Lead-free solder paste is a solder paste without contain lead. Solder paste is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through hole pin in paste components by printing solder paste in/over the holes. The paste initially adheres components in place by being sticky, it is then heated (along with the rest of the board) melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe and then the components are put in place by a pick-and-place machine or by hand.
Based on the Lead-Free Solder Paste market development status, competitive landscape and development model in different regions of the world, this report is dedicated to providing niche markets, potential risks and comprehensive competitive strategy analysis in different fields. From the competitive advantages of different types of products and services, the development opportunities and consumption characteristics and structure analysis of the downstream application fields are all analyzed in detail. To Boost Growth during the epidemic era, this report analyzes in detail for the potential risks and opportunities which can be focused on.
In Chapter 2.4 of the report, we share our perspectives for the impact of COVID-19 from the long and short term.
In chapter 3.4, we provide the influence of the crisis on the industry chain, especially for marketing channels.
In chapters 8-13, we update the timely industry economic revitalization plan of the country-wise government.
Key players in the global Lead-Free Solder Paste market covered in Chapter 5:
KOKI
Weiteou
Union Soltek Group
Nihon Almit
Yashida
Zhongya Electronic Solder
Nordson
Alpha
Senju Metal Industry
Guangchen Metal Products
Interflux Electronics
Kester
DongGuan Legret Metal
Nihon Superior
MG Chemicals
Yanktai Microelectronic Material
Tongfang Tech
Nihon Genma Mfg
AMTECH
Tamura
Shenzhen Bright
Indium Corporation
AIM Solder
Henkel AG & Co
Tianjin Songben
Balver Zinn Josef Jost
Uchihashi Estec
Chengxing Group
Huaqing Solder
Qualitek
In Chapter 6, on the basis of types, the Lead-Free Solder Paste market from 2015 to 2025 is primarily split into:
Low-temperature lead-free solder paste
Middle and Low-temperature lead-free solder paste
Middle -temperature lead-free solder paste
High-temperature lead-free solder paste
In Chapter 7, on the basis of applications, the Lead-Free Solder Paste market from 2015 to 2025 covers:
Wire board
PCB board
SMT
Other
Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2015-2025) of the following regions are covered in Chapter 8-13:
North America (Covered in Chapter 9)
United States
Canada
Mexico
Europe (Covered in Chapter 10)
Germany
UK
France
Italy
Spain
Russia
Others
Asia-Pacific (Covered in Chapter 11)
China
Japan
South Korea
Australia
India
South America (Covered in Chapter 12)
Brazil
Argentina
Columbia
Middle East and Africa (Covered in Chapter 13)
UAE
Egypt
South Africa
Years considered for this report:
Historical Years: 2015-2019
Base Year: 2019
Estimated Year: 2020
Forecast Period: 2020-2025
Summary:
Get latest Market Research Reports on Lead-Free Solder Paste. Industry analysis & Market Report on Lead-Free Solder Paste is a syndicated market report, published as Global Lead-Free Solder Paste Market Research Report with Opportunities and Strategies to Boost Growth- COVID-19 Impact and Recovery. It is complete Research Study and Industry Analysis of Lead-Free Solder Paste market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.