Report Detail
Global BGA Packaging Solder Ball Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
- RnM4586322 |
- 09 April, 2024 |
- Global |
- 116 Pages |
- GIR (Global Info Research) |
- Electronics & Semiconductor
According to our (Global Info Research) latest study, the global BGA Packaging Solder Ball market size was valued at USD 158.8 million in 2023 and is forecast to a readjusted size of USD 236.9 million by 2030 with a CAGR of 5.9% during review period.
BGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial role in connecting the integrated circuit to the printed circuit board (PCB).
Market Drivers: Miniaturization of Electronic Devices: The trend toward smaller and more compact electronic devices, such as smartphones, tablets, and wearables, drives the demand for BGA packaging with solder balls. BGA offers a high pin count in a smaller footprint, making it suitable for miniaturized electronics.
Increasing Demand for High-Performance Computing: Growing demand for high-performance computing, data centers, and graphics processing units (GPUs) fuels the adoption of advanced packaging solutions like BGA. Solder balls contribute to the reliability and thermal performance of these high-power components.
Advancements in Semiconductor Technology: Ongoing advancements in semiconductor manufacturing technologies, including finer pitch and higher pin counts, necessitate the development of solder balls with improved materials and manufacturing processes to meet the requirements of next-generation electronic devices.
Rise in Internet of Things (IoT) Devices: The proliferation of IoT devices, which require compact and efficient packaging solutions, boosts the demand for BGA packaging with solder balls. BGA technology supports the integration of sensors and processors in small form factors.
Consumer Electronics Industry Growth: The consumer electronics industry's continual growth, driven by innovations in smartphones, laptops, gaming consoles, and other electronic gadgets, contributes significantly to the demand for BGA packaging solder balls.
Market Restrictions: Cost and Complexity of Manufacturing: The manufacturing processes involved in producing BGA packaging with solder balls can be complex and may require advanced equipment. The associated costs, including material and manufacturing expenses, could be a limitation for some manufacturers or applications.
Stringent Quality and Compliance Standards: Industries such as aerospace and automotive have stringent quality and compliance standards. Meeting these standards, including requirements for high-reliability solder joints, can be challenging and may act as a restriction for certain applications.
The Global Info Research report includes an overview of the development of the BGA Packaging Solder Ball industry chain, the market status of IDM (Up to 0.2 mm, 0.2-0.5 mm), OSAT (Up to 0.2 mm, 0.2-0.5 mm), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of BGA Packaging Solder Ball.
Regionally, the report analyzes the BGA Packaging Solder Ball markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global BGA Packaging Solder Ball market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the BGA Packaging Solder Ball market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the BGA Packaging Solder Ball industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (Million Units), revenue generated, and market share of different by Diameter (e.g., Up to 0.2 mm, 0.2-0.5 mm).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the BGA Packaging Solder Ball market.
Regional Analysis: The report involves examining the BGA Packaging Solder Ball market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the BGA Packaging Solder Ball market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to BGA Packaging Solder Ball:
Company Analysis: Report covers individual BGA Packaging Solder Ball manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards BGA Packaging Solder Ball This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (IDM, OSAT).
Technology Analysis: Report covers specific technologies relevant to BGA Packaging Solder Ball. It assesses the current state, advancements, and potential future developments in BGA Packaging Solder Ball areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the BGA Packaging Solder Ball market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
BGA Packaging Solder Ball market is split by Diameter and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Diameter, and by Application in terms of volume and value.
Market segment by Diameter
Up to 0.2 mm
0.2-0.5 mm
Above 0.5 mm
Market segment by Application
IDM
OSAT
Major players covered
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe BGA Packaging Solder Ball product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of BGA Packaging Solder Ball, with price, sales, revenue and global market share of BGA Packaging Solder Ball from 2019 to 2024.
Chapter 3, the BGA Packaging Solder Ball competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the BGA Packaging Solder Ball breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Diameter and application, with sales market share and growth rate by diameter, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and BGA Packaging Solder Ball market forecast, by regions, diameter and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of BGA Packaging Solder Ball.
Chapter 14 and 15, to describe BGA Packaging Solder Ball sales channel, distributors, customers, research findings and conclusion.
1 Market Overview
- 1.1 Product Overview and Scope of BGA Packaging Solder Ball
- 1.2 Market Estimation Caveats and Base Year
- 1.3 Market Analysis by Diameter
- 1.3.1 Overview: Global BGA Packaging Solder Ball Consumption Value by Diameter: 2019 Versus 2023 Versus 2030
- 1.3.2 Up to 0.2 mm
- 1.3.3 0.2-0.5 mm
- 1.3.4 Above 0.5 mm
- 1.4 Market Analysis by Application
- 1.4.1 Overview: Global BGA Packaging Solder Ball Consumption Value by Application: 2019 Versus 2023 Versus 2030
- 1.4.2 IDM
- 1.4.3 OSAT
- 1.5 Global BGA Packaging Solder Ball Market Size & Forecast
- 1.5.1 Global BGA Packaging Solder Ball Consumption Value (2019 & 2023 & 2030)
- 1.5.2 Global BGA Packaging Solder Ball Sales Quantity (2019-2030)
- 1.5.3 Global BGA Packaging Solder Ball Average Price (2019-2030)
2 Manufacturers Profiles
- 2.1 Senju Metal
- 2.1.1 Senju Metal Details
- 2.1.2 Senju Metal Major Business
- 2.1.3 Senju Metal BGA Packaging Solder Ball Product and Services
- 2.1.4 Senju Metal BGA Packaging Solder Ball Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.1.5 Senju Metal Recent Developments/Updates
- 2.2 Accurus
- 2.2.1 Accurus Details
- 2.2.2 Accurus Major Business
- 2.2.3 Accurus BGA Packaging Solder Ball Product and Services
- 2.2.4 Accurus BGA Packaging Solder Ball Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.2.5 Accurus Recent Developments/Updates
- 2.3 DS HiMetal
- 2.3.1 DS HiMetal Details
- 2.3.2 DS HiMetal Major Business
- 2.3.3 DS HiMetal BGA Packaging Solder Ball Product and Services
- 2.3.4 DS HiMetal BGA Packaging Solder Ball Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.3.5 DS HiMetal Recent Developments/Updates
- 2.4 NMC
- 2.4.1 NMC Details
- 2.4.2 NMC Major Business
- 2.4.3 NMC BGA Packaging Solder Ball Product and Services
- 2.4.4 NMC BGA Packaging Solder Ball Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.4.5 NMC Recent Developments/Updates
- 2.5 MKE
- 2.5.1 MKE Details
- 2.5.2 MKE Major Business
- 2.5.3 MKE BGA Packaging Solder Ball Product and Services
- 2.5.4 MKE BGA Packaging Solder Ball Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.5.5 MKE Recent Developments/Updates
- 2.6 PMTC
- 2.6.1 PMTC Details
- 2.6.2 PMTC Major Business
- 2.6.3 PMTC BGA Packaging Solder Ball Product and Services
- 2.6.4 PMTC BGA Packaging Solder Ball Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.6.5 PMTC Recent Developments/Updates
- 2.7 Indium Corporation
- 2.7.1 Indium Corporation Details
- 2.7.2 Indium Corporation Major Business
- 2.7.3 Indium Corporation BGA Packaging Solder Ball Product and Services
- 2.7.4 Indium Corporation BGA Packaging Solder Ball Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.7.5 Indium Corporation Recent Developments/Updates
- 2.8 YCTC
- 2.8.1 YCTC Details
- 2.8.2 YCTC Major Business
- 2.8.3 YCTC BGA Packaging Solder Ball Product and Services
- 2.8.4 YCTC BGA Packaging Solder Ball Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.8.5 YCTC Recent Developments/Updates
- 2.9 Shenmao Technology
- 2.9.1 Shenmao Technology Details
- 2.9.2 Shenmao Technology Major Business
- 2.9.3 Shenmao Technology BGA Packaging Solder Ball Product and Services
- 2.9.4 Shenmao Technology BGA Packaging Solder Ball Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.9.5 Shenmao Technology Recent Developments/Updates
- 2.10 Shanghai hiking solder material
- 2.10.1 Shanghai hiking solder material Details
- 2.10.2 Shanghai hiking solder material Major Business
- 2.10.3 Shanghai hiking solder material BGA Packaging Solder Ball Product and Services
- 2.10.4 Shanghai hiking solder material BGA Packaging Solder Ball Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
- 2.10.5 Shanghai hiking solder material Recent Developments/Updates
3 Competitive Environment: BGA Packaging Solder Ball by Manufacturer
- 3.1 Global BGA Packaging Solder Ball Sales Quantity by Manufacturer (2019-2024)
- 3.2 Global BGA Packaging Solder Ball Revenue by Manufacturer (2019-2024)
- 3.3 Global BGA Packaging Solder Ball Average Price by Manufacturer (2019-2024)
- 3.4 Market Share Analysis (2023)
- 3.4.1 Producer Shipments of BGA Packaging Solder Ball by Manufacturer Revenue ($MM) and Market Share (%): 2023
- 3.4.2 Top 3 BGA Packaging Solder Ball Manufacturer Market Share in 2023
- 3.4.2 Top 6 BGA Packaging Solder Ball Manufacturer Market Share in 2023
- 3.5 BGA Packaging Solder Ball Market: Overall Company Footprint Analysis
- 3.5.1 BGA Packaging Solder Ball Market: Region Footprint
- 3.5.2 BGA Packaging Solder Ball Market: Company Product Type Footprint
- 3.5.3 BGA Packaging Solder Ball Market: Company Product Application Footprint
- 3.6 New Market Entrants and Barriers to Market Entry
- 3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
- 4.1 Global BGA Packaging Solder Ball Market Size by Region
- 4.1.1 Global BGA Packaging Solder Ball Sales Quantity by Region (2019-2030)
- 4.1.2 Global BGA Packaging Solder Ball Consumption Value by Region (2019-2030)
- 4.1.3 Global BGA Packaging Solder Ball Average Price by Region (2019-2030)
- 4.2 North America BGA Packaging Solder Ball Consumption Value (2019-2030)
- 4.3 Europe BGA Packaging Solder Ball Consumption Value (2019-2030)
- 4.4 Asia-Pacific BGA Packaging Solder Ball Consumption Value (2019-2030)
- 4.5 South America BGA Packaging Solder Ball Consumption Value (2019-2030)
- 4.6 Middle East and Africa BGA Packaging Solder Ball Consumption Value (2019-2030)
5 Market Segment by Diameter
- 5.1 Global BGA Packaging Solder Ball Sales Quantity by Diameter (2019-2030)
- 5.2 Global BGA Packaging Solder Ball Consumption Value by Diameter (2019-2030)
- 5.3 Global BGA Packaging Solder Ball Average Price by Diameter (2019-2030)
6 Market Segment by Application
- 6.1 Global BGA Packaging Solder Ball Sales Quantity by Application (2019-2030)
- 6.2 Global BGA Packaging Solder Ball Consumption Value by Application (2019-2030)
- 6.3 Global BGA Packaging Solder Ball Average Price by Application (2019-2030)
7 North America
- 7.1 North America BGA Packaging Solder Ball Sales Quantity by Diameter (2019-2030)
- 7.2 North America BGA Packaging Solder Ball Sales Quantity by Application (2019-2030)
- 7.3 North America BGA Packaging Solder Ball Market Size by Country
- 7.3.1 North America BGA Packaging Solder Ball Sales Quantity by Country (2019-2030)
- 7.3.2 North America BGA Packaging Solder Ball Consumption Value by Country (2019-2030)
- 7.3.3 United States Market Size and Forecast (2019-2030)
- 7.3.4 Canada Market Size and Forecast (2019-2030)
- 7.3.5 Mexico Market Size and Forecast (2019-2030)
8 Europe
- 8.1 Europe BGA Packaging Solder Ball Sales Quantity by Diameter (2019-2030)
- 8.2 Europe BGA Packaging Solder Ball Sales Quantity by Application (2019-2030)
- 8.3 Europe BGA Packaging Solder Ball Market Size by Country
- 8.3.1 Europe BGA Packaging Solder Ball Sales Quantity by Country (2019-2030)
- 8.3.2 Europe BGA Packaging Solder Ball Consumption Value by Country (2019-2030)
- 8.3.3 Germany Market Size and Forecast (2019-2030)
- 8.3.4 France Market Size and Forecast (2019-2030)
- 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
- 8.3.6 Russia Market Size and Forecast (2019-2030)
- 8.3.7 Italy Market Size and Forecast (2019-2030)
9 Asia-Pacific
- 9.1 Asia-Pacific BGA Packaging Solder Ball Sales Quantity by Diameter (2019-2030)
- 9.2 Asia-Pacific BGA Packaging Solder Ball Sales Quantity by Application (2019-2030)
- 9.3 Asia-Pacific BGA Packaging Solder Ball Market Size by Region
- 9.3.1 Asia-Pacific BGA Packaging Solder Ball Sales Quantity by Region (2019-2030)
- 9.3.2 Asia-Pacific BGA Packaging Solder Ball Consumption Value by Region (2019-2030)
- 9.3.3 China Market Size and Forecast (2019-2030)
- 9.3.4 Japan Market Size and Forecast (2019-2030)
- 9.3.5 Korea Market Size and Forecast (2019-2030)
- 9.3.6 India Market Size and Forecast (2019-2030)
- 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
- 9.3.8 Australia Market Size and Forecast (2019-2030)
10 South America
- 10.1 South America BGA Packaging Solder Ball Sales Quantity by Diameter (2019-2030)
- 10.2 South America BGA Packaging Solder Ball Sales Quantity by Application (2019-2030)
- 10.3 South America BGA Packaging Solder Ball Market Size by Country
- 10.3.1 South America BGA Packaging Solder Ball Sales Quantity by Country (2019-2030)
- 10.3.2 South America BGA Packaging Solder Ball Consumption Value by Country (2019-2030)
- 10.3.3 Brazil Market Size and Forecast (2019-2030)
- 10.3.4 Argentina Market Size and Forecast (2019-2030)
11 Middle East & Africa
- 11.1 Middle East & Africa BGA Packaging Solder Ball Sales Quantity by Diameter (2019-2030)
- 11.2 Middle East & Africa BGA Packaging Solder Ball Sales Quantity by Application (2019-2030)
- 11.3 Middle East & Africa BGA Packaging Solder Ball Market Size by Country
- 11.3.1 Middle East & Africa BGA Packaging Solder Ball Sales Quantity by Country (2019-2030)
- 11.3.2 Middle East & Africa BGA Packaging Solder Ball Consumption Value by Country (2019-2030)
- 11.3.3 Turkey Market Size and Forecast (2019-2030)
- 11.3.4 Egypt Market Size and Forecast (2019-2030)
- 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
- 11.3.6 South Africa Market Size and Forecast (2019-2030)
12 Market Dynamics
- 12.1 BGA Packaging Solder Ball Market Drivers
- 12.2 BGA Packaging Solder Ball Market Restraints
- 12.3 BGA Packaging Solder Ball Trends Analysis
- 12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry
13 Raw Material and Industry Chain
- 13.1 Raw Material of BGA Packaging Solder Ball and Key Manufacturers
- 13.2 Manufacturing Costs Percentage of BGA Packaging Solder Ball
- 13.3 BGA Packaging Solder Ball Production Process
- 13.4 BGA Packaging Solder Ball Industrial Chain
14 Shipments by Distribution Channel
- 14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
- 14.2 BGA Packaging Solder Ball Typical Distributors
- 14.3 BGA Packaging Solder Ball Typical Customers
15 Research Findings and Conclusion
16 Appendix
- 16.1 Methodology
- 16.2 Research Process and Data Source
Summary:
Get latest Market Research Reports on BGA Packaging Solder Ball. Industry analysis & Market Report on BGA Packaging Solder Ball is a syndicated market report, published as Global BGA Packaging Solder Ball Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030. It is complete Research Study and Industry Analysis of BGA Packaging Solder Ball market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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