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Electronics & Semiconductor Global Circuit Board Heat Sink Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

  • RnM4608205
    • |
  • 19 August, 2024
    • |
  • Global
    • |
  • 121 Pages
    • |
  • GIR (Global Info Research)
    • |
  • Electronics & Semiconductor

A circuit board heat sink is a cooling device attached to the circuit boards of electronic equipment and computers. They are used to stabilize circuit operation by dissipating heat generated by electronic and electrical components mounted on printed circuit boards. Semiconductor components in various circuits tend to generate large amounts of heat when large drive power is required.
With the evolution of semiconductor processes, large-scale integrated circuits have been realized in extremely small sizes. In devices that realize such complex and advanced functions and performance, the amount of heat generated is also often large. To reduce the amount of heat generated, various efforts are being made on the semiconductor device side to reduce power consumption. However, in most cases, heat sinks are required to maintain stable operation when used in various environments.
According to our (Global Info Research) latest study, the global Circuit Board Heat Sink market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of %during review period.
This report is a detailed and comprehensive analysis for global Circuit Board Heat Sink market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.
Key Features:
Global Circuit Board Heat Sink market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2019-2030
Global Circuit Board Heat Sink market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2019-2030
Global Circuit Board Heat Sink market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2019-2030
Global Circuit Board Heat Sink market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2019-2024
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Circuit Board Heat Sink
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Circuit Board Heat Sink market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Nishimura Advanced Ceramics, Millennium Circuits Limited, Epec, A.L.M.T. Corp., Nippon Electric Glass, Resonac Holdings Corporation, RayMing Technology, Himalay Engineering, PW Circuits Ltd, Zaward Corporation, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Circuit Board Heat Sink market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Natural Air Cooling
Forced Air Cooling
Market segment by Application
Industrial Equipment
Consumer Electronics
Others
Major players covered
Nishimura Advanced Ceramics
Millennium Circuits Limited
Epec
A.L.M.T. Corp.
Nippon Electric Glass
Resonac Holdings Corporation
RayMing Technology
Himalay Engineering
PW Circuits Ltd
Zaward Corporation
db Electronic
TAKAGI MFG.CO.,LTD.
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Circuit Board Heat Sink product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Circuit Board Heat Sink, with price, sales quantity, revenue, and global market share of Circuit Board Heat Sink from 2019 to 2024.
Chapter 3, the Circuit Board Heat Sink competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Circuit Board Heat Sink breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Circuit Board Heat Sink market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Circuit Board Heat Sink.
Chapter 14 and 15, to describe Circuit Board Heat Sink sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Circuit Board Heat Sink Consumption Value by Type: 2019 Versus 2023 Versus 2030
    • 1.3.2 Natural Air Cooling
    • 1.3.3 Forced Air Cooling
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Circuit Board Heat Sink Consumption Value by Application: 2019 Versus 2023 Versus 2030
    • 1.4.2 Industrial Equipment
    • 1.4.3 Consumer Electronics
    • 1.4.4 Others
  • 1.5 Global Circuit Board Heat Sink Market Size & Forecast
    • 1.5.1 Global Circuit Board Heat Sink Consumption Value (2019 & 2023 & 2030)
    • 1.5.2 Global Circuit Board Heat Sink Sales Quantity (2019-2030)
    • 1.5.3 Global Circuit Board Heat Sink Average Price (2019-2030)

2 Manufacturers Profiles

  • 2.1 Nishimura Advanced Ceramics
    • 2.1.1 Nishimura Advanced Ceramics Details
    • 2.1.2 Nishimura Advanced Ceramics Major Business
    • 2.1.3 Nishimura Advanced Ceramics Circuit Board Heat Sink Product and Services
    • 2.1.4 Nishimura Advanced Ceramics Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.1.5 Nishimura Advanced Ceramics Recent Developments/Updates
  • 2.2 Millennium Circuits Limited
    • 2.2.1 Millennium Circuits Limited Details
    • 2.2.2 Millennium Circuits Limited Major Business
    • 2.2.3 Millennium Circuits Limited Circuit Board Heat Sink Product and Services
    • 2.2.4 Millennium Circuits Limited Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.2.5 Millennium Circuits Limited Recent Developments/Updates
  • 2.3 Epec
    • 2.3.1 Epec Details
    • 2.3.2 Epec Major Business
    • 2.3.3 Epec Circuit Board Heat Sink Product and Services
    • 2.3.4 Epec Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.3.5 Epec Recent Developments/Updates
  • 2.4 A.L.M.T. Corp.
    • 2.4.1 A.L.M.T. Corp. Details
    • 2.4.2 A.L.M.T. Corp. Major Business
    • 2.4.3 A.L.M.T. Corp. Circuit Board Heat Sink Product and Services
    • 2.4.4 A.L.M.T. Corp. Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.4.5 A.L.M.T. Corp. Recent Developments/Updates
  • 2.5 Nippon Electric Glass
    • 2.5.1 Nippon Electric Glass Details
    • 2.5.2 Nippon Electric Glass Major Business
    • 2.5.3 Nippon Electric Glass Circuit Board Heat Sink Product and Services
    • 2.5.4 Nippon Electric Glass Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.5.5 Nippon Electric Glass Recent Developments/Updates
  • 2.6 Resonac Holdings Corporation
    • 2.6.1 Resonac Holdings Corporation Details
    • 2.6.2 Resonac Holdings Corporation Major Business
    • 2.6.3 Resonac Holdings Corporation Circuit Board Heat Sink Product and Services
    • 2.6.4 Resonac Holdings Corporation Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.6.5 Resonac Holdings Corporation Recent Developments/Updates
  • 2.7 RayMing Technology
    • 2.7.1 RayMing Technology Details
    • 2.7.2 RayMing Technology Major Business
    • 2.7.3 RayMing Technology Circuit Board Heat Sink Product and Services
    • 2.7.4 RayMing Technology Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.7.5 RayMing Technology Recent Developments/Updates
  • 2.8 Himalay Engineering
    • 2.8.1 Himalay Engineering Details
    • 2.8.2 Himalay Engineering Major Business
    • 2.8.3 Himalay Engineering Circuit Board Heat Sink Product and Services
    • 2.8.4 Himalay Engineering Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.8.5 Himalay Engineering Recent Developments/Updates
  • 2.9 PW Circuits Ltd
    • 2.9.1 PW Circuits Ltd Details
    • 2.9.2 PW Circuits Ltd Major Business
    • 2.9.3 PW Circuits Ltd Circuit Board Heat Sink Product and Services
    • 2.9.4 PW Circuits Ltd Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.9.5 PW Circuits Ltd Recent Developments/Updates
  • 2.10 Zaward Corporation
    • 2.10.1 Zaward Corporation Details
    • 2.10.2 Zaward Corporation Major Business
    • 2.10.3 Zaward Corporation Circuit Board Heat Sink Product and Services
    • 2.10.4 Zaward Corporation Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.10.5 Zaward Corporation Recent Developments/Updates
  • 2.11 db Electronic
    • 2.11.1 db Electronic Details
    • 2.11.2 db Electronic Major Business
    • 2.11.3 db Electronic Circuit Board Heat Sink Product and Services
    • 2.11.4 db Electronic Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.11.5 db Electronic Recent Developments/Updates
  • 2.12 TAKAGI MFG.CO.,LTD.
    • 2.12.1 TAKAGI MFG.CO.,LTD. Details
    • 2.12.2 TAKAGI MFG.CO.,LTD. Major Business
    • 2.12.3 TAKAGI MFG.CO.,LTD. Circuit Board Heat Sink Product and Services
    • 2.12.4 TAKAGI MFG.CO.,LTD. Circuit Board Heat Sink Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.12.5 TAKAGI MFG.CO.,LTD. Recent Developments/Updates

3 Competitive Environment: Circuit Board Heat Sink by Manufacturer

  • 3.1 Global Circuit Board Heat Sink Sales Quantity by Manufacturer (2019-2024)
  • 3.2 Global Circuit Board Heat Sink Revenue by Manufacturer (2019-2024)
  • 3.3 Global Circuit Board Heat Sink Average Price by Manufacturer (2019-2024)
  • 3.4 Market Share Analysis (2023)
    • 3.4.1 Producer Shipments of Circuit Board Heat Sink by Manufacturer Revenue ($MM) and Market Share (%): 2023
    • 3.4.2 Top 3 Circuit Board Heat Sink Manufacturer Market Share in 2023
    • 3.4.3 Top 6 Circuit Board Heat Sink Manufacturer Market Share in 2023
  • 3.5 Circuit Board Heat Sink Market: Overall Company Footprint Analysis
    • 3.5.1 Circuit Board Heat Sink Market: Region Footprint
    • 3.5.2 Circuit Board Heat Sink Market: Company Product Type Footprint
    • 3.5.3 Circuit Board Heat Sink Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Circuit Board Heat Sink Market Size by Region
    • 4.1.1 Global Circuit Board Heat Sink Sales Quantity by Region (2019-2030)
    • 4.1.2 Global Circuit Board Heat Sink Consumption Value by Region (2019-2030)
    • 4.1.3 Global Circuit Board Heat Sink Average Price by Region (2019-2030)
  • 4.2 North America Circuit Board Heat Sink Consumption Value (2019-2030)
  • 4.3 Europe Circuit Board Heat Sink Consumption Value (2019-2030)
  • 4.4 Asia-Pacific Circuit Board Heat Sink Consumption Value (2019-2030)
  • 4.5 South America Circuit Board Heat Sink Consumption Value (2019-2030)
  • 4.6 Middle East & Africa Circuit Board Heat Sink Consumption Value (2019-2030)

5 Market Segment by Type

  • 5.1 Global Circuit Board Heat Sink Sales Quantity by Type (2019-2030)
  • 5.2 Global Circuit Board Heat Sink Consumption Value by Type (2019-2030)
  • 5.3 Global Circuit Board Heat Sink Average Price by Type (2019-2030)

6 Market Segment by Application

  • 6.1 Global Circuit Board Heat Sink Sales Quantity by Application (2019-2030)
  • 6.2 Global Circuit Board Heat Sink Consumption Value by Application (2019-2030)
  • 6.3 Global Circuit Board Heat Sink Average Price by Application (2019-2030)

7 North America

  • 7.1 North America Circuit Board Heat Sink Sales Quantity by Type (2019-2030)
  • 7.2 North America Circuit Board Heat Sink Sales Quantity by Application (2019-2030)
  • 7.3 North America Circuit Board Heat Sink Market Size by Country
    • 7.3.1 North America Circuit Board Heat Sink Sales Quantity by Country (2019-2030)
    • 7.3.2 North America Circuit Board Heat Sink Consumption Value by Country (2019-2030)
    • 7.3.3 United States Market Size and Forecast (2019-2030)
    • 7.3.4 Canada Market Size and Forecast (2019-2030)
    • 7.3.5 Mexico Market Size and Forecast (2019-2030)

8 Europe

  • 8.1 Europe Circuit Board Heat Sink Sales Quantity by Type (2019-2030)
  • 8.2 Europe Circuit Board Heat Sink Sales Quantity by Application (2019-2030)
  • 8.3 Europe Circuit Board Heat Sink Market Size by Country
    • 8.3.1 Europe Circuit Board Heat Sink Sales Quantity by Country (2019-2030)
    • 8.3.2 Europe Circuit Board Heat Sink Consumption Value by Country (2019-2030)
    • 8.3.3 Germany Market Size and Forecast (2019-2030)
    • 8.3.4 France Market Size and Forecast (2019-2030)
    • 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
    • 8.3.6 Russia Market Size and Forecast (2019-2030)
    • 8.3.7 Italy Market Size and Forecast (2019-2030)

9 Asia-Pacific

  • 9.1 Asia-Pacific Circuit Board Heat Sink Sales Quantity by Type (2019-2030)
  • 9.2 Asia-Pacific Circuit Board Heat Sink Sales Quantity by Application (2019-2030)
  • 9.3 Asia-Pacific Circuit Board Heat Sink Market Size by Region
    • 9.3.1 Asia-Pacific Circuit Board Heat Sink Sales Quantity by Region (2019-2030)
    • 9.3.2 Asia-Pacific Circuit Board Heat Sink Consumption Value by Region (2019-2030)
    • 9.3.3 China Market Size and Forecast (2019-2030)
    • 9.3.4 Japan Market Size and Forecast (2019-2030)
    • 9.3.5 South Korea Market Size and Forecast (2019-2030)
    • 9.3.6 India Market Size and Forecast (2019-2030)
    • 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
    • 9.3.8 Australia Market Size and Forecast (2019-2030)

10 South America

  • 10.1 South America Circuit Board Heat Sink Sales Quantity by Type (2019-2030)
  • 10.2 South America Circuit Board Heat Sink Sales Quantity by Application (2019-2030)
  • 10.3 South America Circuit Board Heat Sink Market Size by Country
    • 10.3.1 South America Circuit Board Heat Sink Sales Quantity by Country (2019-2030)
    • 10.3.2 South America Circuit Board Heat Sink Consumption Value by Country (2019-2030)
    • 10.3.3 Brazil Market Size and Forecast (2019-2030)
    • 10.3.4 Argentina Market Size and Forecast (2019-2030)

11 Middle East & Africa

  • 11.1 Middle East & Africa Circuit Board Heat Sink Sales Quantity by Type (2019-2030)
  • 11.2 Middle East & Africa Circuit Board Heat Sink Sales Quantity by Application (2019-2030)
  • 11.3 Middle East & Africa Circuit Board Heat Sink Market Size by Country
    • 11.3.1 Middle East & Africa Circuit Board Heat Sink Sales Quantity by Country (2019-2030)
    • 11.3.2 Middle East & Africa Circuit Board Heat Sink Consumption Value by Country (2019-2030)
    • 11.3.3 Turkey Market Size and Forecast (2019-2030)
    • 11.3.4 Egypt Market Size and Forecast (2019-2030)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
    • 11.3.6 South Africa Market Size and Forecast (2019-2030)

12 Market Dynamics

  • 12.1 Circuit Board Heat Sink Market Drivers
  • 12.2 Circuit Board Heat Sink Market Restraints
  • 12.3 Circuit Board Heat Sink Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Circuit Board Heat Sink and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Circuit Board Heat Sink
  • 13.3 Circuit Board Heat Sink Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Circuit Board Heat Sink Typical Distributors
  • 14.3 Circuit Board Heat Sink Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Circuit Board Heat Sink. Industry analysis & Market Report on Circuit Board Heat Sink is a syndicated market report, published as Global Circuit Board Heat Sink Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030. It is complete Research Study and Industry Analysis of Circuit Board Heat Sink market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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