E-Chuck for Wafer is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.
In 2019, the market size of E-Chuck for Wafer is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for E-Chuck for Wafer.
This report studies the global market size of E-Chuck for Wafer, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the E-Chuck for Wafer production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
SHINKO
TOTO
Creative Technology Corporation
Kyocera
FM Industries
NTK CERATEC
Tsukuba Seiko
Applied Materials
II-VI M Cubed
Market Segment by Product Type
Coulomb Type E-Chuck for Wafer
Johnsen-Rahbek (JR) Type E-Chuck for Wafer
Market Segment by Application
300 mm Wafer
200 mm Wafer
Others
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the E-Chuck for Wafer status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key E-Chuck for Wafer manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of E-Chuck for Wafer are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
Summary:
Get latest Market Research Reports on E-Chuck for Wafer. Industry analysis & Market Report on E-Chuck for Wafer is a syndicated market report, published as Global (United States, European Union and China) E-Chuck for Wafer Market Research Report 2019-2025. It is complete Research Study and Industry Analysis of E-Chuck for Wafer market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.