This report studies the Flip Chip Bonder market. Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method. The Flip Chip Bonder market has witnessed significant growth in the past few years, and is expected to maintain this trend during the forecast period. The global Flip Chip Bonder market is expected to reach $563.57 million by 2025 from $276.18 million in 2019, growing at a CAGR of 12.62% from 2019 to 2025.
This report focuses on Flip Chip Bonder volume and value at global level, regional level and company level. From a global perspective, this report represents overall Flip Chip Bonder market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the sales, ex-factory price, revenue and market share for each manufacturer covered in this report.
The following manufacturers are covered:
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
Amicra Germany
SET
Segment by Regions
North America
Europe
China
Japan
Rest of World
Segment by Type
Fully Automatic
Semi-Automatic
Segment by Application
IDMs
OSAT
Table of Contents
1 Flip Chip Bonder Market Overview 1
1.1 Product Overview and Scope of Flip Chip Bonder 1
1.2 Flip Chip Bonder Segment by Types 2
1.2.1 Global Flip Chip Bonder Sales Comparison by Types (2014-2025) 2
1.2.2 Fully Automatic 3
1.2.3 Semi-Automatic 4
1.3 Flip Chip Bonder Segment by Applications 4
1.3.1 Global Flip Chip Bonder Sales Comparison by Applications (2014-2025) 5
1.3.2 IDMs 6
1.3.3 OSAT 7
1.4 Global Flip Chip Bonder Market by Regions 7
1.4.1 Global Flip Chip Bonder Market Size by Regions 7
1.4.2 North America Flip Chip Bonder Status and Prospect (2014-2025) 8
1.4.3 Europe Flip Chip Bonder Status and Prospect (2014-2025) 9
1.4.4 China Flip Chip Bonder Status and Prospect (2014-2025) 10
1.4.5 Japan Flip Chip Bonder Status and Prospect (2014-2025) 11
1.5 Global Flip Chip Bonder Market Size 12
1.5.1 Global Flip Chip Bonder Revenue (2014-2025) 12
1.5.2 Global Flip Chip Bonder Sales (2014-2025) 13
2 Global Flip Chip Bonder Market Competition by Manufacturers/Brand 15
2.1 Global Flip Chip Bonder Sales (Units) and Share by Manufacturers (2014-2019) 15
2.2 Global Flip Chip Bonder Revenue (Million USD) and Share by Manufacturers (2014-2019) 17
2.3 Global Flip Chip Bonder Average Price (K USD/Unit) by Manufacturers (2014-2019) 19
Summary: Get latest Market Research Reports on Flip Chip Bonder Growth Potential 2019. Industry analysis & Market Report on Flip Chip Bonder Growth Potential 2019 is a syndicated market report, published as Global Flip Chip Bonder Growth Potential 2019. It is complete Research Study and Industry Analysis of Flip Chip Bonder Growth Potential 2019 market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.