Global and United States Multi-chip Module (MCM) Packaging Market Report & Forecast 2022-2028

A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits (ICs or "chips"), semiconductor dies and or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC.
Market Analysis and Insights: Global and United States Multi-chip Module (MCM) Packaging Market

This report focuses on global and United States Multi-chip Module (MCM) Packaging market, also covers the segmentation data of other regions in regional level and county level.

Due to the COVID-19 pandemic, the global Multi-chip Module (MCM) Packaging market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, by Type, MCM-D accounting for % of the Multi-chip Module (MCM) Packaging global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While by Application, PC was the leading segment, accounting for over percent market share in 2021, and altered to an % CAGR throughout this forecast period.

In United States the Multi-chip Module (MCM) Packaging market size is expected to grow from US$ million in 2021 to US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.

Global Multi-chip Module (MCM) Packaging Scope and Market Size

Multi-chip Module (MCM) Packaging market is segmented by region (country), players, by Type and by Application. Players, stakeholders, and other participants in the global Multi-chip Module (MCM) Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application for the period 2017-2028.

For United States market, this report focuses on the Multi-chip Module (MCM) Packaging market size by players, by Type and by Application, for the period 2017-2028. The key players include the global and local players, which play important roles in United States.

Segment by Type, the Multi-chip Module (MCM) Packaging market is segmented into

MCM-D

MCM-C

MCM-L

Segment by Application, the Multi-chip Module (MCM) Packaging market is segmented into

PC

SSD

Consumer Electronics

Others

Regional and Country-level Analysis

By Region

North America

United States

Canada

Europe

Germany

France

U.K.

Italy

Russia

Asia-Pacific

China

Japan

South Korea

India

Australia

China Taiwan

Indonesia

Thailand

Malaysia

Latin America

Mexico

Brazil

Argentina

Colombia

Middle East & Africa

Turkey

Saudi Arabia

UAE

Competitive Landscape and Multi-chip Module (MCM) Packaging Market Share Analysis

Multi-chip Module (MCM) Packaging market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2017-2022. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2017-2022. Details included are company description, major business, company total revenue and the sales, revenue generated in Multi-chip Module (MCM) Packaging business, the date to enter into the Multi-chip Module (MCM) Packaging market, Multi-chip Module (MCM) Packaging product introduction, recent developments, etc.

The major vendors covered:

Cypress

Samsung

Micron Technology

Winbond

Macronix

ISSI

Eon

Microchip

SK Hynix

Intel

Texas Instruments

ASE

Amkor

IBM

Qorvo