According to our (Global Info Research) latest study, the global Memory Semiconductor Packaging market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Since the outbreak of the epidemic in 2020, remote office, online education, streaming media and other applications have triggered an increase in demand for consumer electronics and cloud services, and the global Digital transformation has accelerated. At the same time, the semiconductor industry, including storage chips, has formed a global comprehensive shortage wave that has lasted for nearly two years due to sudden demand and accelerated supply chain hoarding.
However, since the third quarter of 2021, the comprehensive shortage of supply and demand has transformed into a structural imbalance between supply and demand. The phenomenon of long and short materials continues to ferment in major end markets, and the inventory level of enterprises is gradually piling up, leading to a cycle of inventory adjustment downstream. In 2022, under the impact of a series of events such as the Russia-Ukraine conflict, the resurgence of the epidemic, and rising inflation, the risk of global economic downturn has intensified. The demand for smart phones, PCs and other technology products is rapidly declining. The dilemma of "low demand and high inventory" is constantly fermenting, leading to a rapid change in the supply and demand relationship. The market situation of oversupply has led to further decline in the market.
The three-year "pandemic dividend" has subsided, and 2022 has become a turning point, bringing the growth of the storage market to an end. According to the CFM flash memory market, the NAND Flash market capacity is expected to grow by 6% to 610 B GB in 2022, while the DRAM market capacity is expected to grow by 4% to 194 B Gb. Compared to the previous NAND Flash and DRAM, which maintained growth rates of over 30% and 20% respectively, the growth rates of 6% and 4% in 2022 are undoubtedly at historical lows. It is expected to return to the growth rates of 20% and 10% in 2023 under the premise of improved demand.
Packaging is an essential part of semiconductor manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level. The package is the container that holds the semiconductor die. The packaging may be done by a separate vendor, the OSAT, although foundries are expanding their packaging efforts. The package protects the die, connects the chip to a board or other chips, and may dissipate heat. This report focuses on Memory Semiconductor Packaging market.
This report is a detailed and comprehensive analysis for global Memory Semiconductor Packaging market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Memory Semiconductor Packaging market size and forecasts, in consumption value ($ Million), 2018-2029
Global Memory Semiconductor Packaging market size and forecasts by region and country, in consumption value ($ Million), 2018-2029
Global Memory Semiconductor Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), 2018-2029
Global Memory Semiconductor Packaging market shares of main players, in revenue ($ Million), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Memory Semiconductor Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Memory Semiconductor Packaging market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Samsung, Micron, Hynix, Amkor and YMTC and etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market segmentation
Memory Semiconductor Packaging market is split by Type and by Application. For the period 2018-2029, the growth among segments provide accurate calculations and forecasts for consumption value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
OSATs
IDM
Market segment by Application
DRAM
3D NAND
SRAM
Others
Market segment by players, this report covers
Samsung
Micron
Hynix
Amkor
YMTC
CXMT
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
South America (Brazil, Argentina and Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Memory Semiconductor Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Memory Semiconductor Packaging, with revenue, gross margin and global market share of Memory Semiconductor Packaging from 2018 to 2023.
Chapter 3, the Memory Semiconductor Packaging competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2018 to 2029.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2018 to 2023.and Memory Semiconductor Packaging market forecast, by regions, type and application, with consumption value, from 2024 to 2029.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War
Chapter 12, the key raw materials and key suppliers, and industry chain of Memory Semiconductor Packaging.
Chapter 13, to describe Memory Semiconductor Packaging research findings and conclusion.
Summary:
Get latest Market Research Reports on Memory Semiconductor Packaging. Industry analysis & Market Report on Memory Semiconductor Packaging is a syndicated market report, published as Global Memory Semiconductor Packaging Market 2023 by Company, Regions, Type and Application, Forecast to 2029. It is complete Research Study and Industry Analysis of Memory Semiconductor Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.