This report covers market size and forecasts of Thermal Conductive Adhesives, including the following market information:
Global Thermal Conductive Adhesives Market Size, 2019-2021, and 2020 (quarterly data), (US$ Million) & (K MT)
Global Thermal Conductive Adhesives Market Size by Type and by Application, 2019-2021, and 2020 (quarterly data), (US$ Million) & (K MT)
Global Thermal Conductive Adhesives Market Size by Region (and Key Countries), 2019-2021, and 2020 (quarterly data), (US$ Million) & (K MT)
Global Thermal Conductive Adhesives Market Size by Company, 2019- 2020 (quarterly data), (US$ Million) & (K MT)
Key market players
Major competitors identified in this market include Henkel AG & Co. KGaA, H.B. Fuller, 3M Company, Permabond Engineering Adhesives, Masterbond, Creative Materials Inc., Panacol-Elosol GmbH, DOW Corning, Polytec PT GmbH, Lord Corporation, MG Chemicals, Protavic America, Inc., Aremco, Cast-Coat, Inc., Nagase America Corporation, etc.
Based on the Region:
Asia-Pacific (China, Japan, South Korea, India and ASEAN)
North America (US and Canada)
Europe (Germany, France, UK and Italy)
Rest of World (Latin America, Middle East & Africa)
Based on the Type:
Silicones
Epoxies
Polyurethanes
Acrylics
Based on the Application:
Battery Thermal
Heat Sink
IC Packaging Heat Conduction
LED Lighting Thermal
Thermal Material Potting
Summary:
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