Report Detail
Global IC Packaging Market Size, Status and Forecast 2019-2025
- RnM3608425 |
- 22 July, 2019 |
- Global |
- 108 Pages |
- QYResearch |
- Service & Software
IC, or integrated circuit, packaging refers literally to the material that contains a semiconductor device. The package is a case that surrounds the circuit material to protect it from corrosion or physical damage and to allow for mounting of the electrical contacts connecting it to the PCB. There are many different types of integrated circuits, and therefore there are different types of IC packaging to consider, as different types of circuits will have different needs when it comes to their outer shell.
In the production of semiconductor devices, IC packaging is the last stage in the process. During this stage, the semiconductor block gets covered in a package that protects the IC from potentially damaging external elements and the corrosive effects of age. The package is essentially an encasement designed to protect the block and also to promote the electrical contacts that deliver signals to the circuit board of an electronic device.
IC packaging has evolved since the 1970s, when ball grid array (BGA) packages first came into use among electronics manufacturers. At the dawn of the 21st century, newer options eclipsed pin grid array packages, namely the plastic quad flat pack and the thin small outline package. As the noughties progressed, manufacturers like Intel ushered in the era of land grid array packages.
In 2018, the global IC Packaging market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.
This report focuses on the global IC Packaging status, future forecast, growth opportunity, key market and key players. The study objectives are to present the IC Packaging development in North America, Europe, China, Japan, Southeast Asia, India and Central & South America.
The key players covered in this study
ASE Group
Amkor
JECT
SPIL
Powertech Technology Inc
TSHT
TFME
UTAC
Chipbond
ChipMOS
KYEC
Unisem
Walton Advanced Engineering
Signetics
Hana Micron
Market segment by Type, the product can be split into
Pin-grid Array
Quad Flat Pack
Quad Flat No-Lead
Others
Market segment by Application, split into
Communication
Computing & Networking
Consumer Electronics
Others
Market segment by Regions/Countries, this report covers
North America
Europe
China
Japan
Southeast Asia
India
Central & South America
The study objectives of this report are:
To analyze global IC Packaging status, future forecast, growth opportunity, key market and key players.
To present the IC Packaging development in North America, Europe, China, Japan, Southeast Asia, India and Central & South America.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by product type, market and key regions.
In this study, the years considered to estimate the market size of IC Packaging are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Table of Contents
1 Report Overview
- 1.1 Study Scope
- 1.2 Key Market Segments
- 1.3 Players Covered
- 1.4 Market Analysis by Type
- 1.4.1 Global IC Packaging Market Size Growth Rate by Type (2014-2025)
- 1.4.2 Pin-grid Array
- 1.4.3 Quad Flat Pack
- 1.4.4 Quad Flat No-Lead
- 1.4.5 Others
- 1.5 Market by Application
- 1.5.1 Global IC Packaging Market Share by Application (2019-2025)
- 1.5.2 Communication
- 1.5.3 Computing & Networking
- 1.5.4 Consumer Electronics
- 1.5.5 Others
- 1.6 Study Objectives
- 1.7 Years Considered
2 Global Growth Trends
- 2.1 IC Packaging Market Size
- 2.2 IC Packaging Growth Trends by Regions
- 2.2.1 IC Packaging Market Size by Regions (2019-2025)
- 2.2.2 IC Packaging Market Share by Regions (2014-2019)
- 2.3 Industry Trends
- 2.3.1 Market Top Trends
- 2.3.2 Market Drivers
- 2.3.3 Market Challenges
- 2.3.4 Porter’s Five Forces Analysis
3 Market Share by Key Players
- 3.1 IC Packaging Market Size by by Players
- 3.1.1 Global IC Packaging Revenue by by Players (2014-2019)
- 3.1.2 Global IC Packaging Revenue Market Share by by Players (2014-2019)
- 3.1.3 Global IC Packaging Market Concentration Ratio (CR5 and HHI)
- 3.2 IC Packaging Key Players Head office and Area Served
- 3.3 Key Players IC Packaging Product/Solution/Service
- 3.4 Date of Enter into IC Packaging Market
- 3.5 Mergers & Acquisitions, Expansion Plans
4 Breakdown Data by Type and Application
- 4.1 Global IC Packaging Market Size by Type (2014-2019)
- 4.2 Global IC Packaging Market Size by Application (2014-2019)
5 North America
- 5.1 North America IC Packaging Market Size (2014-2019)
- 5.2 IC Packaging Key Players in North America
- 5.3 North America IC Packaging Market Size by Type
- 5.4 North America IC Packaging Market Size by Application
6 Europe
- 6.1 Europe IC Packaging Market Size (2014-2019)
- 6.2 IC Packaging Key Players in Europe
- 6.3 Europe IC Packaging Market Size by Type
- 6.4 Europe IC Packaging Market Size by Application
7 China
- 7.1 China IC Packaging Market Size (2014-2019)
- 7.2 IC Packaging Key Players in China
- 7.3 China IC Packaging Market Size by Type
- 7.4 China IC Packaging Market Size by Application
8 Japan
- 8.1 Japan IC Packaging Market Size (2014-2019)
- 8.2 IC Packaging Key Players in Japan
- 8.3 Japan IC Packaging Market Size by Type
- 8.4 Japan IC Packaging Market Size by Application
9 Southeast Asia
- 9.1 Southeast Asia IC Packaging Market Size (2014-2019)
- 9.2 IC Packaging Key Players in Southeast Asia
- 9.3 Southeast Asia IC Packaging Market Size by Type
- 9.4 Southeast Asia IC Packaging Market Size by Application
10 India
- 10.1 India IC Packaging Market Size (2014-2019)
- 10.2 IC Packaging Key Players in India
- 10.3 India IC Packaging Market Size by Type
- 10.4 India IC Packaging Market Size by Application
11 Central & South America
- 11.1 Central & South America IC Packaging Market Size (2014-2019)
- 11.2 IC Packaging Key Players in Central & South America
- 11.3 Central & South America IC Packaging Market Size by Type
- 11.4 Central & South America IC Packaging Market Size by Application
12 International Players Profiles
- 12.1 ASE Group
- 12.1.1 ASE Group Company Details
- 12.1.2 Company Description and Business Overview
- 12.1.3 IC Packaging Introduction
- 12.1.4 ASE Group Revenue in IC Packaging Business (2014-2019))
- 12.1.5 ASE Group Recent Development
- 12.2 Amkor
- 12.2.1 Amkor Company Details
- 12.2.2 Company Description and Business Overview
- 12.2.3 IC Packaging Introduction
- 12.2.4 Amkor Revenue in IC Packaging Business (2014-2019)
- 12.2.5 Amkor Recent Development
- 12.3 JECT
- 12.3.1 JECT Company Details
- 12.3.2 Company Description and Business Overview
- 12.3.3 IC Packaging Introduction
- 12.3.4 JECT Revenue in IC Packaging Business (2014-2019)
- 12.3.5 JECT Recent Development
- 12.4 SPIL
- 12.4.1 SPIL Company Details
- 12.4.2 Company Description and Business Overview
- 12.4.3 IC Packaging Introduction
- 12.4.4 SPIL Revenue in IC Packaging Business (2014-2019)
- 12.4.5 SPIL Recent Development
- 12.5 Powertech Technology Inc
- 12.5.1 Powertech Technology Inc Company Details
- 12.5.2 Company Description and Business Overview
- 12.5.3 IC Packaging Introduction
- 12.5.4 Powertech Technology Inc Revenue in IC Packaging Business (2014-2019)
- 12.5.5 Powertech Technology Inc Recent Development
- 12.6 TSHT
- 12.6.1 TSHT Company Details
- 12.6.2 Company Description and Business Overview
- 12.6.3 IC Packaging Introduction
- 12.6.4 TSHT Revenue in IC Packaging Business (2014-2019)
- 12.6.5 TSHT Recent Development
- 12.7 TFME
- 12.7.1 TFME Company Details
- 12.7.2 Company Description and Business Overview
- 12.7.3 IC Packaging Introduction
- 12.7.4 TFME Revenue in IC Packaging Business (2014-2019)
- 12.7.5 TFME Recent Development
- 12.8 UTAC
- 12.8.1 UTAC Company Details
- 12.8.2 Company Description and Business Overview
- 12.8.3 IC Packaging Introduction
- 12.8.4 UTAC Revenue in IC Packaging Business (2014-2019)
- 12.8.5 UTAC Recent Development
- 12.9 Chipbond
- 12.9.1 Chipbond Company Details
- 12.9.2 Company Description and Business Overview
- 12.9.3 IC Packaging Introduction
- 12.9.4 Chipbond Revenue in IC Packaging Business (2014-2019)
- 12.9.5 Chipbond Recent Development
- 12.10 ChipMOS
- 12.10.1 ChipMOS Company Details
- 12.10.2 Company Description and Business Overview
- 12.10.3 IC Packaging Introduction
- 12.10.4 ChipMOS Revenue in IC Packaging Business (2014-2019)
- 12.10.5 ChipMOS Recent Development
- 12.11 KYEC
- 12.12 Unisem
- 12.13 Walton Advanced Engineering
- 12.14 Signetics
- 12.15 Hana Micron
13 Market Forecast 2019-2025
- 13.1 Market Size Forecast by Product (2019-2025)
- 13.2 Market Size Forecast by Application (2019-2025)
- 13.3 Market Size Forecast by Regions
- 13.4 North America
- 13.5 Europe
- 13.6 China
- 13.7 Japan
- 13.8 Southeast Asia
- 13.9 India
- 13.10 Central & South America
14 Analyst's Viewpoints/Conclusions
15 Appendix
- 15.1 Research Methodology
- 15.1.1 Methodology/Research Approach
- 15.1.1.1 Research Programs/Design
- 15.1.1.2 Market Size Estimation
- 15.1.1.3 Market Breakdown and Data Triangulation
- 15.1.2 Data Source
- 15.1.2.1 Secondary Sources
- 15.1.2.2 Primary Sources
- 15.1.1 Methodology/Research Approach
- 15.2 Disclaimer
Summary:
Get latest Market Research Reports on IC Packaging. Industry analysis & Market Report on IC Packaging is a syndicated market report, published as Global IC Packaging Market Size, Status and Forecast 2019-2025. It is complete Research Study and Industry Analysis of IC Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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