Report Detail
Global Electronic Potting & Encapsulating Market Research Report 2012-2024
- RnM3591138 |
- 12 July, 2019 |
- Global |
- 88 Pages |
- HeyReport |
- Chemical & Material
Summary
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
The global Electronic Potting & Encapsulating market will reach xxx Million USD in 2019 with CAGR xx% 2019-2024. The objective of report is to define, segment, and project the market on the basis of product type, application, and region, and to describe the content about the factors influencing market dynamics, policy, economic, technology and market entry etc.
Based on products type, the report describes major products type share of regional market. Products mentioned as follows:
Silicones
Epoxy
Polyurethane
Others
Leading vendors in the market are included based on profile, business performance etc. Vendors mentioned as follows:
Dow Corning
Henkel
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions
Based on Application, the report describes major application share of regional market. Application mentioned as follows:
Consumer Electronics
Automotive
Medical
Telecommunications
Others
Based on region, the report describes major regions market by products and application. Regions mentioned as follows:
Asia-Pacific
North America
Europe
South America
Middle East & Africa
Table of Contents
1 Market Overview
- 1.1 Objectives of Research
- 1.1.1 Definition
- 1.1.2 Specifications
- 1.2 Market Segment
- 1.2.1 by Type
- 1.2.1.1 Silicones
- 1.2.1.2 Epoxy
- 1.2.1.3 Polyurethane
- 1.2.1.4 Others
- 1.2.2 by Application
- 1.2.2.1 Consumer Electronics
- 1.2.2.2 Automotive
- 1.2.2.3 Medical
- 1.2.2.4 Telecommunications
- 1.2.2.5 Others
- 1.2.3 by Regions
- 1.2.1 by Type
2 Industry Chain
- 2.1 Industry Chain Structure
- 2.2 Upstream
- 2.3 Market
- 2.3.1 SWOT
- 2.3.2 Dynamics
3 Environmental Analysis
- 3.1 Policy
- 3.2 Economic
- 3.3 Technology
- 3.4 Market Entry
4 Market Segmentation by Type
- 4.1 Market Size
- 4.1.1 Silicones Market, 2013-2018
- 4.1.2 Epoxy Market, 2013-2018
- 4.1.3 Polyurethane Market, 2013-2018
- 4.1.4 Others Market, 2013-2018
- 4.2 Market Forecast
- 4.2.1 Silicones Market Forecast, 2019-2024
- 4.2.2 Epoxy Market Forecast, 2019-2024
- 4.2.3 Polyurethane Market Forecast, 2019-2024
- 4.2.4 Others Market Forecast, 2019-2024
5 Market Segmentation by Application
- 5.1 Market Size
- 5.1.1 Consumer Electronics Market, 2013-2018
- 5.1.2 Automotive Market, 2013-2018
- 5.1.3 Medical Market, 2013-2018
- 5.1.4 Telecommunications Market, 2013-2018
- 5.1.5 Others Market, 2013-2018
- 5.2 Market Forecast
- 5.2.1 Consumer Electronics Market Forecast, 2019-2024
- 5.2.2 Automotive Market Forecast, 2019-2024
- 5.2.3 Medical Market Forecast, 2019-2024
- 5.2.4 Telecommunications Market Forecast, 2019-2024
- 5.2.5 Others Market Forecast, 2019-2024
6 Market Segmentation by Region
- 6.1 Market Size
- 6.1.1 Asia-Pacific
- 6.1.1.1 Asia-Pacific Market, 2012-2018
- 6.1.1.2 Asia-Pacific Market by Type
- 6.1.1.3 Asia-Pacific Market by Application
- 6.1.2 North America
- 6.1.2.1 North America Market, 2012-2018
- 6.1.2.2 North America Market by Type
- 6.1.2.3 North America Market by Application
- 6.1.3 Europe
- 6.1.3.1 Europe Market, 2012-2018
- 6.1.3.2 Europe Market by Type
- 6.1.3.3 Europe Market by Application
- 6.1.4 South America
- 6.1.4.1 South America Market, 2012-2018
- 6.1.4.2 South America Market by Type
- 6.1.4.3 South America Market by Application
- 6.1.5 Middle East & Africa
- 6.1.5.1 Middle East & Africa Market, 2012-2018
- 6.1.5.2 Middle East & Africa Market by Type
- 6.1.5.3 Middle East & Africa Market by Application
- 6.1.1 Asia-Pacific
- 6.2 Market Forecast
- 6.2.1 Asia-Pacific Market Forecast, 2019-2024
- 6.2.2 North America Market Forecast, 2019-2024
- 6.2.3 Europe Market Forecast, 2019-2024
- 6.2.4 South America Market Forecast, 2019-2024
- 6.2.5 Middle East & Africa Market Forecast, 2019-2024
7 Market Competitive
- 7.1 Global Market by Vendors
- 7.2 Market Concentration
- 7.3 Price & Factors
- 7.4 Marketing Channel
8 Major Vendors
- 8.1 Dow Corning
- 8.2 Henkel
- 8.3 Hitachi Chemical
- 8.4 LORD Corporation
- 8.5 Huntsman Corporation
- 8.6 ITW Engineered Polymers
- 8.7 3M
- 8.8 H.B. Fuller
- 8.9 John C. Dolph
- 8.10 Master Bond
- 8.11 ACC Silicones
- 8.12 Epic Resins
- 8.13 Plasma Ruggedized Solutions
9 Conclusion
Summary:
Get latest Market Research Reports on Electronic Potting & Encapsulating . Industry analysis & Market Report on Electronic Potting & Encapsulating is a syndicated market report, published as Global Electronic Potting & Encapsulating Market Research Report 2012-2024. It is complete Research Study and Industry Analysis of Electronic Potting & Encapsulating market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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