ESD packaging is used for devices or products that can be damaged by electrostatic discharge (ESD). ESD is the sudden flow of electricity between two electrically charged objects. This flow of electricity may result in the damage of devices. ESD packaging is commonly used for packaging printed circuit boards (PCBs) and semiconductors. PCBs are mostly used in industries such as electronics and automotive and are extremely prone to ESD.
The APAC to dominate the ESD packaging market during the forecast period. The high concentration of electronic manufacturers in countries like China, Taiwan, South Korea, and Japan is the major contributor to the growth of the ESD packaging market in APAC. Also, the market is driven by the growing demand for smartphones and IT infrastructure in the region.
In 2019, the market size of ESD Packaging is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for ESD Packaging.
This report studies the global market size of ESD Packaging, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the ESD Packaging production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
BASF
Desco Industries
Dow Chemical Company
PPG Industries
AkzoNobel
DaklaPack Group
Dou Yee
GWP Group
Kao-Chia Plastics
Miller Supply
Polyplus Packaging
TIP Corporation
Uline
Market Segment by Product Type
Antistatic Latex Bag Packaging
Composite Materials Packaging
Other
Market Segment by Application
Communication Network Infrastructure
Consumer Electronics
Computer Peripherals
Aerospace and Defense
Healthcare and Instrumentation
Automotive
Other
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the ESD Packaging status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key ESD Packaging manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of ESD Packaging are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
Summary:
Get latest Market Research Reports on ESD Packaging . Industry analysis & Market Report on ESD Packaging is a syndicated market report, published as Global (United States, European Union and China) ESD Packaging Market Research Report 2019-2025. It is complete Research Study and Industry Analysis of ESD Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.