Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn't have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.
COF is the role of product through the flexible substrate and connected to on-chip liquid crystal panel, the liquid crystal panel and the control chip driver current, voltage, thus changing the state of the liquid crystal display different screens. Currently, COF products are widely used in LCD TVs, smart 3G phones and laptop computers and other products with LCD display driver.
Driven by a growing range of applications in the automotive, industrial, military, aerospace, computer, telecommunication, consumer electronics, and medical electronics industries, miniaturization and the use of flex circuits continue to be of prime interest to electronics manufacturers.
In China, COF manufactures mainly include Danbond Technology, AKM Industrial, Compass Technology Company and others. China is the world’s third producer of COF and the world’s biggest consumption market.
The Chip On Flex (COF) market was valued at 1490 Million US$ in 2018 and is projected to reach 2030 Million US$ by 2025, at a CAGR of 4.5% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Chip On Flex (COF).
This report presents the worldwide Chip On Flex (COF) market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
LGIT
Stemco
Flexceed
Chipbond Technology
CWE
Danbond Technology
AKM Industrial
Compass Technology Company
Compunetics
STARS Microelectronics
Chip On Flex (COF) Breakdown Data by Type
Single sided COF
Others
Chip On Flex (COF) Breakdown Data by Application
Military
Medical
Aerospace
Electronics
Other
Chip On Flex (COF) Production by Region
United States
Europe
China
Japan
South Korea
Other Regions
Chip On Flex (COF) Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global Chip On Flex (COF) status and future forecast,involving, production, revenue, consumption, historical and forecast.
To present the key Chip On Flex (COF) manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of Chip On Flex (COF) :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (K Pcs). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Chip On Flex (COF) market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Summary:
Get latest Market Research Reports on Chip On Flex (COF) . Industry analysis & Market Report on Chip On Flex (COF) is a syndicated market report, published as Global Chip On Flex (COF) Market Insights, Forecast to 2025. It is complete Research Study and Industry Analysis of Chip On Flex (COF) market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.