Report Detail
Global High Density Interconnect PCB Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
- RnM3819108 |
- 13 August, 2024 |
- Global |
- 116 Pages |
- GIR (Global Info Research) |
- Electronics & Semiconductor
According to our (Global Info Research) latest study, the global High Density Interconnect PCB market size was valued at USD 8441 million in 2023 and is forecast to a readjusted size of USD 13290 million by 2030 with a CAGR of 6.7% during review period.
A high-density interconnect (HDI) is a fastest growing technology used in the printed circuit board (PCB), which have higher wiring density per unit as compared to the conventional circuit boards. These HDI PCBs have finer lines and spaces ( 100 m), smaller vias ( 150 m), and capture pads ( 400 m). Moreover, HDI PCBs have a relatively higher connection pad density over conventional PCBs that is over 20 pads/cm2. Hence, they are widely adopted in the consumer electronics sector and have a high growth potential in the automotive industry.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
The Global Info Research report includes an overview of the development of the High Density Interconnect PCB industry chain, the market status of Consumer Electronics (Smartphone & Tablet, Laptop & PC), Military And Defense (Smartphone & Tablet, Laptop & PC), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of High Density Interconnect PCB.
Regionally, the report analyzes the High Density Interconnect PCB markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global High Density Interconnect PCB market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the High Density Interconnect PCB market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the High Density Interconnect PCB industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K Units), revenue generated, and market share of different by Type (e.g., Smartphone & Tablet, Laptop & PC).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the High Density Interconnect PCB market.
Regional Analysis: The report involves examining the High Density Interconnect PCB market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the High Density Interconnect PCB market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to High Density Interconnect PCB:
Company Analysis: Report covers individual High Density Interconnect PCB manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards High Density Interconnect PCB This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Consumer Electronics, Military And Defense).
Technology Analysis: Report covers specific technologies relevant to High Density Interconnect PCB. It assesses the current state, advancements, and potential future developments in High Density Interconnect PCB areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the High Density Interconnect PCB market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
High Density Interconnect PCB market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Market segment by Type
Smartphone & Tablet
Laptop & PC
Smart Wearables
Others
Market segment by Application
Consumer Electronics
Military And Defense
Telecom And IT
Automotive
Major players covered
TTM Technologies (US)
PCBCART (China)
Millennium Circuits Limited (US)
RAYMING (China)
Mistral Solutions Pvt. Ltd. (India)
SIERRA CIRCUITS INC. (US)
Advanced Circuits (US)
FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan)
FINELINE Ltd. (Israel)
Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe High Density Interconnect PCB product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of High Density Interconnect PCB, with price, sales, revenue and global market share of High Density Interconnect PCB from 2019 to 2024.
Chapter 3, the High Density Interconnect PCB competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the High Density Interconnect PCB breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and High Density Interconnect PCB market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of High Density Interconnect PCB.
Chapter 14 and 15, to describe High Density Interconnect PCB sales channel, distributors, customers, research findings and conclusion.
1 Market Overview
- 1.1 Product Overview and Scope of High Density Interconnect PCB
- 1.2 Market Estimation Caveats and Base Year
- 1.3 Market Analysis by Type
- 1.3.1 Overview: Global High Density Interconnect PCB Consumption Value by Type: 2019 Versus 2023 Versus 2030
- 1.3.2 Smartphone & Tablet
- 1.3.3 Laptop & PC
- 1.3.4 Smart Wearables
- 1.3.5 Others
- 1.4 Market Analysis by Application
- 1.4.1 Overview: Global High Density Interconnect PCB Consumption Value by Application: 2019 Versus 2023 Versus 2030
- 1.4.2 Consumer Electronics
- 1.4.3 Military And Defense
- 1.4.4 Telecom And IT
- 1.4.5 Automotive
- 1.5 Global High Density Interconnect PCB Market Size & Forecast
- 1.5.1 Global High Density Interconnect PCB Consumption Value (2019 & 2023 & 2030)
- 1.5.2 Global High Density Interconnect PCB Sales Quantity (2019-2030)
- 1.5.3 Global High Density Interconnect PCB Average Price (2019-2030)
2 Manufacturers Profiles
- 2.1 TTM Technologies (US)
- 2.1.1 TTM Technologies (US) Details
- 2.1.2 TTM Technologies (US) Major Business
- 2.1.3 TTM Technologies (US) High Density Interconnect PCB Product and Services
- 2.1.4 TTM Technologies (US) High Density Interconnect PCB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.1.5 TTM Technologies (US) Recent Developments/Updates
- 2.2 PCBCART (China)
- 2.2.1 PCBCART (China) Details
- 2.2.2 PCBCART (China) Major Business
- 2.2.3 PCBCART (China) High Density Interconnect PCB Product and Services
- 2.2.4 PCBCART (China) High Density Interconnect PCB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.2.5 PCBCART (China) Recent Developments/Updates
- 2.3 Millennium Circuits Limited (US)
- 2.3.1 Millennium Circuits Limited (US) Details
- 2.3.2 Millennium Circuits Limited (US) Major Business
- 2.3.3 Millennium Circuits Limited (US) High Density Interconnect PCB Product and Services
- 2.3.4 Millennium Circuits Limited (US) High Density Interconnect PCB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.3.5 Millennium Circuits Limited (US) Recent Developments/Updates
- 2.4 RAYMING (China)
- 2.4.1 RAYMING (China) Details
- 2.4.2 RAYMING (China) Major Business
- 2.4.3 RAYMING (China) High Density Interconnect PCB Product and Services
- 2.4.4 RAYMING (China) High Density Interconnect PCB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.4.5 RAYMING (China) Recent Developments/Updates
- 2.5 Mistral Solutions Pvt. Ltd. (India)
- 2.5.1 Mistral Solutions Pvt. Ltd. (India) Details
- 2.5.2 Mistral Solutions Pvt. Ltd. (India) Major Business
- 2.5.3 Mistral Solutions Pvt. Ltd. (India) High Density Interconnect PCB Product and Services
- 2.5.4 Mistral Solutions Pvt. Ltd. (India) High Density Interconnect PCB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.5.5 Mistral Solutions Pvt. Ltd. (India) Recent Developments/Updates
- 2.6 SIERRA CIRCUITS INC. (US)
- 2.6.1 SIERRA CIRCUITS INC. (US) Details
- 2.6.2 SIERRA CIRCUITS INC. (US) Major Business
- 2.6.3 SIERRA CIRCUITS INC. (US) High Density Interconnect PCB Product and Services
- 2.6.4 SIERRA CIRCUITS INC. (US) High Density Interconnect PCB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.6.5 SIERRA CIRCUITS INC. (US) Recent Developments/Updates
- 2.7 Advanced Circuits (US)
- 2.7.1 Advanced Circuits (US) Details
- 2.7.2 Advanced Circuits (US) Major Business
- 2.7.3 Advanced Circuits (US) High Density Interconnect PCB Product and Services
- 2.7.4 Advanced Circuits (US) High Density Interconnect PCB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.7.5 Advanced Circuits (US) Recent Developments/Updates
- 2.8 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan)
- 2.8.1 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) Details
- 2.8.2 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) Major Business
- 2.8.3 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) High Density Interconnect PCB Product and Services
- 2.8.4 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) High Density Interconnect PCB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.8.5 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) Recent Developments/Updates
- 2.9 FINELINE Ltd. (Israel)
- 2.9.1 FINELINE Ltd. (Israel) Details
- 2.9.2 FINELINE Ltd. (Israel) Major Business
- 2.9.3 FINELINE Ltd. (Israel) High Density Interconnect PCB Product and Services
- 2.9.4 FINELINE Ltd. (Israel) High Density Interconnect PCB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.9.5 FINELINE Ltd. (Israel) Recent Developments/Updates
- 2.10 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)
- 2.10.1 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) Details
- 2.10.2 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) Major Business
- 2.10.3 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) High Density Interconnect PCB Product and Services
- 2.10.4 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) High Density Interconnect PCB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.10.5 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) Recent Developments/Updates
3 Competitive Environment: High Density Interconnect PCB by Manufacturer
- 3.1 Global High Density Interconnect PCB Sales Quantity by Manufacturer (2019-2024)
- 3.2 Global High Density Interconnect PCB Revenue by Manufacturer (2019-2024)
- 3.3 Global High Density Interconnect PCB Average Price by Manufacturer (2019-2024)
- 3.4 Market Share Analysis (2023)
- 3.4.1 Producer Shipments of High Density Interconnect PCB by Manufacturer Revenue ($MM) and Market Share (%): 2023
- 3.4.2 Top 3 High Density Interconnect PCB Manufacturer Market Share in 2023
- 3.4.2 Top 6 High Density Interconnect PCB Manufacturer Market Share in 2023
- 3.5 High Density Interconnect PCB Market: Overall Company Footprint Analysis
- 3.5.1 High Density Interconnect PCB Market: Region Footprint
- 3.5.2 High Density Interconnect PCB Market: Company Product Type Footprint
- 3.5.3 High Density Interconnect PCB Market: Company Product Application Footprint
- 3.6 New Market Entrants and Barriers to Market Entry
- 3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
- 4.1 Global High Density Interconnect PCB Market Size by Region
- 4.1.1 Global High Density Interconnect PCB Sales Quantity by Region (2019-2030)
- 4.1.2 Global High Density Interconnect PCB Consumption Value by Region (2019-2030)
- 4.1.3 Global High Density Interconnect PCB Average Price by Region (2019-2030)
- 4.2 North America High Density Interconnect PCB Consumption Value (2019-2030)
- 4.3 Europe High Density Interconnect PCB Consumption Value (2019-2030)
- 4.4 Asia-Pacific High Density Interconnect PCB Consumption Value (2019-2030)
- 4.5 South America High Density Interconnect PCB Consumption Value (2019-2030)
- 4.6 Middle East and Africa High Density Interconnect PCB Consumption Value (2019-2030)
5 Market Segment by Type
- 5.1 Global High Density Interconnect PCB Sales Quantity by Type (2019-2030)
- 5.2 Global High Density Interconnect PCB Consumption Value by Type (2019-2030)
- 5.3 Global High Density Interconnect PCB Average Price by Type (2019-2030)
6 Market Segment by Application
- 6.1 Global High Density Interconnect PCB Sales Quantity by Application (2019-2030)
- 6.2 Global High Density Interconnect PCB Consumption Value by Application (2019-2030)
- 6.3 Global High Density Interconnect PCB Average Price by Application (2019-2030)
7 North America
- 7.1 North America High Density Interconnect PCB Sales Quantity by Type (2019-2030)
- 7.2 North America High Density Interconnect PCB Sales Quantity by Application (2019-2030)
- 7.3 North America High Density Interconnect PCB Market Size by Country
- 7.3.1 North America High Density Interconnect PCB Sales Quantity by Country (2019-2030)
- 7.3.2 North America High Density Interconnect PCB Consumption Value by Country (2019-2030)
- 7.3.3 United States Market Size and Forecast (2019-2030)
- 7.3.4 Canada Market Size and Forecast (2019-2030)
- 7.3.5 Mexico Market Size and Forecast (2019-2030)
8 Europe
- 8.1 Europe High Density Interconnect PCB Sales Quantity by Type (2019-2030)
- 8.2 Europe High Density Interconnect PCB Sales Quantity by Application (2019-2030)
- 8.3 Europe High Density Interconnect PCB Market Size by Country
- 8.3.1 Europe High Density Interconnect PCB Sales Quantity by Country (2019-2030)
- 8.3.2 Europe High Density Interconnect PCB Consumption Value by Country (2019-2030)
- 8.3.3 Germany Market Size and Forecast (2019-2030)
- 8.3.4 France Market Size and Forecast (2019-2030)
- 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
- 8.3.6 Russia Market Size and Forecast (2019-2030)
- 8.3.7 Italy Market Size and Forecast (2019-2030)
9 Asia-Pacific
- 9.1 Asia-Pacific High Density Interconnect PCB Sales Quantity by Type (2019-2030)
- 9.2 Asia-Pacific High Density Interconnect PCB Sales Quantity by Application (2019-2030)
- 9.3 Asia-Pacific High Density Interconnect PCB Market Size by Region
- 9.3.1 Asia-Pacific High Density Interconnect PCB Sales Quantity by Region (2019-2030)
- 9.3.2 Asia-Pacific High Density Interconnect PCB Consumption Value by Region (2019-2030)
- 9.3.3 China Market Size and Forecast (2019-2030)
- 9.3.4 Japan Market Size and Forecast (2019-2030)
- 9.3.5 Korea Market Size and Forecast (2019-2030)
- 9.3.6 India Market Size and Forecast (2019-2030)
- 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
- 9.3.8 Australia Market Size and Forecast (2019-2030)
10 South America
- 10.1 South America High Density Interconnect PCB Sales Quantity by Type (2019-2030)
- 10.2 South America High Density Interconnect PCB Sales Quantity by Application (2019-2030)
- 10.3 South America High Density Interconnect PCB Market Size by Country
- 10.3.1 South America High Density Interconnect PCB Sales Quantity by Country (2019-2030)
- 10.3.2 South America High Density Interconnect PCB Consumption Value by Country (2019-2030)
- 10.3.3 Brazil Market Size and Forecast (2019-2030)
- 10.3.4 Argentina Market Size and Forecast (2019-2030)
11 Middle East & Africa
- 11.1 Middle East & Africa High Density Interconnect PCB Sales Quantity by Type (2019-2030)
- 11.2 Middle East & Africa High Density Interconnect PCB Sales Quantity by Application (2019-2030)
- 11.3 Middle East & Africa High Density Interconnect PCB Market Size by Country
- 11.3.1 Middle East & Africa High Density Interconnect PCB Sales Quantity by Country (2019-2030)
- 11.3.2 Middle East & Africa High Density Interconnect PCB Consumption Value by Country (2019-2030)
- 11.3.3 Turkey Market Size and Forecast (2019-2030)
- 11.3.4 Egypt Market Size and Forecast (2019-2030)
- 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
- 11.3.6 South Africa Market Size and Forecast (2019-2030)
12 Market Dynamics
- 12.1 High Density Interconnect PCB Market Drivers
- 12.2 High Density Interconnect PCB Market Restraints
- 12.3 High Density Interconnect PCB Trends Analysis
- 12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry
13 Raw Material and Industry Chain
- 13.1 Raw Material of High Density Interconnect PCB and Key Manufacturers
- 13.2 Manufacturing Costs Percentage of High Density Interconnect PCB
- 13.3 High Density Interconnect PCB Production Process
- 13.4 High Density Interconnect PCB Industrial Chain
14 Shipments by Distribution Channel
- 14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
- 14.2 High Density Interconnect PCB Typical Distributors
- 14.3 High Density Interconnect PCB Typical Customers
15 Research Findings and Conclusion
16 Appendix
- 16.1 Methodology
- 16.2 Research Process and Data Source
Summary:
Get latest Market Research Reports on High Density Interconnect PCB. Industry analysis & Market Report on High Density Interconnect PCB is a syndicated market report, published as Global High Density Interconnect PCB Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030. It is complete Research Study and Industry Analysis of High Density Interconnect PCB market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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