Description
Scope of the Report:
The worldwide market for Ball Grid Array (BGA) Packages is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2024, from xx million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Ball Grid Array (BGA) Packages in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
Amkor Technology
Intel
STATS ChipPAC Ltd.
TriQuint Semiconductor Inc.
PARPRO
Jiangsu Changjiang Electronics Technology Co.
Integrated Circuit Engineering Corporation
Advanced Semiconductor Engineering, Inc.
ASE Group
Corintech Ltd
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Molded Array Process BGA
Thermally Enhanced BGA
Package on Package (PoP) BGA
Micro BGA
Market Segment by Applications, can be divided into
OEM
Aftermarket
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Ball Grid Array (BGA) Packages product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Ball Grid Array (BGA) Packages, with price, sales, revenue and global market share of Ball Grid Array (BGA) Packages in 2017 and 2018.
Chapter 3, the Ball Grid Array (BGA) Packages competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Ball Grid Array (BGA) Packages breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Ball Grid Array (BGA) Packages market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Ball Grid Array (BGA) Packages sales channel, distributors, customers, research findings and conclusion, appendix and data source.
Summary:
Get latest Market Research Reports on Ball Grid Array (BGA) Packages. Industry analysis & Market Report on Ball Grid Array (BGA) Packages is a syndicated market report, published as Global Ball Grid Array (BGA) Packages Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024. It is complete Research Study and Industry Analysis of Ball Grid Array (BGA) Packages market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.