Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.
Most PCB manufacturers are finding the demand for multilayer boards increasing by leaps and bounds. This growing demand is fed by the need for smaller, lighter boards for use in electrical devices, military equipment, healthcare miniaturization, and an expanding market for smart devices incorporated in home automation systems.
Smartphones and computers are perfect applications for multilayer PCBs with their need for compactness and light weight, yet sophisticated functionality.
Within the PCB market, the communication industry is expected to remain the largest market. Continuous innovations in smartphones and increasing demand from emerging economies are expected to spur growth for this segment over the forecast period.
According to this study, over the next five years the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market will register a 1.9% CAGR in terms of revenue, the global market size will reach US$ 25700 million by 2024, from US$ 23000 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market by product type, application, key manufacturers and key regions and countries.
This study considers the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Layer 4-6
Layer 8-10
Layer 10+
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Consumer Electronics
Communications
Computer Related Industry
Automotive Industry
Other
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Nippon Mektron
ZD Tech
TTM Technologies
Unimicron
Sumitomo Denko
Compeq
Tripod
Samsung E-M
Young Poong Group
HannStar
Ibiden
Nanya PCB
KBC PCB Group
Daeduck Group
AT&S
Fujikura
Meiko
Multek
Kinsus
Chin Poon
T.P.T.
Shinko Denski
Wus Group
Simmtech
Mflex
CMK
LG Innotek
Gold Circuit
Shennan Circuit
Ellington
Kinwong
Founder Tech
Dynamic
Aoshikang
Wuzhou
CCTC
SZ Fast Print
Guangdong Xinda
Shenzhen Suntak
Redboard
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market by identifying its various subsegments.
Focuses on the key global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Summary:
Get latest Market Research Reports on Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) . Industry analysis & Market Report on Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) is a syndicated market report, published as Global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Market Growth 2019-2024. It is complete Research Study and Industry Analysis of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.