Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.
Tip: It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to QYR's investigation, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.
According to our (Global Info Research) latest study, the global Die Attach Materials market size was valued at USD 586.8 million in 2022 and is forecast to a readjusted size of USD 674.5 million by 2029 with a CAGR of 2.0% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The major players in global Die-Attach Materials market include Alpha Assembly Solutions, SMIC, Shenmao Technology, etc. The top 3 players occupy about 40% shares of the global market. Asia Pacific and North America are main markets, they occupy about 90% of the global market. Die Attach Paste is the main type, with a share about 85%. SMT Assembly is the main application, which holds a share about 50%.
This report is a detailed and comprehensive analysis for global Die Attach Materials market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Die Attach Materials market size and forecasts, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/MT), 2018-2029
Global Die Attach Materials market size and forecasts by region and country, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/MT), 2018-2029
Global Die Attach Materials market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/MT), 2018-2029
Global Die Attach Materials market shares of main players, shipments in revenue ($ Million), sales quantity (MT), and ASP (US$/MT), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Die Attach Materials
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Die Attach Materials market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Alpha Assembly Solutions, SMIC, Henkel, Shenmao Technology and Heraeu, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Die Attach Materials market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Die Attach Paste
Die Attach Wire
Others
Market segment by Application
SMT Assembly
Semiconductor Packaging
Automotive
Medical
Others
Major players covered
Alpha Assembly Solutions
SMIC
Henkel
Shenmao Technology
Heraeu
Shenzhen Weite New Material
Sumitomo Bakelite
Indium
AIM
Tamura
Kyocera
TONGFANG TECH
NAMICS
Hitachi Chemical
Nordson EFD
Asahi Solder
Dow
Shanghai Jinji
Inkron
Palomar Technologies
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Die Attach Materials product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Die Attach Materials, with price, sales, revenue and global market share of Die Attach Materials from 2018 to 2023.
Chapter 3, the Die Attach Materials competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Die Attach Materials breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Die Attach Materials market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Die Attach Materials.
Chapter 14 and 15, to describe Die Attach Materials sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Die Attach Materials . Industry analysis & Market Report on Die Attach Materials is a syndicated market report, published as Global Die Attach Materials Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029. It is complete Research Study and Industry Analysis of Die Attach Materials market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.