Report Detail
Global Integrated Circuit Packaging Solder Ball Sales Market Report 2021
- RnM4291637 |
- 24 June, 2021 |
- Global |
- 143 Pages |
- QYResearch |
- Electronics & Semiconductor
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Market Analysis and Insights: Global Integrated Circuit Packaging Solder Ball Market
The global Integrated Circuit Packaging Solder Ball market was valued at US$ XX in 2020 and will reach US$ XX million by the end of 2027, growing at a CAGR of XX% during 2022-2027.
Global Integrated Circuit Packaging Solder Ball Scope and Market Size
The global Integrated Circuit Packaging Solder Ball market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Integrated Circuit Packaging Solder Ball market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.
Segment by Type
Lead Solder Ball
Lead Free Solder Ball
Segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others
The Integrated Circuit Packaging Solder Ball market is analysed and market size information is provided by regions (countries). Segment by Application, the Integrated Circuit Packaging Solder Ball market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.
By Company
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Jovy Systems
SK Hynix
1 Integrated Circuit Packaging Solder Ball Market Overview
- 1.1 Integrated Circuit Packaging Solder Ball Product Scope
- 1.2 Integrated Circuit Packaging Solder Ball Segment by Type
- 1.2.1 Global Integrated Circuit Packaging Solder Ball Sales by Type (2016 & 2021 & 2027)
- 1.2.2 Lead Solder Ball
- 1.2.3 Lead Free Solder Ball
- 1.3 Integrated Circuit Packaging Solder Ball Segment by Application
- 1.3.1 Global Integrated Circuit Packaging Solder Ball Sales Comparison by Application (2016 & 2021 & 2027)
- 1.3.2 BGA
- 1.3.3 CSP & WLCSP
- 1.3.4 Flip-Chip & Others
- 1.4 Integrated Circuit Packaging Solder Ball Market Estimates and Forecasts (2016-2027)
- 1.4.1 Global Integrated Circuit Packaging Solder Ball Market Size in Value Growth Rate (2016-2027)
- 1.4.2 Global Integrated Circuit Packaging Solder Ball Market Size in Volume Growth Rate (2016-2027)
- 1.4.3 Global Integrated Circuit Packaging Solder Ball Price Trends (2016-2027)
2 Integrated Circuit Packaging Solder Ball Estimates and Forecasts by Region
- 2.1 Global Integrated Circuit Packaging Solder Ball Market Size by Region: 2016 VS 2021 VS 2027
- 2.2 Global Integrated Circuit Packaging Solder Ball Retrospective Market Scenario by Region (2016-2021)
- 2.2.1 Global Integrated Circuit Packaging Solder Ball Sales Market Share by Region (2016-2021)
- 2.2.2 Global Integrated Circuit Packaging Solder Ball Revenue Market Share by Region (2016-2021)
- 2.3 Global Integrated Circuit Packaging Solder Ball Market Estimates and Forecasts by Region (2022-2027)
- 2.3.1 Global Integrated Circuit Packaging Solder Ball Sales Estimates and Forecasts by Region (2022-2027)
- 2.3.2 Global Integrated Circuit Packaging Solder Ball Revenue Forecast by Region (2022-2027)
- 2.4 Geographic Market Analysis: Market Facts & Figures
- 2.4.1 North America Integrated Circuit Packaging Solder Ball Estimates and Projections (2016-2027)
- 2.4.2 Europe Integrated Circuit Packaging Solder Ball Estimates and Projections (2016-2027)
- 2.4.3 China Integrated Circuit Packaging Solder Ball Estimates and Projections (2016-2027)
- 2.4.4 Japan Integrated Circuit Packaging Solder Ball Estimates and Projections (2016-2027)
- 2.4.5 Southeast Asia Integrated Circuit Packaging Solder Ball Estimates and Projections (2016-2027)
- 2.4.6 India Integrated Circuit Packaging Solder Ball Estimates and Projections (2016-2027)
3 Global Integrated Circuit Packaging Solder Ball Competition Landscape by Players
- 3.1 Global Top Integrated Circuit Packaging Solder Ball Players by Sales (2016-2021)
- 3.2 Global Top Integrated Circuit Packaging Solder Ball Players by Revenue (2016-2021)
- 3.3 Global Integrated Circuit Packaging Solder Ball Market Share by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Integrated Circuit Packaging Solder Ball as of 2020)
- 3.4 Global Integrated Circuit Packaging Solder Ball Average Price by Company (2016-2021)
- 3.5 Manufacturers Integrated Circuit Packaging Solder Ball Manufacturing Sites, Area Served, Product Type
- 3.6 Manufacturers Mergers & Acquisitions, Expansion Plans
4 Global Integrated Circuit Packaging Solder Ball Market Size by Type
- 4.1 Global Integrated Circuit Packaging Solder Ball Historic Market Review by Type (2016-2021)
- 4.1.1 Global Integrated Circuit Packaging Solder Ball Sales Market Share by Type (2016-2021)
- 4.1.2 Global Integrated Circuit Packaging Solder Ball Revenue Market Share by Type (2016-2021)
- 4.1.3 Global Integrated Circuit Packaging Solder Ball Price by Type (2016-2021)
- 4.2 Global Integrated Circuit Packaging Solder Ball Market Estimates and Forecasts by Type (2022-2027)
- 4.2.1 Global Integrated Circuit Packaging Solder Ball Sales Forecast by Type (2022-2027)
- 4.2.2 Global Integrated Circuit Packaging Solder Ball Revenue Forecast by Type (2022-2027)
- 4.2.3 Global Integrated Circuit Packaging Solder Ball Price Forecast by Type (2022-2027)
5 Global Integrated Circuit Packaging Solder Ball Market Size by Application
- 5.1 Global Integrated Circuit Packaging Solder Ball Historic Market Review by Application (2016-2021)
- 5.1.1 Global Integrated Circuit Packaging Solder Ball Sales Market Share by Application (2016-2021)
- 5.1.2 Global Integrated Circuit Packaging Solder Ball Revenue Market Share by Application (2016-2021)
- 5.1.3 Global Integrated Circuit Packaging Solder Ball Price by Application (2016-2021)
- 5.2 Global Integrated Circuit Packaging Solder Ball Market Estimates and Forecasts by Application (2022-2027)
- 5.2.1 Global Integrated Circuit Packaging Solder Ball Sales Forecast by Application (2022-2027)
- 5.2.2 Global Integrated Circuit Packaging Solder Ball Revenue Forecast by Application (2022-2027)
- 5.2.3 Global Integrated Circuit Packaging Solder Ball Price Forecast by Application (2022-2027)
6 North America Integrated Circuit Packaging Solder Ball Market Facts & Figures
- 6.1 North America Integrated Circuit Packaging Solder Ball Sales by Company
- 6.1.1 North America Integrated Circuit Packaging Solder Ball Sales by Company (2016-2021)
- 6.1.2 North America Integrated Circuit Packaging Solder Ball Revenue by Company (2016-2021)
- 6.2 North America Integrated Circuit Packaging Solder Ball Sales Breakdown by Type
- 6.2.1 North America Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2016-2021)
- 6.2.2 North America Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2022-2027)
- 6.3 North America Integrated Circuit Packaging Solder Ball Sales Breakdown by Application
- 6.3.1 North America Integrated Circuit Packaging Solder Ball Sales Breakdown by Application (2016-2021)
- 6.3.2 North America Integrated Circuit Packaging Solder Ball Sales Breakdown by Application (2022-2027)
7 Europe Integrated Circuit Packaging Solder Ball Market Facts & Figures
- 7.1 Europe Integrated Circuit Packaging Solder Ball Sales by Company
- 7.1.1 Europe Integrated Circuit Packaging Solder Ball Sales by Company (2016-2021)
- 7.1.2 Europe Integrated Circuit Packaging Solder Ball Revenue by Company (2016-2021)
- 7.2 Europe Integrated Circuit Packaging Solder Ball Sales Breakdown by Type
- 7.2.1 Europe Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2016-2021)
- 7.2.2 Europe Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2022-2027)
- 7.3 Europe Integrated Circuit Packaging Solder Ball Sales Breakdown by Application
- 7.3.1 Europe 143 Sales Breakdown by Application (2016-2021)
- 7.3.2 Europe 143 Sales Breakdown by Application (2022-2027)
8 China Integrated Circuit Packaging Solder Ball Market Facts & Figures
- 8.1 China Integrated Circuit Packaging Solder Ball Sales by Company
- 8.1.1 China Integrated Circuit Packaging Solder Ball Sales by Company (2016-2021)
- 8.1.2 China Integrated Circuit Packaging Solder Ball Revenue by Company (2016-2021)
- 8.2 China Integrated Circuit Packaging Solder Ball Sales Breakdown by Type
- 8.2.1 China Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2016-2021)
- 8.2.2 China Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2022-2027)
- 8.3 China Integrated Circuit Packaging Solder Ball Sales Breakdown by Application
- 8.3.1 China 314 Sales Breakdown by Application (2016-2021)
- 8.3.2 China 314 Sales Breakdown by Application (2022-2027)
9 Japan Integrated Circuit Packaging Solder Ball Market Facts & Figures
- 9.1 Japan Integrated Circuit Packaging Solder Ball Sales by Company
- 9.1.1 Japan Integrated Circuit Packaging Solder Ball Sales by Company (2016-2021)
- 9.1.2 Japan Integrated Circuit Packaging Solder Ball Revenue by Company (2016-2021)
- 9.2 Japan Integrated Circuit Packaging Solder Ball Sales Breakdown by Type
- 9.2.1 Japan Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2016-2021)
- 9.2.2 Japan Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2022-2027)
- 9.3 Japan Integrated Circuit Packaging Solder Ball Sales Breakdown by Application
- 9.3.1 Japan Jan. Sales Breakdown by Application (2016-2021)
- 9.3.2 Japan Jan. Sales Breakdown by Application (2022-2027)
10 Southeast Asia Integrated Circuit Packaging Solder Ball Market Facts & Figures
- 10.1 Southeast Asia Integrated Circuit Packaging Solder Ball Sales by Company
- 10.1.1 Southeast Asia Integrated Circuit Packaging Solder Ball Sales by Company (2016-2021)
- 10.1.2 Southeast Asia Integrated Circuit Packaging Solder Ball Revenue by Company (2016-2021)
- 10.2 Southeast Asia Integrated Circuit Packaging Solder Ball Sales Breakdown by Type
- 10.2.1 Southeast Asia Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2016-2021)
- 10.2.2 Southeast Asia Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2022-2027)
- 10.3 Southeast Asia Integrated Circuit Packaging Solder Ball Sales Breakdown by Application
- 10.3.1 Southeast Asia M Units Sales Breakdown by Application (2016-2021)
- 10.3.2 Southeast Asia M Units Sales Breakdown by Application (2022-2027)
11 India Integrated Circuit Packaging Solder Ball Market Facts & Figures
- 11.1 India Integrated Circuit Packaging Solder Ball Sales by Company
- 11.1.1 India Integrated Circuit Packaging Solder Ball Sales by Company (2016-2021)
- 11.1.2 India Integrated Circuit Packaging Solder Ball Revenue by Company (2016-2021)
- 11.2 India Integrated Circuit Packaging Solder Ball Sales Breakdown by Type
- 11.2.1 India Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2016-2021)
- 11.2.2 India Integrated Circuit Packaging Solder Ball Sales Breakdown by Type (2022-2027)
- 11.3 India Integrated Circuit Packaging Solder Ball Sales Breakdown by Application
- 11.3.1 India Integrated Circuit Packaging Solder Ball Sales Breakdown by Application (2016-2021)
- 11.3.2 India Integrated Circuit Packaging Solder Ball Sales Breakdown by Application (2022-2027)
12 Company Profiles and Key Figures in Integrated Circuit Packaging Solder Ball Business
- 12.1 Senju Metal
- 12.1.1 Senju Metal Corporation Information
- 12.1.2 Senju Metal Business Overview
- 12.1.3 Senju Metal Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.1.4 Senju Metal Integrated Circuit Packaging Solder Ball Products Offered
- 12.1.5 Senju Metal Recent Development
- 12.2 DS HiMetal
- 12.2.1 DS HiMetal Corporation Information
- 12.2.2 DS HiMetal Business Overview
- 12.2.3 DS HiMetal Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.2.4 DS HiMetal Integrated Circuit Packaging Solder Ball Products Offered
- 12.2.5 DS HiMetal Recent Development
- 12.3 MKE
- 12.3.1 MKE Corporation Information
- 12.3.2 MKE Business Overview
- 12.3.3 MKE Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.3.4 MKE Integrated Circuit Packaging Solder Ball Products Offered
- 12.3.5 MKE Recent Development
- 12.4 YCTC
- 12.4.1 YCTC Corporation Information
- 12.4.2 YCTC Business Overview
- 12.4.3 YCTC Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.4.4 YCTC Integrated Circuit Packaging Solder Ball Products Offered
- 12.4.5 YCTC Recent Development
- 12.5 Accurus
- 12.5.1 Accurus Corporation Information
- 12.5.2 Accurus Business Overview
- 12.5.3 Accurus Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.5.4 Accurus Integrated Circuit Packaging Solder Ball Products Offered
- 12.5.5 Accurus Recent Development
- 12.6 PMTC
- 12.6.1 PMTC Corporation Information
- 12.6.2 PMTC Business Overview
- 12.6.3 PMTC Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.6.4 PMTC Integrated Circuit Packaging Solder Ball Products Offered
- 12.6.5 PMTC Recent Development
- 12.7 Shanghai hiking solder material
- 12.7.1 Shanghai hiking solder material Corporation Information
- 12.7.2 Shanghai hiking solder material Business Overview
- 12.7.3 Shanghai hiking solder material Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.7.4 Shanghai hiking solder material Integrated Circuit Packaging Solder Ball Products Offered
- 12.7.5 Shanghai hiking solder material Recent Development
- 12.8 Shenmao Technology
- 12.8.1 Shenmao Technology Corporation Information
- 12.8.2 Shenmao Technology Business Overview
- 12.8.3 Shenmao Technology Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.8.4 Shenmao Technology Integrated Circuit Packaging Solder Ball Products Offered
- 12.8.5 Shenmao Technology Recent Development
- 12.9 Nippon Micrometal
- 12.9.1 Nippon Micrometal Corporation Information
- 12.9.2 Nippon Micrometal Business Overview
- 12.9.3 Nippon Micrometal Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.9.4 Nippon Micrometal Integrated Circuit Packaging Solder Ball Products Offered
- 12.9.5 Nippon Micrometal Recent Development
- 12.10 Indium Corporation
- 12.10.1 Indium Corporation Corporation Information
- 12.10.2 Indium Corporation Business Overview
- 12.10.3 Indium Corporation Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.10.4 Indium Corporation Integrated Circuit Packaging Solder Ball Products Offered
- 12.10.5 Indium Corporation Recent Development
- 12.11 Jovy Systems
- 12.11.1 Jovy Systems Corporation Information
- 12.11.2 Jovy Systems Business Overview
- 12.11.3 Jovy Systems Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.11.4 Jovy Systems Integrated Circuit Packaging Solder Ball Products Offered
- 12.11.5 Jovy Systems Recent Development
- 12.12 SK Hynix
- 12.12.1 SK Hynix Corporation Information
- 12.12.2 SK Hynix Business Overview
- 12.12.3 SK Hynix Integrated Circuit Packaging Solder Ball Sales, Revenue and Gross Margin (2016-2021)
- 12.12.4 SK Hynix Integrated Circuit Packaging Solder Ball Products Offered
- 12.12.5 SK Hynix Recent Development
13 Integrated Circuit Packaging Solder Ball Manufacturing Cost Analysis
- 13.1 Integrated Circuit Packaging Solder Ball Key Raw Materials Analysis
- 13.1.1 Key Raw Materials
- 13.1.2 Key Raw Materials Price Trend
- 13.1.3 Key Suppliers of Raw Materials
- 13.2 Proportion of Manufacturing Cost Structure
- 13.3 Manufacturing Process Analysis of Integrated Circuit Packaging Solder Ball
- 13.4 Integrated Circuit Packaging Solder Ball Industrial Chain Analysis
14 Marketing Channel, Distributors and Customers
- 14.1 Marketing Channel
- 14.2 Integrated Circuit Packaging Solder Ball Distributors List
- 14.3 Integrated Circuit Packaging Solder Ball Customers
15 Market Dynamics
- 15.1 Integrated Circuit Packaging Solder Ball Market Trends
- 15.2 Integrated Circuit Packaging Solder Ball Drivers
- 15.3 Integrated Circuit Packaging Solder Ball Market Challenges
- 15.4 Integrated Circuit Packaging Solder Ball Market Restraints
16 Research Findings and Conclusion
17 Appendix
- 17.1 Research Methodology
- 17.1.1 Methodology/Research Approach
- 17.1.2 Data Source
- 17.2 Author List
Summary:
Get latest Market Research Reports on Integrated Circuit Packaging Solder Ball. Industry analysis & Market Report on Integrated Circuit Packaging Solder Ball is a syndicated market report, published as Global Integrated Circuit Packaging Solder Ball Sales Market Report 2021. It is complete Research Study and Industry Analysis of Integrated Circuit Packaging Solder Ball market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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