BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.
At present, the Back Grinding Tapes industry is generally at a more advanced level in Japan, the world's large enterprises are mainly concentrated in Japan. Meanwhile, Japan companies have more advanced equipment, strong R & D capability, the technical level is in a leading position.
There are major two classification of Back Grinding Tapes in this report, UV Type BGT, Non-UV Type BGT. Globally, the production value share of each type of Back Grinding Tapes is 40.46% and 59.54% in 2017.
According to this study, over the next five years the Back Grinding Tapes market will register a 4.9% CAGR in terms of revenue, the global market size will reach US$ 230 million by 2024, from US$ 170 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Back Grinding Tapes business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Back Grinding Tapes market by product type, application, key manufacturers and key regions and countries.
This study considers the Back Grinding Tapes value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
UV Type
Non-UV Type
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Standard
Standard Thin Die
(S)DBG(GAL)
Bump
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
...
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Back Grinding Tapes consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Back Grinding Tapes market by identifying its various subsegments.
Focuses on the key global Back Grinding Tapes manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Back Grinding Tapes with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Back Grinding Tapes submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Summary:
Get latest Market Research Reports on Back Grinding Tapes . Industry analysis & Market Report on Back Grinding Tapes is a syndicated market report, published as Global Back Grinding Tapes Market Growth 2019-2024. It is complete Research Study and Industry Analysis of Back Grinding Tapes market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.