Laser grooving equipment for semiconductor is a kind of machine that through laser scribing, remove the Low-k substances in the wafer saw track and the coating formed by the metal wiring layer in advance, thereby reducing the occurrence of chip defects and improving chip production efficiency in the subsequent blade dicing process.
According to our (Global Info Research) latest study, the global Laser Grooving Equipment for Semiconductor market size was valued at US$ 415 million in 2023 and is forecast to a readjusted size of USD 1038 million by 2030 with a CAGR of 14.2% during review period.
Global top five manufacturers of laser grooving equipment for semiconductor occupied for a share over 80 percent, key players are DISCO, ASM Laser Separation International (ALSI), EO Technics, Wuhan DR Laser Technology and Delphi Laser etc. Geographically speaking, Japan holds the most of global market share, about 30%. China holds about 25% of share, while North America followed by nearly 20%. In terms of product, the type of 12 Inch is the largest segment, with a share over 45%. And in terms of application, the largest application is semiconductor wafer, which takes nearly 70%.
This report is a detailed and comprehensive analysis for global Laser Grooving Equipment for Semiconductor market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.
Key Features:
Global Laser Grooving Equipment for Semiconductor market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030
Global Laser Grooving Equipment for Semiconductor market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030
Global Laser Grooving Equipment for Semiconductor market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030
Global Laser Grooving Equipment for Semiconductor market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2019-2024
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Laser Grooving Equipment for Semiconductor
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Laser Grooving Equipment for Semiconductor market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO, ASMPT, EO Technics, Wuhan Dr Laser Technology, Delphi Laser, Synova, Suzhou Maxwell Technologies, Suzhou Lumi Laser Technology, Han's Laser Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Laser Grooving Equipment for Semiconductor market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
8 Inch
12 Inch
Others
Market segment by Application
Semiconductor Wafer
Solar Cells
Major players covered
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Laser Grooving Equipment for Semiconductor product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Laser Grooving Equipment for Semiconductor, with price, sales quantity, revenue, and global market share of Laser Grooving Equipment for Semiconductor from 2019 to 2024.
Chapter 3, the Laser Grooving Equipment for Semiconductor competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Laser Grooving Equipment for Semiconductor breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Laser Grooving Equipment for Semiconductor market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Laser Grooving Equipment for Semiconductor.
Chapter 14 and 15, to describe Laser Grooving Equipment for Semiconductor sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Laser Grooving Equipment for Semiconductor. Industry analysis & Market Report on Laser Grooving Equipment for Semiconductor is a syndicated market report, published as Global Laser Grooving Equipment for Semiconductor Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030. It is complete Research Study and Industry Analysis of Laser Grooving Equipment for Semiconductor market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.