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Electronics & Semiconductor Global and United States IC Packaging Substrate (SUB) Market Report & Forecast 2022-2028

  • RnM4385598
    • |
  • 21 February, 2022
    • |
  • Global
    • |
  • 124 Pages
    • |
  • QYResearch
    • |
  • Electronics & Semiconductor

Summary:

Market Analysis and Insights: Global and United States IC Packaging Substrate (SUB) Market
This report focuses on global and United States IC Packaging Substrate (SUB) market, also covers the segmentation data of other regions in regional level and county level.
Due to the COVID-19 pandemic, the global IC Packaging Substrate (SUB) market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, by Type, Organic Substrate accounting for % of the IC Packaging Substrate (SUB) global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While by Application, Smart Phones was the leading segment, accounting for over percent market share in 2021, and altered to an % CAGR throughout this forecast period.
In United States the IC Packaging Substrate (SUB) market size is expected to grow from US$ million in 2021 to US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
Global IC Packaging Substrate (SUB) Scope and Market Size
IC Packaging Substrate (SUB) market is segmented by region (country), players, by Type and by Application. Players, stakeholders, and other participants in the global IC Packaging Substrate (SUB) market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
For United States market, this report focuses on the IC Packaging Substrate (SUB) market size by players, by Type and by Application, for the period 2017-2028. The key players include the global and local players, which play important roles in United States.
Segment by Type, the IC Packaging Substrate (SUB) market is segmented into
Organic Substrate
Inorganic Substrate
Composite Substrate
Segment by Application, the IC Packaging Substrate (SUB) market is segmented into
Smart Phones
PC (Tablet, Laptop)
Wearable Devices
Others
Regional and Country-level Analysis
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Competitive Landscape and IC Packaging Substrate (SUB) Market Share Analysis
IC Packaging Substrate (SUB) market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2017-2022. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2017-2022. Details included are company description, major business, company total revenue and the sales, revenue generated in IC Packaging Substrate (SUB) business, the date to enter into the IC Packaging Substrate (SUB) market, IC Packaging Substrate (SUB) product introduction, recent developments, etc.
The major vendors covered:
Samsung Electro-Mechanics
MST
NGK
KLA Corporation
Panasonic
Simmtech
Daeduck
ASE Material
Kyocera
Ibiden
Shinko Electric Industries
AT&S
LG InnoTek
Fastprint Circuit Tech
ACCESS
Danbond Technology
TTM Technologies
Unimicron
Nan Ya PCB
Kinsus
SCC


Table of Contents

    1 Study Coverage

    • 1.1 IC Packaging Substrate (SUB) Product Introduction
    • 1.2 Global IC Packaging Substrate (SUB) Outlook 2017 VS 2022 VS 2028
      • 1.2.1 Global IC Packaging Substrate (SUB) Sales in US$ Million for the Year 2017-2028
      • 1.2.2 Global IC Packaging Substrate (SUB) Sales in Volume for the Year 2017-2028
    • 1.3 United States IC Packaging Substrate (SUB) Outlook 2017 VS 2022 VS 2028
      • 1.3.1 United States IC Packaging Substrate (SUB) Sales in US$ Million for the Year 2017-2028
      • 1.3.2 United States IC Packaging Substrate (SUB) Sales in Volume for the Year 2017-2028
    • 1.4 IC Packaging Substrate (SUB) Market Size, United States VS Global, 2017 VS 2022 VS 2028
      • 1.4.1 The Market Share of United States IC Packaging Substrate (SUB) in Global, 2017 VS 2022 VS 2028
      • 1.4.2 The Growth Rate of IC Packaging Substrate (SUB) Market Size, United States VS Global, 2017 VS 2022 VS 2028
    • 1.5 IC Packaging Substrate (SUB) Market Dynamics
      • 1.5.1 IC Packaging Substrate (SUB) Industry Trends
      • 1.5.2 IC Packaging Substrate (SUB) Market Drivers
      • 1.5.3 IC Packaging Substrate (SUB) Market Challenges
      • 1.5.4 IC Packaging Substrate (SUB) Market Restraints
    • 1.6 Study Objectives
    • 1.7 Years Considered

    2 Market by Type

    • 2.1 IC Packaging Substrate (SUB) Market Segment by Type
      • 2.1.1 Organic Substrate
      • 2.1.2 Inorganic Substrate
      • 2.1.3 Composite Substrate
    • 2.2 Global IC Packaging Substrate (SUB) Market Size by Type
      • 2.2.1 Global IC Packaging Substrate (SUB) Sales in Value, by Type (2017, 2022 & 2028)
      • 2.2.2 Global IC Packaging Substrate (SUB) Sales in Volume, by Type (2017, 2022 & 2028)
      • 2.2.3 Global IC Packaging Substrate (SUB) Average Selling Price (ASP) by Type (2017, 2022 & 2028)
    • 2.3 United States IC Packaging Substrate (SUB) Market Size by Type
      • 2.3.1 United States IC Packaging Substrate (SUB) Sales in Value, by Type (2017, 2022 & 2028)
      • 2.3.2 United States IC Packaging Substrate (SUB) Sales in Volume, by Type (2017, 2022 & 2028)
      • 2.3.3 United States IC Packaging Substrate (SUB) Average Selling Price (ASP) by Type (2017, 2022 & 2028)

    3 Market by Application

    • 3.1 IC Packaging Substrate (SUB) Market Segment by Application
      • 3.1.1 Smart Phones
      • 3.1.2 PC (Tablet, Laptop)
      • 3.1.3 Wearable Devices
      • 3.1.4 Others
    • 3.2 Global IC Packaging Substrate (SUB) Market Size by Application
      • 3.2.1 Global IC Packaging Substrate (SUB) Sales in Value, by Application (2017, 2022 & 2028)
      • 3.2.2 Global IC Packaging Substrate (SUB) Sales in Volume, by Application (2017, 2022 & 2028)
      • 3.3.3 Global IC Packaging Substrate (SUB) Average Selling Price (ASP) by Application (2017, 2022 & 2028)
    • 3.3 United States IC Packaging Substrate (SUB) Market Size by Application
      • 3.3.1 United States IC Packaging Substrate (SUB) Sales in Value, by Application (2017, 2022 & 2028)
      • 3.3.2 United States IC Packaging Substrate (SUB) Sales in Volume, by Application (2017, 2022 & 2028)
      • 3.3.3 United States IC Packaging Substrate (SUB) Average Selling Price (ASP) by Application (2017, 2022 & 2028)

    4 Global IC Packaging Substrate (SUB) Competitor Landscape by Company

    • 4.1 Global IC Packaging Substrate (SUB) Market Size by Company
      • 4.1.1 Top Global IC Packaging Substrate (SUB) Manufacturers Ranked by Revenue (2021)
      • 4.1.2 Global IC Packaging Substrate (SUB) Revenue by Manufacturer (2017-2022)
      • 4.1.3 Global IC Packaging Substrate (SUB) Sales by Manufacturer (2017-2022)
      • 4.1.4 Global IC Packaging Substrate (SUB) Price by Manufacturer (2017-2022)
    • 4.2 Global IC Packaging Substrate (SUB) Concentration Ratio (CR)
      • 4.2.1 IC Packaging Substrate (SUB) Market Concentration Ratio (CR) (2017-2022)
      • 4.2.2 Global Top 5 and Top 10 Largest Manufacturers of IC Packaging Substrate (SUB) in 2021
      • 4.2.3 Global IC Packaging Substrate (SUB) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
    • 4.3 Global IC Packaging Substrate (SUB) Manufacturing Base Distribution, Product Type
      • 4.3.1 Global IC Packaging Substrate (SUB) Manufacturers, Headquarters and Distribution of Producing Region
      • 4.3.2 Manufacturers IC Packaging Substrate (SUB) Product Type
      • 4.3.3 Date of International Manufacturers Enter into IC Packaging Substrate (SUB) Market
    • 4.4 Manufacturers Mergers & Acquisitions, Expansion Plans
    • 4.5 United States IC Packaging Substrate (SUB) Market Size by Company
      • 4.5.1 Top IC Packaging Substrate (SUB) Players in United States, Ranked by Revenue (2021)
      • 4.5.2 United States IC Packaging Substrate (SUB) Revenue by Players (2020, 2021 & 2022)
      • 4.5.3 United States IC Packaging Substrate (SUB) Sales by Players (2020, 2021 & 2022)

    5 Global IC Packaging Substrate (SUB) Market Size by Region

    • 5.1 Global IC Packaging Substrate (SUB) Market Size by Region: 2017 VS 2022 VS 2028
    • 5.2 Global IC Packaging Substrate (SUB) Market Size in Volume by Region (2017-2028)
      • 5.2.1 Global IC Packaging Substrate (SUB) Sales in Volume by Region: 2017-2022
      • 5.2.2 Global IC Packaging Substrate (SUB) Sales in Volume Forecast by Region (2023-2028)
    • 5.3 Global IC Packaging Substrate (SUB) Market Size in Value by Region (2017-2028)
      • 5.3.1 Global IC Packaging Substrate (SUB) Sales in Value by Region: 2017-2022
      • 5.3.2 Global IC Packaging Substrate (SUB) Sales in Value by Region: 2023-2028

    6 Segment in Region Level & Country Level

    • 6.1 North America
      • 6.1.1 North America IC Packaging Substrate (SUB) Market Size YoY Growth 2017-2028
      • 6.1.2 North America IC Packaging Substrate (SUB) Market Facts & Figures by Country (2017, 2022 & 2028)
      • 6.1.3 United States
      • 6.1.4 Canada
    • 6.2 Asia-Pacific
      • 6.2.1 Asia-Pacific IC Packaging Substrate (SUB) Market Size YoY Growth 2017-2028
      • 6.2.2 Asia-Pacific IC Packaging Substrate (SUB) Market Facts & Figures by Region (2017, 2022 & 2028)
      • 6.2.3 China
      • 6.2.4 Japan
      • 6.2.5 South Korea
      • 6.2.6 India
      • 6.2.7 Australia
      • 6.2.8 China Taiwan
      • 6.2.9 Indonesia
      • 6.2.10 Thailand
      • 6.2.11 Malaysia
    • 6.3 Europe
      • 6.3.1 Europe IC Packaging Substrate (SUB) Market Size YoY Growth 2017-2028
      • 6.3.2 Europe IC Packaging Substrate (SUB) Market Facts & Figures by Country (2017, 2022 & 2028)
      • 6.3.3 Germany
      • 6.3.4 France
      • 6.3.5 U.K.
      • 6.3.6 Italy
      • 6.3.7 Russia
    • 6.4 Latin America
      • 6.4.1 Latin America IC Packaging Substrate (SUB) Market Size YoY Growth 2017-2028
      • 6.4.2 Latin America IC Packaging Substrate (SUB) Market Facts & Figures by Country (2017, 2022 & 2028)
      • 6.4.3 Mexico
      • 6.4.4 Brazil
      • 6.4.5 Argentina
    • 6.5 Middle East and Africa
      • 6.5.1 Middle East and Africa IC Packaging Substrate (SUB) Market Size YoY Growth 2017-2028
      • 6.5.2 Middle East and Africa IC Packaging Substrate (SUB) Market Facts & Figures by Country (2017, 2022 & 2028)
      • 6.5.3 Turkey
      • 6.5.4 Saudi Arabia
      • 6.5.5 UAE

    7 Company Profiles

    • 7.1 Samsung Electro-Mechanics
      • 7.1.1 Samsung Electro-Mechanics Corporation Information
      • 7.1.2 Samsung Electro-Mechanics Description and Business Overview
      • 7.1.3 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.1.4 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Products Offered
      • 7.1.5 Samsung Electro-Mechanics Recent Development
    • 7.2 MST
      • 7.2.1 MST Corporation Information
      • 7.2.2 MST Description and Business Overview
      • 7.2.3 MST IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.2.4 MST IC Packaging Substrate (SUB) Products Offered
      • 7.2.5 MST Recent Development
    • 7.3 NGK
      • 7.3.1 NGK Corporation Information
      • 7.3.2 NGK Description and Business Overview
      • 7.3.3 NGK IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.3.4 NGK IC Packaging Substrate (SUB) Products Offered
      • 7.3.5 NGK Recent Development
    • 7.4 KLA Corporation
      • 7.4.1 KLA Corporation Corporation Information
      • 7.4.2 KLA Corporation Description and Business Overview
      • 7.4.3 KLA Corporation IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.4.4 KLA Corporation IC Packaging Substrate (SUB) Products Offered
      • 7.4.5 KLA Corporation Recent Development
    • 7.5 Panasonic
      • 7.5.1 Panasonic Corporation Information
      • 7.5.2 Panasonic Description and Business Overview
      • 7.5.3 Panasonic IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.5.4 Panasonic IC Packaging Substrate (SUB) Products Offered
      • 7.5.5 Panasonic Recent Development
    • 7.6 Simmtech
      • 7.6.1 Simmtech Corporation Information
      • 7.6.2 Simmtech Description and Business Overview
      • 7.6.3 Simmtech IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.6.4 Simmtech IC Packaging Substrate (SUB) Products Offered
      • 7.6.5 Simmtech Recent Development
    • 7.7 Daeduck
      • 7.7.1 Daeduck Corporation Information
      • 7.7.2 Daeduck Description and Business Overview
      • 7.7.3 Daeduck IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.7.4 Daeduck IC Packaging Substrate (SUB) Products Offered
      • 7.7.5 Daeduck Recent Development
    • 7.8 ASE Material
      • 7.8.1 ASE Material Corporation Information
      • 7.8.2 ASE Material Description and Business Overview
      • 7.8.3 ASE Material IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.8.4 ASE Material IC Packaging Substrate (SUB) Products Offered
      • 7.8.5 ASE Material Recent Development
    • 7.9 Kyocera
      • 7.9.1 Kyocera Corporation Information
      • 7.9.2 Kyocera Description and Business Overview
      • 7.9.3 Kyocera IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.9.4 Kyocera IC Packaging Substrate (SUB) Products Offered
      • 7.9.5 Kyocera Recent Development
    • 7.10 Ibiden
      • 7.10.1 Ibiden Corporation Information
      • 7.10.2 Ibiden Description and Business Overview
      • 7.10.3 Ibiden IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.10.4 Ibiden IC Packaging Substrate (SUB) Products Offered
      • 7.10.5 Ibiden Recent Development
    • 7.11 Shinko Electric Industries
      • 7.11.1 Shinko Electric Industries Corporation Information
      • 7.11.2 Shinko Electric Industries Description and Business Overview
      • 7.11.3 Shinko Electric Industries IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.11.4 Shinko Electric Industries IC Packaging Substrate (SUB) Products Offered
      • 7.11.5 Shinko Electric Industries Recent Development
    • 7.12 AT&S
      • 7.12.1 AT&S Corporation Information
      • 7.12.2 AT&S Description and Business Overview
      • 7.12.3 AT&S IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.12.4 AT&S Products Offered
      • 7.12.5 AT&S Recent Development
    • 7.13 LG InnoTek
      • 7.13.1 LG InnoTek Corporation Information
      • 7.13.2 LG InnoTek Description and Business Overview
      • 7.13.3 LG InnoTek IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.13.4 LG InnoTek Products Offered
      • 7.13.5 LG InnoTek Recent Development
    • 7.14 Fastprint Circuit Tech
      • 7.14.1 Fastprint Circuit Tech Corporation Information
      • 7.14.2 Fastprint Circuit Tech Description and Business Overview
      • 7.14.3 Fastprint Circuit Tech IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.14.4 Fastprint Circuit Tech Products Offered
      • 7.14.5 Fastprint Circuit Tech Recent Development
    • 7.15 ACCESS
      • 7.15.1 ACCESS Corporation Information
      • 7.15.2 ACCESS Description and Business Overview
      • 7.15.3 ACCESS IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.15.4 ACCESS Products Offered
      • 7.15.5 ACCESS Recent Development
    • 7.16 Danbond Technology
      • 7.16.1 Danbond Technology Corporation Information
      • 7.16.2 Danbond Technology Description and Business Overview
      • 7.16.3 Danbond Technology IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.16.4 Danbond Technology Products Offered
      • 7.16.5 Danbond Technology Recent Development
    • 7.17 TTM Technologies
      • 7.17.1 TTM Technologies Corporation Information
      • 7.17.2 TTM Technologies Description and Business Overview
      • 7.17.3 TTM Technologies IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.17.4 TTM Technologies Products Offered
      • 7.17.5 TTM Technologies Recent Development
    • 7.18 Unimicron
      • 7.18.1 Unimicron Corporation Information
      • 7.18.2 Unimicron Description and Business Overview
      • 7.18.3 Unimicron IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.18.4 Unimicron Products Offered
      • 7.18.5 Unimicron Recent Development
    • 7.19 Nan Ya PCB
      • 7.19.1 Nan Ya PCB Corporation Information
      • 7.19.2 Nan Ya PCB Description and Business Overview
      • 7.19.3 Nan Ya PCB IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.19.4 Nan Ya PCB Products Offered
      • 7.19.5 Nan Ya PCB Recent Development
    • 7.20 Kinsus
      • 7.20.1 Kinsus Corporation Information
      • 7.20.2 Kinsus Description and Business Overview
      • 7.20.3 Kinsus IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.20.4 Kinsus Products Offered
      • 7.20.5 Kinsus Recent Development
    • 7.21 SCC
      • 7.21.1 SCC Corporation Information
      • 7.21.2 SCC Description and Business Overview
      • 7.21.3 SCC IC Packaging Substrate (SUB) Sales, Revenue and Gross Margin (2017-2022)
      • 7.21.4 SCC Products Offered
      • 7.21.5 SCC Recent Development

    8 Industry Chain and Sales Channels Analysis

    • 8.1 IC Packaging Substrate (SUB) Industry Chain Analysis
    • 8.2 IC Packaging Substrate (SUB) Key Raw Materials
      • 8.2.1 Key Raw Materials
      • 8.2.2 IC Packaging Substrate (SUB) Distributors
    • 8.3 IC Packaging Substrate (SUB) Production Mode & Process
    • 8.4 IC Packaging Substrate (SUB) Sales and Marketing
      • 8.4.1 IC Packaging Substrate (SUB) Sales Channels
      • 8.4.2 IC Packaging Substrate (SUB) Distributors
    • 8.5 IC Packaging Substrate (SUB) Customers

    9 Research Findings and Conclusion

      10 Appendix

      • 10.1 Research Methodology
        • 10.1.1 Methodology/Research Approach
        • 10.1.2 Data Source
      • 10.2 Author Details

      Summary:
      Get latest Market Research Reports on IC Packaging Substrate (SUB). Industry analysis & Market Report on IC Packaging Substrate (SUB) is a syndicated market report, published as Global and United States IC Packaging Substrate (SUB) Market Report & Forecast 2022-2028. It is complete Research Study and Industry Analysis of IC Packaging Substrate (SUB) market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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