Global (United States, European Union and China) High Density Interconnect (HDI) PCBs Market Research Report 2019-2025

Table of Contents

1 Report Overview

• 1.1 Research Scope
• 1.2 Major Manufacturers Covered in This Report
• 1.3 Market Segment by Type
  • 1.3.1 Global High Density Interconnect (HDI) PCBs Market Size Growth Rate by Type (2019-2025)
  • 1.3.2 4-6 Layers HDI PCBs
  • 1.3.3 8-10 Layer HDI PCBs
  • 1.3.4 10+ Layer HDI PCBs
• 1.4 Market Segment by Application
  • 1.4.1 Global High Density Interconnect (HDI) PCBs Market Share by Application (2019-2025)
  • 1.4.2 Automotive
  • 1.4.3 Computers
  • 1.4.4 Communication
  • 1.4.5 Digital
  • 1.4.6 Others
• 1.5 Study Objectives
• 1.6 Years Considered

2 Global Growth Trends

• 2.1 Production and Capacity Analysis
  • 2.1.1 Global High Density Interconnect (HDI) PCBs Production Value 2014-2025
  • 2.1.2 Global High Density Interconnect (HDI) PCBs Production 2014-2025
  • 2.1.3 Global High Density Interconnect (HDI) PCBs Capacity 2014-2025
  • 2.1.4 Global High Density Interconnect (HDI) PCBs Marketing Pricing and Trends
• 2.2 Key Producers Growth Rate (CAGR) 2019-2025
  • 2.2.1 Global High Density Interconnect (HDI) PCBs Market Size CAGR of Key Regions
  • 2.2.2 Global High Density Interconnect (HDI) PCBs Market Share of Key Regions
• 2.3 Industry Trends
  • 2.3.1 Market Top Trends
  • 2.3.2 Market Drivers

3 Market Share by Manufacturers

• 3.1 Capacity and Production by Manufacturers
  • 3.1.1 Global High Density Interconnect (HDI) PCBs Capacity by Manufacturers
  • 3.1.2 Global High Density Interconnect (HDI) PCBs Production by Manufacturers
• 3.2 Revenue by Manufacturers
  • 3.2.1 High Density Interconnect (HDI) PCBs Revenue by Manufacturers (2014-2019)
  • 3.2.2 High Density Interconnect (HDI) PCBs Revenue Share by Manufacturers (2014-2019)
  • 3.2.3 Global High Density Interconnect (HDI) PCBs Market Concentration Ratio (CR5 and HHI)
• 3.3 High Density Interconnect (HDI) PCBs Price by Manufacturers
• 3.4 Key Manufacturers High Density Interconnect (HDI) PCBs Plants/Factories Distribution and Area Served
• 3.5 Date of Key Manufacturers Enter into High Density Interconnect (HDI) PCBs Market
• 3.6 Key Manufacturers High Density Interconnect (HDI) PCBs Product Offered
• 3.7 Mergers & Acquisitions, Expansion Plans

4 Market Size by Type

• 4.1 Production and Production Value for Each Type
  • 4.1.1 4-6 Layers HDI PCBs Production and Production Value (2014-2019)
  • 4.1.2 8-10 Layer HDI PCBs Production and Production Value (2014-2019)
  • 4.1.3 10+ Layer HDI PCBs Production and Production Value (2014-2019)
• 4.2 Global High Density Interconnect (HDI) PCBs Production Market Share by Type
• 4.3 Global High Density Interconnect (HDI) PCBs Production Value Market Share by Type
• 4.4 High Density Interconnect (HDI) PCBs Ex-factory Price by Type

5 Market Size by Application

• 5.1 Overview
• 5.2 Global High Density Interconnect (HDI) PCBs Consumption by Application

6 Production by Regions

• 6.1 Global High Density Interconnect (HDI) PCBs Production (History Data) by Regions 2014-2019
• 6.2 Global High Density Interconnect (HDI) PCBs Production Value (History Data) by Regions
• 6.3 United States
  • 6.3.1 United States High Density Interconnect (HDI) PCBs Production Growth Rate 2014-2019
  • 6.3.2 United States High Density Interconnect (HDI) PCBs Production Value Growth Rate 2014-2019
  • 6.3.3 Key Players in United States
  • 6.3.4 United States High Density Interconnect (HDI) PCBs Import & Export
• 6.4 European Union
  • 6.4.1 European Union High Density Interconnect (HDI) PCBs Production Growth Rate 2014-2019
  • 6.4.2 European Union High Density Interconnect (HDI) PCBs Production Value Growth Rate 2014-2019
  • 6.4.3 Key Players in European Union
  • 6.4.4 European Union High Density Interconnect (HDI) PCBs Import & Export
• 6.5 China
  • 6.5.1 China High Density Interconnect (HDI) PCBs Production Growth Rate 2014-2019
  • 6.5.2 China High Density Interconnect (HDI) PCBs Production Value Growth Rate 2014-2019
  • 6.5.3 Key Players in China
  • 6.5.4 China High Density Interconnect (HDI) PCBs Import & Export
• 6.6 Rest of World
  • 6.6.1 Japan
  • 6.6.2 Korea
  • 6.6.3 India
  • 6.6.4 Southeast Asia

7 High Density Interconnect (HDI) PCBs Consumption by Regions

• 7.1 Global High Density Interconnect (HDI) PCBs Consumption (History Data) by Regions
• 7.2 United States
  • 7.2.1 United States High Density Interconnect (HDI) PCBs Consumption by Type
  • 7.2.2 United States High Density Interconnect (HDI) PCBs Consumption by Application
• 7.3 European Union
  • 7.3.1 European Union High Density Interconnect (HDI) PCBs Consumption by Type
  • 7.3.2 European Union High Density Interconnect (HDI) PCBs Consumption by Application
• 7.4 China
  • 7.4.1 China High Density Interconnect (HDI) PCBs Consumption by Type
  • 7.4.2 China High Density Interconnect (HDI) PCBs Consumption by Application
• 7.5 Rest of World
  • 7.5.1 Rest of World High Density Interconnect (HDI) PCBs Consumption by Type
  • 7.5.2 Rest of World High Density Interconnect (HDI) PCBs Consumption by Application
  • 7.5.1 Japan
  • 7.5.2 Korea
  • 7.5.3 India
  • 7.5.4 Southeast Asia

8 Company Profiles

• 8.1 IBIDEN Group
  • 8.1.1 IBIDEN Group Company Details
  • 8.1.2 Company Description and Business Overview
  • 8.1.3 Production and Revenue of High Density Interconnect (HDI) PCBs
  • 8.1.4 High Density Interconnect (HDI) PCBs Product Introduction
  • 8.1.5 IBIDEN Group Recent Development
• 8.2 NCAB Group
  • 8.2.1 NCAB Group Company Details
  • 8.2.2 Company Description and Business Overview
  • 8.2.3 Production and Revenue of High Density Interconnect (HDI) PCBs
  • 8.2.4 High Density Interconnect (HDI) PCBs Product Introduction
  • 8.2.5 NCAB Group Recent Development
• 8.3 Bittele Electronics
  • 8.3.1 Bittele Electronics Company Details
  • 8.3.2 Company Description and Business Overview
  • 8.3.3 Production and Revenue of High Density Interconnect (HDI) PCBs
  • 8.3.4 High Density Interconnect (HDI) PCBs Product Introduction
  • 8.3.5 Bittele Electronics Recent Development
• 8.4 TTM Technologies
  • 8.4.1 TTM Technologies Company Details
  • 8.4.2 Company Description and Business Overview
  • 8.4.3 Production and Revenue of High Density Interconnect (HDI) PCBs
  • 8.4.4 High Density Interconnect (HDI) PCBs Product Introduction
  • 8.4.5 TTM Technologies Recent Development
• 8.5 Unimicron
  • 8.5.1 Unimicron Company Details
  • 8.5.2 Company Description and Business Overview
  • 8.5.3 Production and Revenue of High Density Interconnect (HDI) PCBs
  • 8.5.4 High Density Interconnect (HDI) PCBs Product Introduction
  • 8.5.5 Unimicron Recent Development
• 8.6 AT&S
  • 8.6.1 AT&S Company Details
  • 8.6.2 Company Description and Business Overview
  • 8.6.3 Production and Revenue of High Density Interconnect (HDI) PCBs
  • 8.6.4 High Density Interconnect (HDI) PCBs Product Introduction
  • 8.6.5 AT&S Recent Development
• 8.7 SEMCO
  • 8.7.1 SEMCO Company Details
  • 8.7.2 Company Description and Business Overview
  • 8.7.3 Production and Revenue of High Density Interconnect (HDI) PCBs
  • 8.7.4 High Density Interconnect (HDI) PCBs Product Introduction
  • 8.7.5 SEMCO Recent Development
• 8.8 Young Poong Group
  • 8.8.1 Young Poong Group Company Details
  • 8.8.2 Company Description and Business Overview
  • 8.8.3 Production and Revenue of High Density Interconnect (HDI) PCBs
  • 8.8.4 High Density Interconnect (HDI) PCBs Product Introduction
  • 8.8.5 Young Poong Group Recent Development
• 8.9 ZDT
  • 8.9.1 ZDT Company Details
  • 8.9.2 Company Description and Business Overview
  • 8.9.3 Production and Revenue of High Density Interconnect (HDI) PCBs
  • 8.9.4 High Density Interconnect (HDI) PCBs Product Introduction
  • 8.9.5 ZDT Recent Development
• 8.10 Unitech Printed Circuit Board
  • 8.10.1 Unitech Printed Circuit Board Company Details
  • 8.10.2 Company Description and Business Overview
  • 8.10.3 Production and Revenue of High Density Interconnect (HDI) PCBs
  • 8.10.4 High Density Interconnect (HDI) PCBs Product Introduction
  • 8.10.5 Unitech Printed Circuit Board Recent Development
• 8.11 LG Innotek
• 8.12 Tripod Technology
• 8.13 Daeduck
• 8.14 HannStar Board
• 8.15 Nan Ya PCB
• 8.16 CMK Corporation
• 8.17 Kingboard
• 8.18 Ellington
• 8.19 Wuzhu Technology
• 8.20 Kinwong

9 Market Forecast

• 9.1 Global Market Size Forecast
  • 9.1.1 Global High Density Interconnect (HDI) PCBs Capacity, Production Forecast 2019-2025
  • 9.1.2 Global High Density Interconnect (HDI) PCBs Production Value Forecast 2019-2025
• 9.2 Market Forecast by Regions
  • 9.2.1 Global High Density Interconnect (HDI) PCBs Production and Value Forecast by Regions 2019-2025
  • 9.2.2 Global High Density Interconnect (HDI) PCBs Consumption Forecast by Regions 2019-2025
• 9.3 United States
  • 9.3.1 Production and Value Forecast in United States
  • 9.3.2 Consumption Forecast in United States
• 9.4 European Union
  • 9.4.1 Production and Value Forecast in European Union
  • 9.4.2 Consumption Forecast in European Union
• 9.5 China
  • 9.5.1 Production and Value Forecast in China
  • 9.5.2 Consumption Forecast in China
• 9.6 Rest of World
  • 9.6.1 Japan
  • 9.6.2 Korea
  • 9.6.3 India
  • 9.6.4 Southeast Asia
• 9.7 Forecast by Type
  • 9.7.1 Global High Density Interconnect (HDI) PCBs Production Forecast by Type
  • 9.7.2 Global High Density Interconnect (HDI) PCBs Production Value Forecast by Type
• 9.8 Consumption Forecast by Application

10 Value Chain and Sales Channels Analysis

• 10.1 Value Chain Analysis
• 10.2 Sales Channels Analysis
  • 10.2.1 High Density Interconnect (HDI) PCBs Sales Channels
  • 10.2.2 High Density Interconnect (HDI) PCBs Distributors
• 10.3 High Density Interconnect (HDI) PCBs Customers

11 Opportunities & Challenges, Threat and Affecting Factors

• 11.1 Market Opportunities
• 11.2 Market Challenges
• 11.3 Porter's Five Forces Analysis

12 Key Findings

13 Appendix

• 13.1 Research Methodology
  • 13.1.1 Methodology/Research Approach
    • 13.1.1.1 Research Programs/Design
    • 13.1.1.2 Market Size Estimation
    • 13.1.1.3 Market Breakdown and Data Triangulation
  • 13.1.2 Data Source
    • 13.1.2.1 Secondary Sources
    • 13.1.2.2 Primary Sources
• 13.2 Author Details