This report studies the IC-Substrate market, IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Including Rigid Substrate, Flexible Substrate, Ceramic Substrates by Materials, and WB (wire bonding), FC (flip chip) IC-Substrate by packaging method. The IC-Substrate is mainly used for PC (Tablet, Laptop), Smart Phone, Wearable Devices and Other Devices. And PC (Tablet, Laptop) is the largest usage with the share of about 48%, followed by Smart Phone (35.5%).
The global average price of IC-Substrate is in the declining trend in 2012-2017, from about 817 $/m²in 2012 to 564 $/m² in 2016. And the price will be in declining trend while there are more and more players come.
Taiwan, Korea, Japan and China are the four largest sales market of IC-Substrate in the world in the past few years and it will keep the same position in the next years. And Japan is the largest customer of IC-Substrate in the world at present. Taiwan is the second largest market in the report with a consumption share of about 24% in 2016, followed by China with a share of 16%. Other key markets are Korea, USA, Europe, etc. which have the leading technology.
The IC-Substrate market was valued at xx Million US$ in 2018 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for IC-Substrate.
This report presents the worldwide IC-Substrate market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
Ibiden
Shinko
Kyocera
Eastern
TTM Technologies
Unimicron
Kinsus
Nanya
ASE
Semco
LG Innotek
Simmtech
Daeduck
KCC(Korea Circuit Company)
Zhen Ding Technology
AT&S
Shennan Circuit
ACCESS
Shenzhen Fastprint Circuit Tech
IC-Substrate Breakdown Data by Type
WB BGA Substrate
WB CSP Substrate
FC BGA Substrate
FC CSP Substrate
Other Types
IC-Substrate Breakdown Data by Application
PC (Tablet, Laptop)
Smart Phone
Wearable Devices (smart watch)
Other Applications
IC-Substrate Production by Region
United States
Europe
China
Japan
South Korea
Other Regions
IC-Substrate Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global IC-Substrate status and future forecast,involving, production, revenue, consumption, historical and forecast.
To present the key IC-Substrate manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of IC-Substrate :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (K m²). Both top-down and bottom-up approaches have been used to estimate and validate the market size of IC-Substrate market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Summary:
Get latest Market Research Reports on IC-Substrate. Industry analysis & Market Report on IC-Substrate is a syndicated market report, published as Global IC-Substrate Market Insights, Forecast to 2025. It is complete Research Study and Industry Analysis of IC-Substrate market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.