Global and United States IC Chip Packaging and Testing Market Report & Forecast 2022-2028

Table of Contents

1 Study Coverage

• 1.1 IC Chip Packaging and Testing Product Introduction
• 1.2 Global IC Chip Packaging and Testing Outlook 2017 VS 2022 VS 2028
  • 1.2.1 Global IC Chip Packaging and Testing Sales in US$ Million for the Year 2017-2028
  • 1.2.2 Global IC Chip Packaging and Testing Sales in Volume for the Year 2017-2028
• 1.3 United States IC Chip Packaging and Testing Outlook 2017 VS 2022 VS 2028
  • 1.3.1 United States IC Chip Packaging and Testing Sales in US$ Million for the Year 2017-2028
  • 1.3.2 United States IC Chip Packaging and Testing Sales in Volume for the Year 2017-2028
• 1.4 IC Chip Packaging and Testing Market Size, United States VS Global, 2017 VS 2022 VS 2028
  • 1.4.1 The Market Share of United States IC Chip Packaging and Testing in Global, 2017 VS 2022 VS 2028
  • 1.4.2 The Growth Rate of IC Chip Packaging and Testing Market Size, United States VS Global, 2017 VS 2022 VS 2028
• 1.5 IC Chip Packaging and Testing Market Dynamics
  • 1.5.1 IC Chip Packaging and Testing Industry Trends
  • 1.5.2 IC Chip Packaging and Testing Market Drivers
  • 1.5.3 IC Chip Packaging and Testing Market Challenges
  • 1.5.4 IC Chip Packaging and Testing Market Restraints
• 1.6 Study Objectives
• 1.7 Years Considered

2 Market by Type

• 2.1 IC Chip Packaging and Testing Market Segment by Type
  • 2.1.1 BGA
  • 2.1.2 LGA
  • 2.1.3 SiP
  • 2.1.4 FC
  • 2.1.5 Others
• 2.2 Global IC Chip Packaging and Testing Market Size by Type
  • 2.2.1 Global IC Chip Packaging and Testing Sales in Value, by Type (2017, 2022 & 2028)
  • 2.2.2 Global IC Chip Packaging and Testing Sales in Volume, by Type (2017, 2022 & 2028)
  • 2.2.3 Global IC Chip Packaging and Testing Average Selling Price (ASP) by Type (2017, 2022 & 2028)
• 2.3 United States IC Chip Packaging and Testing Market Size by Type
  • 2.3.1 United States IC Chip Packaging and Testing Sales in Value, by Type (2017, 2022 & 2028)
  • 2.3.2 United States IC Chip Packaging and Testing Sales in Volume, by Type (2017, 2022 & 2028)
  • 2.3.3 United States IC Chip Packaging and Testing Average Selling Price (ASP) by Type (2017, 2022 & 2028)

3 Market by Application

• 3.1 IC Chip Packaging and Testing Market Segment by Application
  • 3.1.1 Communications
  • 3.1.2 Consumer Electronics
  • 3.1.3 Electric Vehicles
  • 3.1.4 Aerospace
  • 3.1.5 Others
• 3.2 Global IC Chip Packaging and Testing Market Size by Application
  • 3.2.1 Global IC Chip Packaging and Testing Sales in Value, by Application (2017, 2022 & 2028)
  • 3.2.2 Global IC Chip Packaging and Testing Sales in Volume, by Application (2017, 2022 & 2028)
  • 3.3.3 Global IC Chip Packaging and Testing Average Selling Price (ASP) by Application (2017, 2022 & 2028)
• 3.3 United States IC Chip Packaging and Testing Market Size by Application
  • 3.3.1 United States IC Chip Packaging and Testing Sales in Value, by Application (2017, 2022 & 2028)
  • 3.3.2 United States IC Chip Packaging and Testing Sales in Volume, by Application (2017, 2022 & 2028)
  • 3.3.3 United States IC Chip Packaging and Testing Average Selling Price (ASP) by Application (2017, 2022 & 2028)

4 Global IC Chip Packaging and Testing Competitor Landscape by Company

• 4.1 Global IC Chip Packaging and Testing Market Size by Company
  • 4.1.1 Top Global IC Chip Packaging and Testing Manufacturers Ranked by Revenue (2021)
  • 4.1.2 Global IC Chip Packaging and Testing Revenue by Manufacturer (2017-2022)
  • 4.1.3 Global IC Chip Packaging and Testing Sales by Manufacturer (2017-2022)
  • 4.1.4 Global IC Chip Packaging and Testing Price by Manufacturer (2017-2022)
• 4.2 Global IC Chip Packaging and Testing Concentration Ratio (CR)
  • 4.2.1 IC Chip Packaging and Testing Market Concentration Ratio (CR) (2017-2022)
  • 4.2.2 Global Top 5 and Top 10 Largest Manufacturers of IC Chip Packaging and Testing in 2021
  • 4.2.3 Global IC Chip Packaging and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
• 4.3 Global IC Chip Packaging and Testing Manufacturing Base Distribution, Product Type
  • 4.3.1 Global IC Chip Packaging and Testing Manufacturers, Headquarters and Distribution of Producing Region
  • 4.3.2 Manufacturers IC Chip Packaging and Testing Product Type
  • 4.3.3 Date of International Manufacturers Enter into IC Chip Packaging and Testing Market
• 4.4 Manufacturers Mergers & Acquisitions, Expansion Plans
• 4.5 United States IC Chip Packaging and Testing Market Size by Company
  • 4.5.1 Top IC Chip Packaging and Testing Players in United States, Ranked by Revenue (2021)
  • 4.5.2 United States IC Chip Packaging and Testing Revenue by Players (2020, 2021 & 2022)
  • 4.5.3 United States IC Chip Packaging and Testing Sales by Players (2020, 2021 & 2022)

5 Global IC Chip Packaging and Testing Market Size by Region

• 5.1 Global IC Chip Packaging and Testing Market Size by Region: 2017 VS 2022 VS 2028
• 5.2 Global IC Chip Packaging and Testing Market Size in Volume by Region (2017-2028)
  • 5.2.1 Global IC Chip Packaging and Testing Sales in Volume by Region: 2017-2022
  • 5.2.2 Global IC Chip Packaging and Testing Sales in Volume Forecast by Region (2023-2028)
• 5.3 Global IC Chip Packaging and Testing Market Size in Value by Region (2017-2028)
  • 5.3.1 Global IC Chip Packaging and Testing Sales in Value by Region: 2017-2022
  • 5.3.2 Global IC Chip Packaging and Testing Sales in Value by Region: 2023-2028

6 Segment in Region Level & Country Level

• 6.1 North America
  • 6.1.1 North America IC Chip Packaging and Testing Market Size YoY Growth 2017-2028
  • 6.1.2 North America IC Chip Packaging and Testing Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.1.3 United States
  • 6.1.4 Canada
• 6.2 Asia-Pacific
  • 6.2.1 Asia-Pacific IC Chip Packaging and Testing Market Size YoY Growth 2017-2028
  • 6.2.2 Asia-Pacific IC Chip Packaging and Testing Market Facts & Figures by Region (2017, 2022 & 2028)
  • 6.2.3 China
  • 6.2.4 Japan
  • 6.2.5 South Korea
  • 6.2.6 India
  • 6.2.7 Australia
  • 6.2.8 China Taiwan
  • 6.2.9 Indonesia
  • 6.2.10 Thailand
  • 6.2.11 Malaysia
• 6.3 Europe
  • 6.3.1 Europe IC Chip Packaging and Testing Market Size YoY Growth 2017-2028
  • 6.3.2 Europe IC Chip Packaging and Testing Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.3.3 Germany
  • 6.3.4 France
  • 6.3.5 U.K.
  • 6.3.6 Italy
  • 6.3.7 Russia
• 6.4 Latin America
  • 6.4.1 Latin America IC Chip Packaging and Testing Market Size YoY Growth 2017-2028
  • 6.4.2 Latin America IC Chip Packaging and Testing Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.4.3 Mexico
  • 6.4.4 Brazil
  • 6.4.5 Argentina
• 6.5 Middle East and Africa
  • 6.5.1 Middle East and Africa IC Chip Packaging and Testing Market Size YoY Growth 2017-2028
  • 6.5.2 Middle East and Africa IC Chip Packaging and Testing Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.5.3 Turkey
  • 6.5.4 Saudi Arabia
  • 6.5.5 UAE

7 Company Profiles

• 7.1 ASE
  • 7.1.1 ASE Corporation Information
  • 7.1.2 ASE Description and Business Overview
  • 7.1.3 ASE IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.1.4 ASE IC Chip Packaging and Testing Products Offered
  • 7.1.5 ASE Recent Development
• 7.2 Amkor Technology
  • 7.2.1 Amkor Technology Corporation Information
  • 7.2.2 Amkor Technology Description and Business Overview
  • 7.2.3 Amkor Technology IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.2.4 Amkor Technology IC Chip Packaging and Testing Products Offered
  • 7.2.5 Amkor Technology Recent Development
• 7.3 SPIL
  • 7.3.1 SPIL Corporation Information
  • 7.3.2 SPIL Description and Business Overview
  • 7.3.3 SPIL IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.3.4 SPIL IC Chip Packaging and Testing Products Offered
  • 7.3.5 SPIL Recent Development
• 7.4 Powertech Technology
  • 7.4.1 Powertech Technology Corporation Information
  • 7.4.2 Powertech Technology Description and Business Overview
  • 7.4.3 Powertech Technology IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.4.4 Powertech Technology IC Chip Packaging and Testing Products Offered
  • 7.4.5 Powertech Technology Recent Development
• 7.5 UTAC
  • 7.5.1 UTAC Corporation Information
  • 7.5.2 UTAC Description and Business Overview
  • 7.5.3 UTAC IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.5.4 UTAC IC Chip Packaging and Testing Products Offered
  • 7.5.5 UTAC Recent Development
• 7.6 Chipbond Technology
  • 7.6.1 Chipbond Technology Corporation Information
  • 7.6.2 Chipbond Technology Description and Business Overview
  • 7.6.3 Chipbond Technology IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.6.4 Chipbond Technology IC Chip Packaging and Testing Products Offered
  • 7.6.5 Chipbond Technology Recent Development
• 7.7 Hana Micron
  • 7.7.1 Hana Micron Corporation Information
  • 7.7.2 Hana Micron Description and Business Overview
  • 7.7.3 Hana Micron IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.7.4 Hana Micron IC Chip Packaging and Testing Products Offered
  • 7.7.5 Hana Micron Recent Development
• 7.8 OSE
  • 7.8.1 OSE Corporation Information
  • 7.8.2 OSE Description and Business Overview
  • 7.8.3 OSE IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.8.4 OSE IC Chip Packaging and Testing Products Offered
  • 7.8.5 OSE Recent Development
• 7.9 Walton Advanced Engineering
  • 7.9.1 Walton Advanced Engineering Corporation Information
  • 7.9.2 Walton Advanced Engineering Description and Business Overview
  • 7.9.3 Walton Advanced Engineering IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.9.4 Walton Advanced Engineering IC Chip Packaging and Testing Products Offered
  • 7.9.5 Walton Advanced Engineering Recent Development
• 7.10 NEPES
  • 7.10.1 NEPES Corporation Information
  • 7.10.2 NEPES Description and Business Overview
  • 7.10.3 NEPES IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.10.4 NEPES IC Chip Packaging and Testing Products Offered
  • 7.10.5 NEPES Recent Development
• 7.11 Unisem
  • 7.11.1 Unisem Corporation Information
  • 7.11.2 Unisem Description and Business Overview
  • 7.11.3 Unisem IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.11.4 Unisem IC Chip Packaging and Testing Products Offered
  • 7.11.5 Unisem Recent Development
• 7.12 ChipMOS Technologies
  • 7.12.1 ChipMOS Technologies Corporation Information
  • 7.12.2 ChipMOS Technologies Description and Business Overview
  • 7.12.3 ChipMOS Technologies IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.12.4 ChipMOS Technologies Products Offered
  • 7.12.5 ChipMOS Technologies Recent Development
• 7.13 Signetics
  • 7.13.1 Signetics Corporation Information
  • 7.13.2 Signetics Description and Business Overview
  • 7.13.3 Signetics IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.13.4 Signetics Products Offered
  • 7.13.5 Signetics Recent Development
• 7.14 Carsem
  • 7.14.1 Carsem Corporation Information
  • 7.14.2 Carsem Description and Business Overview
  • 7.14.3 Carsem IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.14.4 Carsem Products Offered
  • 7.14.5 Carsem Recent Development
• 7.15 KYEC
  • 7.15.1 KYEC Corporation Information
  • 7.15.2 KYEC Description and Business Overview
  • 7.15.3 KYEC IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.15.4 KYEC Products Offered
  • 7.15.5 KYEC Recent Development
• 7.16 Siliconware Precision Industries
  • 7.16.1 Siliconware Precision Industries Corporation Information
  • 7.16.2 Siliconware Precision Industries Description and Business Overview
  • 7.16.3 Siliconware Precision Industries IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.16.4 Siliconware Precision Industries Products Offered
  • 7.16.5 Siliconware Precision Industries Recent Development
• 7.17 ITEQ
  • 7.17.1 ITEQ Corporation Information
  • 7.17.2 ITEQ Description and Business Overview
  • 7.17.3 ITEQ IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.17.4 ITEQ Products Offered
  • 7.17.5 ITEQ Recent Development
• 7.18 JCET
  • 7.18.1 JCET Corporation Information
  • 7.18.2 JCET Description and Business Overview
  • 7.18.3 JCET IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.18.4 JCET Products Offered
  • 7.18.5 JCET Recent Development
• 7.19 TongFu Microelectronics
  • 7.19.1 TongFu Microelectronics Corporation Information
  • 7.19.2 TongFu Microelectronics Description and Business Overview
  • 7.19.3 TongFu Microelectronics IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.19.4 TongFu Microelectronics Products Offered
  • 7.19.5 TongFu Microelectronics Recent Development
• 7.20 Tianshui Huatian Technology
  • 7.20.1 Tianshui Huatian Technology Corporation Information
  • 7.20.2 Tianshui Huatian Technology Description and Business Overview
  • 7.20.3 Tianshui Huatian Technology IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.20.4 Tianshui Huatian Technology Products Offered
  • 7.20.5 Tianshui Huatian Technology Recent Development
• 7.21 Chipmore Technology
  • 7.21.1 Chipmore Technology Corporation Information
  • 7.21.2 Chipmore Technology Description and Business Overview
  • 7.21.3 Chipmore Technology IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.21.4 Chipmore Technology Products Offered
  • 7.21.5 Chipmore Technology Recent Development
• 7.22 China Resources Microelectronics
  • 7.22.1 China Resources Microelectronics Corporation Information
  • 7.22.2 China Resources Microelectronics Description and Business Overview
  • 7.22.3 China Resources Microelectronics IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.22.4 China Resources Microelectronics Products Offered
  • 7.22.5 China Resources Microelectronics Recent Development
• 7.23 Forehope Electronic
  • 7.23.1 Forehope Electronic Corporation Information
  • 7.23.2 Forehope Electronic Description and Business Overview
  • 7.23.3 Forehope Electronic IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.23.4 Forehope Electronic Products Offered
  • 7.23.5 Forehope Electronic Recent Development
• 7.24 Wafer Level CSP
  • 7.24.1 Wafer Level CSP Corporation Information
  • 7.24.2 Wafer Level CSP Description and Business Overview
  • 7.24.3 Wafer Level CSP IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.24.4 Wafer Level CSP Products Offered
  • 7.24.5 Wafer Level CSP Recent Development
• 7.25 Chizhou HISEMI Electronic Technology
  • 7.25.1 Chizhou HISEMI Electronic Technology Corporation Information
  • 7.25.2 Chizhou HISEMI Electronic Technology Description and Business Overview
  • 7.25.3 Chizhou HISEMI Electronic Technology IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.25.4 Chizhou HISEMI Electronic Technology Products Offered
  • 7.25.5 Chizhou HISEMI Electronic Technology Recent Development
• 7.26 Keyang
  • 7.26.1 Keyang Corporation Information
  • 7.26.2 Keyang Description and Business Overview
  • 7.26.3 Keyang IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.26.4 Keyang Products Offered
  • 7.26.5 Keyang Recent Development
• 7.27 Leadyo IC Testing
  • 7.27.1 Leadyo IC Testing Corporation Information
  • 7.27.2 Leadyo IC Testing Description and Business Overview
  • 7.27.3 Leadyo IC Testing IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2017-2022)
  • 7.27.4 Leadyo IC Testing Products Offered
  • 7.27.5 Leadyo IC Testing Recent Development

8 Industry Chain and Sales Channels Analysis

• 8.1 IC Chip Packaging and Testing Industry Chain Analysis
• 8.2 IC Chip Packaging and Testing Key Raw Materials
  • 8.2.1 Key Raw Materials
  • 8.2.2 IC Chip Packaging and Testing Distributors
• 8.3 IC Chip Packaging and Testing Production Mode & Process
• 8.4 IC Chip Packaging and Testing Sales and Marketing
  • 8.4.1 IC Chip Packaging and Testing Sales Channels
  • 8.4.2 IC Chip Packaging and Testing Distributors
• 8.5 IC Chip Packaging and Testing Customers

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
  • 10.1.2 Data Source
• 10.2 Author Details