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Chemical & Material Global Chip On Film Underfill (COF) Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

  • RnM4617119
    • |
  • 26 September, 2024
    • |
  • Global
    • |
  • 136 Pages
    • |
  • GIR (Global Info Research)
    • |
  • Chemical & Material

Underfills serve the purpose of equalizing stresses between chip and substrate. Chips are attached directly to the interconnection points without intermediate elements. Stresses arise at the solder bumps when the electronic modules are heated and cooled during operation due to the different coefficients of thermal expansion of the substrates. Underfill technology was developed to counteract these mechanical influences. The Chip On Film Underfill (COF) market covers Capillary Underfill (CUF), No Flow Underfill (NUF), Non-Conductive Paste (NCP) Underfill, Non-Conductive Film (NCF) Underfill, Molded Underfill (MUF) Underfill, etc. The typical players include Namics Corporation, AI Technology, Henkel, Shenzhen Dover, Darbond, LORD Corporation, Panacol, Won Chemical, etc.
According to our (Global Info Research) latest study, the global Chip On Film Underfill (COF) market size was valued at US$ 385 million in 2023 and is forecast to a readjusted size of USD 479 million by 2030 with a CAGR of 3.2% during review period.
Global Chip On Film Underfill (COF) includes Henkel, Won Chemical, etc. Global top 2 companies hold a share over 43.19%. Asia-Pacific is the largest market, with a share about 49.18%, followed by North America and Europe with the share about 24.91% and 18.09%.
This report is a detailed and comprehensive analysis for global Chip On Film Underfill (COF) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.
Key Features:
Global Chip On Film Underfill (COF) market size and forecasts, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/KG), 2019-2030
Global Chip On Film Underfill (COF) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/KG), 2019-2030
Global Chip On Film Underfill (COF) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/KG), 2019-2030
Global Chip On Film Underfill (COF) market shares of main players, shipments in revenue ($ Million), sales quantity (MT), and ASP (US$/KG), 2019-2024
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Chip On Film Underfill (COF)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Chip On Film Underfill (COF) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, Won Chemical, LORD Corporation, Hanstars, Fuji Chemical, Panacol, Namics Corporation, Shenzhen Dover, Shin-Etsu Chemical, Bondline, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Chip On Film Underfill (COF) market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Capillary Underfill (CUF)
No Flow Underfill (NUF)
Non-Conductive Paste (NCP) Underfill
Non-Conductive Film (NCF) Underfill
Molded Underfill (MUF) Underfill
Market segment by Application
Cell Phone
Tablet
LCD Display
Others
Major players covered
Henkel
Won Chemical
LORD Corporation
Hanstars
Fuji Chemical
Panacol
Namics Corporation
Shenzhen Dover
Shin-Etsu Chemical
Bondline
Zymet
AIM Solder
MacDermid (Alpha Advanced Materials)
Darbond
AI Technology
Master Bond
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Chip On Film Underfill (COF) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Chip On Film Underfill (COF), with price, sales quantity, revenue, and global market share of Chip On Film Underfill (COF) from 2019 to 2024.
Chapter 3, the Chip On Film Underfill (COF) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Chip On Film Underfill (COF) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Chip On Film Underfill (COF) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Chip On Film Underfill (COF).
Chapter 14 and 15, to describe Chip On Film Underfill (COF) sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Chip On Film Underfill (COF) Consumption Value by Type: 2019 Versus 2023 Versus 2030
    • 1.3.2 Capillary Underfill (CUF)
    • 1.3.3 No Flow Underfill (NUF)
    • 1.3.4 Non-Conductive Paste (NCP) Underfill
    • 1.3.5 Non-Conductive Film (NCF) Underfill
    • 1.3.6 Molded Underfill (MUF) Underfill
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Chip On Film Underfill (COF) Consumption Value by Application: 2019 Versus 2023 Versus 2030
    • 1.4.2 Cell Phone
    • 1.4.3 Tablet
    • 1.4.4 LCD Display
    • 1.4.5 Others
  • 1.5 Global Chip On Film Underfill (COF) Market Size & Forecast
    • 1.5.1 Global Chip On Film Underfill (COF) Consumption Value (2019 & 2023 & 2030)
    • 1.5.2 Global Chip On Film Underfill (COF) Sales Quantity (2019-2030)
    • 1.5.3 Global Chip On Film Underfill (COF) Average Price (2019-2030)

2 Manufacturers Profiles

  • 2.1 Henkel
    • 2.1.1 Henkel Details
    • 2.1.2 Henkel Major Business
    • 2.1.3 Henkel Chip On Film Underfill (COF) Product and Services
    • 2.1.4 Henkel Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.1.5 Henkel Recent Developments/Updates
  • 2.2 Won Chemical
    • 2.2.1 Won Chemical Details
    • 2.2.2 Won Chemical Major Business
    • 2.2.3 Won Chemical Chip On Film Underfill (COF) Product and Services
    • 2.2.4 Won Chemical Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.2.5 Won Chemical Recent Developments/Updates
  • 2.3 LORD Corporation
    • 2.3.1 LORD Corporation Details
    • 2.3.2 LORD Corporation Major Business
    • 2.3.3 LORD Corporation Chip On Film Underfill (COF) Product and Services
    • 2.3.4 LORD Corporation Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.3.5 LORD Corporation Recent Developments/Updates
  • 2.4 Hanstars
    • 2.4.1 Hanstars Details
    • 2.4.2 Hanstars Major Business
    • 2.4.3 Hanstars Chip On Film Underfill (COF) Product and Services
    • 2.4.4 Hanstars Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.4.5 Hanstars Recent Developments/Updates
  • 2.5 Fuji Chemical
    • 2.5.1 Fuji Chemical Details
    • 2.5.2 Fuji Chemical Major Business
    • 2.5.3 Fuji Chemical Chip On Film Underfill (COF) Product and Services
    • 2.5.4 Fuji Chemical Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.5.5 Fuji Chemical Recent Developments/Updates
  • 2.6 Panacol
    • 2.6.1 Panacol Details
    • 2.6.2 Panacol Major Business
    • 2.6.3 Panacol Chip On Film Underfill (COF) Product and Services
    • 2.6.4 Panacol Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.6.5 Panacol Recent Developments/Updates
  • 2.7 Namics Corporation
    • 2.7.1 Namics Corporation Details
    • 2.7.2 Namics Corporation Major Business
    • 2.7.3 Namics Corporation Chip On Film Underfill (COF) Product and Services
    • 2.7.4 Namics Corporation Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.7.5 Namics Corporation Recent Developments/Updates
  • 2.8 Shenzhen Dover
    • 2.8.1 Shenzhen Dover Details
    • 2.8.2 Shenzhen Dover Major Business
    • 2.8.3 Shenzhen Dover Chip On Film Underfill (COF) Product and Services
    • 2.8.4 Shenzhen Dover Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.8.5 Shenzhen Dover Recent Developments/Updates
  • 2.9 Shin-Etsu Chemical
    • 2.9.1 Shin-Etsu Chemical Details
    • 2.9.2 Shin-Etsu Chemical Major Business
    • 2.9.3 Shin-Etsu Chemical Chip On Film Underfill (COF) Product and Services
    • 2.9.4 Shin-Etsu Chemical Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.9.5 Shin-Etsu Chemical Recent Developments/Updates
  • 2.10 Bondline
    • 2.10.1 Bondline Details
    • 2.10.2 Bondline Major Business
    • 2.10.3 Bondline Chip On Film Underfill (COF) Product and Services
    • 2.10.4 Bondline Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.10.5 Bondline Recent Developments/Updates
  • 2.11 Zymet
    • 2.11.1 Zymet Details
    • 2.11.2 Zymet Major Business
    • 2.11.3 Zymet Chip On Film Underfill (COF) Product and Services
    • 2.11.4 Zymet Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.11.5 Zymet Recent Developments/Updates
  • 2.12 AIM Solder
    • 2.12.1 AIM Solder Details
    • 2.12.2 AIM Solder Major Business
    • 2.12.3 AIM Solder Chip On Film Underfill (COF) Product and Services
    • 2.12.4 AIM Solder Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.12.5 AIM Solder Recent Developments/Updates
  • 2.13 MacDermid (Alpha Advanced Materials)
    • 2.13.1 MacDermid (Alpha Advanced Materials) Details
    • 2.13.2 MacDermid (Alpha Advanced Materials) Major Business
    • 2.13.3 MacDermid (Alpha Advanced Materials) Chip On Film Underfill (COF) Product and Services
    • 2.13.4 MacDermid (Alpha Advanced Materials) Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.13.5 MacDermid (Alpha Advanced Materials) Recent Developments/Updates
  • 2.14 Darbond
    • 2.14.1 Darbond Details
    • 2.14.2 Darbond Major Business
    • 2.14.3 Darbond Chip On Film Underfill (COF) Product and Services
    • 2.14.4 Darbond Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.14.5 Darbond Recent Developments/Updates
  • 2.15 AI Technology
    • 2.15.1 AI Technology Details
    • 2.15.2 AI Technology Major Business
    • 2.15.3 AI Technology Chip On Film Underfill (COF) Product and Services
    • 2.15.4 AI Technology Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.15.5 AI Technology Recent Developments/Updates
  • 2.16 Master Bond
    • 2.16.1 Master Bond Details
    • 2.16.2 Master Bond Major Business
    • 2.16.3 Master Bond Chip On Film Underfill (COF) Product and Services
    • 2.16.4 Master Bond Chip On Film Underfill (COF) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.16.5 Master Bond Recent Developments/Updates

3 Competitive Environment: Chip On Film Underfill (COF) by Manufacturer

  • 3.1 Global Chip On Film Underfill (COF) Sales Quantity by Manufacturer (2019-2024)
  • 3.2 Global Chip On Film Underfill (COF) Revenue by Manufacturer (2019-2024)
  • 3.3 Global Chip On Film Underfill (COF) Average Price by Manufacturer (2019-2024)
  • 3.4 Market Share Analysis (2023)
    • 3.4.1 Producer Shipments of Chip On Film Underfill (COF) by Manufacturer Revenue ($MM) and Market Share (%): 2023
    • 3.4.2 Top 3 Chip On Film Underfill (COF) Manufacturer Market Share in 2023
    • 3.4.3 Top 6 Chip On Film Underfill (COF) Manufacturer Market Share in 2023
  • 3.5 Chip On Film Underfill (COF) Market: Overall Company Footprint Analysis
    • 3.5.1 Chip On Film Underfill (COF) Market: Region Footprint
    • 3.5.2 Chip On Film Underfill (COF) Market: Company Product Type Footprint
    • 3.5.3 Chip On Film Underfill (COF) Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Chip On Film Underfill (COF) Market Size by Region
    • 4.1.1 Global Chip On Film Underfill (COF) Sales Quantity by Region (2019-2030)
    • 4.1.2 Global Chip On Film Underfill (COF) Consumption Value by Region (2019-2030)
    • 4.1.3 Global Chip On Film Underfill (COF) Average Price by Region (2019-2030)
  • 4.2 North America Chip On Film Underfill (COF) Consumption Value (2019-2030)
  • 4.3 Europe Chip On Film Underfill (COF) Consumption Value (2019-2030)
  • 4.4 Asia-Pacific Chip On Film Underfill (COF) Consumption Value (2019-2030)
  • 4.5 South America Chip On Film Underfill (COF) Consumption Value (2019-2030)
  • 4.6 Middle East & Africa Chip On Film Underfill (COF) Consumption Value (2019-2030)

5 Market Segment by Type

  • 5.1 Global Chip On Film Underfill (COF) Sales Quantity by Type (2019-2030)
  • 5.2 Global Chip On Film Underfill (COF) Consumption Value by Type (2019-2030)
  • 5.3 Global Chip On Film Underfill (COF) Average Price by Type (2019-2030)

6 Market Segment by Application

  • 6.1 Global Chip On Film Underfill (COF) Sales Quantity by Application (2019-2030)
  • 6.2 Global Chip On Film Underfill (COF) Consumption Value by Application (2019-2030)
  • 6.3 Global Chip On Film Underfill (COF) Average Price by Application (2019-2030)

7 North America

  • 7.1 North America Chip On Film Underfill (COF) Sales Quantity by Type (2019-2030)
  • 7.2 North America Chip On Film Underfill (COF) Sales Quantity by Application (2019-2030)
  • 7.3 North America Chip On Film Underfill (COF) Market Size by Country
    • 7.3.1 North America Chip On Film Underfill (COF) Sales Quantity by Country (2019-2030)
    • 7.3.2 North America Chip On Film Underfill (COF) Consumption Value by Country (2019-2030)
    • 7.3.3 United States Market Size and Forecast (2019-2030)
    • 7.3.4 Canada Market Size and Forecast (2019-2030)
    • 7.3.5 Mexico Market Size and Forecast (2019-2030)

8 Europe

  • 8.1 Europe Chip On Film Underfill (COF) Sales Quantity by Type (2019-2030)
  • 8.2 Europe Chip On Film Underfill (COF) Sales Quantity by Application (2019-2030)
  • 8.3 Europe Chip On Film Underfill (COF) Market Size by Country
    • 8.3.1 Europe Chip On Film Underfill (COF) Sales Quantity by Country (2019-2030)
    • 8.3.2 Europe Chip On Film Underfill (COF) Consumption Value by Country (2019-2030)
    • 8.3.3 Germany Market Size and Forecast (2019-2030)
    • 8.3.4 France Market Size and Forecast (2019-2030)
    • 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
    • 8.3.6 Russia Market Size and Forecast (2019-2030)
    • 8.3.7 Italy Market Size and Forecast (2019-2030)

9 Asia-Pacific

  • 9.1 Asia-Pacific Chip On Film Underfill (COF) Sales Quantity by Type (2019-2030)
  • 9.2 Asia-Pacific Chip On Film Underfill (COF) Sales Quantity by Application (2019-2030)
  • 9.3 Asia-Pacific Chip On Film Underfill (COF) Market Size by Region
    • 9.3.1 Asia-Pacific Chip On Film Underfill (COF) Sales Quantity by Region (2019-2030)
    • 9.3.2 Asia-Pacific Chip On Film Underfill (COF) Consumption Value by Region (2019-2030)
    • 9.3.3 China Market Size and Forecast (2019-2030)
    • 9.3.4 Japan Market Size and Forecast (2019-2030)
    • 9.3.5 South Korea Market Size and Forecast (2019-2030)
    • 9.3.6 India Market Size and Forecast (2019-2030)
    • 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
    • 9.3.8 Australia Market Size and Forecast (2019-2030)

10 South America

  • 10.1 South America Chip On Film Underfill (COF) Sales Quantity by Type (2019-2030)
  • 10.2 South America Chip On Film Underfill (COF) Sales Quantity by Application (2019-2030)
  • 10.3 South America Chip On Film Underfill (COF) Market Size by Country
    • 10.3.1 South America Chip On Film Underfill (COF) Sales Quantity by Country (2019-2030)
    • 10.3.2 South America Chip On Film Underfill (COF) Consumption Value by Country (2019-2030)
    • 10.3.3 Brazil Market Size and Forecast (2019-2030)
    • 10.3.4 Argentina Market Size and Forecast (2019-2030)

11 Middle East & Africa

  • 11.1 Middle East & Africa Chip On Film Underfill (COF) Sales Quantity by Type (2019-2030)
  • 11.2 Middle East & Africa Chip On Film Underfill (COF) Sales Quantity by Application (2019-2030)
  • 11.3 Middle East & Africa Chip On Film Underfill (COF) Market Size by Country
    • 11.3.1 Middle East & Africa Chip On Film Underfill (COF) Sales Quantity by Country (2019-2030)
    • 11.3.2 Middle East & Africa Chip On Film Underfill (COF) Consumption Value by Country (2019-2030)
    • 11.3.3 Turkey Market Size and Forecast (2019-2030)
    • 11.3.4 Egypt Market Size and Forecast (2019-2030)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
    • 11.3.6 South Africa Market Size and Forecast (2019-2030)

12 Market Dynamics

  • 12.1 Chip On Film Underfill (COF) Market Drivers
  • 12.2 Chip On Film Underfill (COF) Market Restraints
  • 12.3 Chip On Film Underfill (COF) Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Chip On Film Underfill (COF) and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Chip On Film Underfill (COF)
  • 13.3 Chip On Film Underfill (COF) Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Chip On Film Underfill (COF) Typical Distributors
  • 14.3 Chip On Film Underfill (COF) Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Chip On Film Underfill (COF). Industry analysis & Market Report on Chip On Film Underfill (COF) is a syndicated market report, published as Global Chip On Film Underfill (COF) Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030. It is complete Research Study and Industry Analysis of Chip On Film Underfill (COF) market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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