This report studies the Electronic Packaging Materials market.
Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.
Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
In 2017, Global Electronic Packaging Materials total market size was 4885.6 Million USD, with a steady growth in recent years, according to QYR analysis, the market is expected to reach 6104.9 Million USD by the end of 2023. One of the salient features of Electronic Packaging Materials market is the cooperation with downstream Semiconductor & IC and PCB manufactures, especially for large companies in this industry.
Geographically, the consumption market is leading by Greater China and United States, Europe and Japan. In terms of year 2017, Greater China holds the largest market share, with about 1975.5 Million USD sales revenue, followed by United States, with about 14.76% market share in 2017. China will keep playing important role in Global market.
According to this study, over the next five years the Electronic Packaging Materials market will register a 3.6% CAGR in terms of revenue, the global market size will reach US$ 6050 million by 2024, from US$ 4890 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Electronic Packaging Materials business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Electronic Packaging Materials market by product type, application, key manufacturers and key regions and countries.
This study considers the Electronic Packaging Materials value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Metal Packages
Plastic Packages
Ceramic Packages
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Semiconductor & IC
PCB
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Electronic Packaging Materials consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Electronic Packaging Materials market by identifying its various subsegments.
Focuses on the key global Electronic Packaging Materials manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Electronic Packaging Materials with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Electronic Packaging Materials submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Summary:
Get latest Market Research Reports on Electronic Packaging Materials . Industry analysis & Market Report on Electronic Packaging Materials is a syndicated market report, published as Global Electronic Packaging Materials Market Growth 2019-2024. It is complete Research Study and Industry Analysis of Electronic Packaging Materials market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.