This report covers market size and forecasts of Power Module Packaging, including the following market information:
Global Power Module Packaging Market Size, 2019-2021, and 2020 (quarterly data), (US$ Million) & (K Units)
Global Power Module Packaging Market Size by Type and by Application, 2019-2021, and 2020 (quarterly data), (US$ Million) & (K Units)
Global Power Module Packaging Market Size by Region (and Key Countries), 2019-2021, and 2020 (quarterly data), (US$ Million) & (K Units)
Global Power Module Packaging Market Size by Company, 2019- 2020 (quarterly data), (US$ Million) & (K Units)
Key market players
Major competitors identified in this market include Texas Instruments Incorporated, Star Automations, DyDac Controls, SEMIKRON, IXYS Corporation, Infineon Technologies AG, Mitsubishi Electric Corporation, Fuji Electric Co. Ltd., Sanken Electric Co., Ltd., SanRex Corporation, ON Semiconductor, STMicroelectronics, Hitachi Power Semiconductor Device, ROHM, Danfoss, etc.
Based on the Region:
Asia-Pacific (China, Japan, South Korea, India and ASEAN)
North America (US and Canada)
Europe (Germany, France, UK and Italy)
Rest of World (Latin America, Middle East & Africa)
Based on the Type:
GaN Module
SiC Module
FET Module
IGBT Module
Thyristors
Based on the Application:
Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
Motors
Rail Tractions
Wind Turbines
Photovoltaic Equipment
Summary:
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