.2 Product & Services
3.18.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.19 WUS
3.19.1 Company Information
3.19.2 Product & Services
3.19.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
4 Major Application
4.1 Consumer electronics
4.1.1 Overview
4.1.2 Consumer electronics Market Size and Forecast
4.2 Communications
4.2.1 Overview
4.2.2 Communications Market Size and Forecast
4.3 Computer related industry
4.3.1 Overview
4.3.2 Computer related industry Market Size and Forecast
4.4 Automotive industry
4.4.1 Overview
4.4.2 Automotive industry Market Size and Forecast
4.5 Others
4.5.1 Overview
4.5.2 Others Market Size and Forecast
5 Market by Type
5.By Layer 4~6
5.1 Layer 4~6
5.1.1 Overview
5.1.2 Layer 4~6 Market Size and Forecast
5.2 Layer 8~10
5.2.1 Overview
5.2.2 Layer 8~10 Market Size and Forecast
5.3 Layer 10+
5.3.1 Overview
5.3.2 Layer 10+ Market Size and Forecast
6 Price Overview
6.1 Price by Manufacturers
6.2 Price by Application
6.3 Price by Type
7 Conclusion